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M27C512-45XF1

STMicroelectronics

M27C512-45XF1 by STMicroelectronics

M27C512-45XF1 by STMicroelectronics is a 64K x 8-bit UVPROM with a max access time of 45 ns. It operates asynchronously at a nominal voltage of 5V and features a ceramic, glass-sealed package. Ideal for applications requiring reliable data storage in commercial environments.

Median Price

$15.930

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 4 parts In-Stock

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Digiode

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Vyrian

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Anansix

USA . 981 parts In-Stock

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Zilex Electronics Inc.

Canada . 40 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 19 parts In-Stock

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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IDEA Electronic Components Group

UK . 1,391 parts In-Stock

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$3.404

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$3.064

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MKK Technologies

India . 1,685 parts In-Stock

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$6.401

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DigiPath Technology Company

USA . 1,685 parts In-Stock

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AZTECH Wire

Italy . 937 parts In-Stock

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$9.980

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Microchip USA

USA . 191 parts In-Stock

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$41.283

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A-Z Elektronik GmbH

Germany . 6,620 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,413 parts In-Stock

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GreenTree Electronics

Israel . 1,560 parts In-Stock

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Corphita

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Parana Technologies

USA . 788 parts In-Stock

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Kepictronics

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Overview

Unlock your project's potential with the M27C512-45XF1 EPROM from STMicroelectronics, a leader in innovation and quality. This reliable memory solution ensures optimal performance in various applications, from consumer electronics to automotive systems. With its robust ceramic casing and asynchronous operation, it offers exceptional durability and efficiency. Choose the M27C512-45XF1 for superior data retention, and empower your designs with unmatched reliability and value.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material ensures durability and longevity, protecting the chip from environmental factors, making it suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape is space-efficient, facilitating easier placement on PCBs and optimized layout design.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for immediate data access without the need for a clock signal, enhancing system responsiveness.

Input/Output Type: COMMON

A common I/O type simplifies interfacing with other digital components, reducing complexity in circuit design.

Nominal Supply Voltage / Vsup: 5V

The standard supply voltage makes it compatible with a wide range of electronic systems, ensuring versatility in applications.

Power Supplies (V): 5V

Operating at 5V helps in minimizing power consumption while ensuring reliable performance across various devices.

No. of Terminals: 28

With 28 terminals, this chip provides ample connectivity options, enabling integration into complex systems.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window design allows for easy access to the memory chip for programming and monitoring, simplifying usage.

Maximum Operating Temperature: 70 °C

A higher operating temperature threshold increases reliability in warmer environments, ideal for industrial applications.

Organization: 64KX8

This organization allows for efficient data management with a capacity to store 64K words, providing sufficient memory for many applications.

Output Characteristics: 3-STATE

3-state outputs facilitate multi-device interfacing on a single bus, reducing signal conflicts and improving overall design flexibility.

Minimum Operating Temperature: 0 °C

The low temperature operating range expands usability in colder environments, further increasing versatility.

Terminal Position: DUAL

The dual terminal position improves ease of soldering and mounting, enhancing the reliability of the connection.

Maximum Seated Height: 5.72 mm

Compact height allows for space-saving designs, making it suitable for high-density applications.

Width: 15.24 mm

A standardized width allows for compatibility with numerous PCB designs, enhancing integration into existing systems.

Minimum Supply Voltage (Vsup): 4.75V

This low minimum supply voltage ensures the chip operates efficiently even in lower power environments.

Length: 36.92 mm

The manageable length simplifies placement on PCBs while allowing for optimal routing of traces and tracks.

Temperature Grade: COMMERCIAL

Commercial temperature grading assures adequate performance for everyday applications, making it a robust choice for general use.

Technology: CMOS

CMOS technology offers reduced power consumption, high density, and improved noise margins, making it efficient and reliable.

Parallel or Serial: PARALLEL

Parallel access allows for faster data transactions, making this chip suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals simplify soldering and mechanical stability, making it easy to work with in prototyping and production.

Maximum Supply Current: 30 mA

A low maximum supply current ensures efficient power usage, making it suitable for battery-operated devices.

No. of Words: 65536 words

The capacity to handle 65536 words makes this chip capable of supporting complex data storage needs.

Memory Width: 8

With an 8-bit wide memory, it easily integrates with standard microcontrollers and data buses, enhancing compatibility.

Terminal Pitch: 2.54 mm

The standard pitch allows for easy integration into existing PCB layouts and compatibility with common sockets.

No. of Words Code: 64K

Having 64K words of storage meets the requirements of many typical applications, striking a balance between size and capacity.

Maximum Supply Voltage (Vsup): 5.5V

The upper limit on supply voltage provides a buffer for voltage fluctuations, ensuring stable operation.

Memory Density: 524288 bit

The high memory density allows for substantial data storage capabilities, making the product suitable for various applications.

Memory IC Type: UVPROM

Being UV-erasable offers flexibility in programming, making it ideal for development environments where memory rewriting is frequent.

Maximum Standby Current: 0.0001 Amp

The very low standby current significantly reduces power consumption, enhancing energy efficiency especially in idle states.

Maximum Access Time: 45 ns

A fast access time of 45 ns improves overall system performance, making it suitable for high-speed applications.

Technical Specifications

EPROM M27C512-45XF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Length:

36.92 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

M27C512-45XF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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