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M27C4002-80XF1

STMicroelectronics

M27C4002-80XF1 by STMicroelectronics

M27C4002-80XF1 EPROM by STMicroelectronics features 256KX16 organization, 80 ns access time, and 5V nominal voltage. Ideal for commercial applications requiring reliable non-volatile memory with a memory density of 4Mbit and parallel interface.

Median Price

$6.595

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$6.595

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100

$6.595

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Digiode

USA . 4,750 parts In-Stock

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Vyrian

USA . 4,187 parts In-Stock

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Chip Stock

USA . 824 parts In-Stock

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Anansix

USA . 623 parts In-Stock

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623

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ACDS - Activité Composants Distribution Service

France . 218 parts In-Stock

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Bristol Electronics

USA . 218 parts In-Stock

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Dan-Mar Components

USA . 218 parts In-Stock

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Semtec, LLC

USA . 22 parts In-Stock

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Rebound Electronics

UK . 18 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 14 parts In-Stock

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14

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MRC Electronics

USA . 9 parts In-Stock

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ABC Electronics Ltd.

UK . 4 parts In-Stock

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Halfin

Belgium . 3 parts In-Stock

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3

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,842 parts In-Stock

1+ parts

$2.270

100+ parts

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1,842

$2.270

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Corohmni

South Africa . 711 parts In-Stock

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$2.385

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711

$2.385

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IDEA Electronic Components Group

UK . 2,008 parts In-Stock

1+ parts

$4.318

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$3.886

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2,008

$4.318

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$3.886

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Semicontronic

India . 1,328 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

1k+ parts

$5.820

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1,328

$6.000

$5.850

$5.820

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Continental Prestige Electronics

USA . 1,283 parts In-Stock

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$6.595

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$6.463

1,283

$6.595

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$6.463

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

$6.595

100+ parts

$6.265

1k+ parts

$5.952

10k+ parts

$5.870

200

$6.595

$6.265

$5.952

$5.870

MKK Technologies

India . 1,323 parts In-Stock

1+ parts

$8.119

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1,323

$8.119

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DigiPath Technology Company

USA . 1,323 parts In-Stock

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$8.119

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$8.119

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AZTECH Wire

Italy . 858 parts In-Stock

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$8.592

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858

$8.592

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Ampacity Inc.

Singapore . 423 parts In-Stock

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$30.000

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423

$30.000

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QUARKTWIN TECHNOLOGY LTD

USA . 8,519 parts In-Stock

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Microchip USA

USA . 5,215 parts In-Stock

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Corphita

USA . 3,511 parts In-Stock

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Argo Parts USA

USA . 2,451 parts In-Stock

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Kepictronics

USA . 2,200 parts In-Stock

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Metaverse IC Inc.

Canada . 1,932 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,560 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,040 parts In-Stock

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Parana Technologies

USA . 544 parts In-Stock

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$5.162

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544

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Authorized Procurement Solutions

USA . 21 parts In-Stock

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Perfect Parts

USA . 11 parts In-Stock

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A-Plus Industry Inc.

USA . 6 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Unlock a world of possibilities with the M27C4002-80XF1 EPROM by STMicroelectronics. Crafted with precision and reliability, this product offers unmatched quality and performance. Perfect for a wide range of applications, this EPROM provides customers with value, benefits, and advantages that exceed expectations. Trust in STMicroelectronics to deliver top-notch products that cater to your needs, making your projects soar to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent protection against environmental factors, ensuring the product's durability and reliability.

Operating Mode: ASYNCHRONOUS

Allows for independent access to each memory location, resulting in efficient and flexible data retrieval.

Memory Density: 4194304 bit

High memory density allows for storing a large amount of data in a compact space, making it suitable for applications with high storage requirements.

Maximum Access Time: 80 ns

Fast access time ensures quick retrieval of data, enhancing the overall performance of the product.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

EPROM M27C4002-80XF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T40

JESD-609 Code:

e3

Length:

52.195 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

256KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

70 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C4002-80XF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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