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CY15B104Q-LHXIT

Infineon Technologies

CY15B104Q-LHXIT by Infineon Technologies

CY15B104Q-LHXIT by Infineon Technologies is a FRAM with 512KX8 organization and 524288 words. It operates at a max clock frequency of 40 MHz and has a memory density of 4194304 bit. It is commonly used in applications requiring high endurance and low power consumption.

Median Price

$23.120

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 450 parts In-Stock

1+ parts

$23.120

100+ parts

$19.980

1k+ parts

$19.540

10k+ parts

-

450

$23.120

$19.980

$19.540

-

DigiKey

USA . 4,241 parts In-Stock

1+ parts

$32.320

100+ parts

$27.543

1k+ parts

$26.626

10k+ parts

$24.435

4,241

$32.320

$27.543

$26.626

$24.435

Mouser Electronics

USA . 839 parts In-Stock

1+ parts

$32.320

100+ parts

$27.550

1k+ parts

$26.310

10k+ parts

$24.430

839

$32.320

$27.550

$26.310

$24.430

Flip Electronics (Authorized)

USA . 15,936 parts In-Stock

1+ parts

-

100+ parts

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15,936

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Arrow

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

$21.040

12,500

-

-

-

$21.040

Verical

USA . 12,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$21.040

12,500

-

-

-

$21.040

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$21.510

100+ parts

-

1k+ parts

-

10k+ parts

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650

$21.510

-

-

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Digiode

USA . 446 parts In-Stock

1+ parts

$21.945

100+ parts

-

1k+ parts

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10k+ parts

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446

$21.945

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Flip Electronics

USA . 12,206 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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12,206

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Vyrian

USA . 3,342 parts In-Stock

1+ parts

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3,342

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IBS Electronics

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$27.980

2,500

-

-

-

$27.980

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,606 parts In-Stock

1+ parts

$19.640

100+ parts

$19.149

1k+ parts

$19.051

10k+ parts

-

3,606

$19.640

$19.149

$19.051

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Ampacity Inc.

Singapore . 3,549 parts In-Stock

1+ parts

$19.640

100+ parts

-

1k+ parts

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10k+ parts

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3,549

$19.640

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Corphita

USA . 924 parts In-Stock

1+ parts

$20.790

100+ parts

-

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10k+ parts

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924

$20.790

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Continental Prestige Electronics

USA . 4,910 parts In-Stock

1+ parts

$21.290

100+ parts

-

1k+ parts

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10k+ parts

$20.864

4,910

$21.290

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-

$20.864

Argo Parts USA

USA . 4,128 parts In-Stock

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4,128

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Perfect Parts

USA . 3,035 parts In-Stock

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3,035

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Futuretech Components

Singapore . 2,500 parts In-Stock

1+ parts

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100+ parts

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2,500

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Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

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100+ parts

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500

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Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

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50

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Overview

Discover the CY15B104Q-LHXIT by Infineon Technologies, a cutting-edge FRAM that combines superior quality with innovative technology. With its small outline and very thin profile package style, this product is perfect for space-constrained applications. Offering a wide operating temperature range and excellent data retention, it ensures reliable performance even in harsh environments. The CY15B104Q-LHXIT boasts a high endurance of 100 trillion write/erase cycles, providing exceptional durability and long-lasting functionality. Whether you need high-speed storage solutions or reliable nonvolatile memory, this FRAM delivers unparalleled value, benefits, and advantages to meet your specific needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY. This product is made of high-quality plastic and epoxy materials, ensuring durability and reliability.

Surface Mount:

YES. Being surface mountable, this product offers easy installation and efficient use of space on circuit boards.

No. of Functions:

1. With one function, this product simplifies integration and reduces complexity in electronic systems.

Package Shape:

RECTANGULAR. The rectangular package shape allows for easy handling and compatibility with various equipment designs.

Operating Mode:

SYNCHRONOUS. This product operates in synchronous mode, enabling precise timing and synchronization with other components.

Nominal Supply Voltage / Vsup (V):

3.3. The nominal supply voltage of 3.3V ensures stable and reliable power supply, contributing to optimal performance.

No. of Terminals:

8. With 8 terminals, this product offers versatile connectivity options and easy integration into different applications.

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE. The compact and thin profile of this package style allows for space-efficient installation and effective heat dissipation.

Maximum Operating Temperature:

85 °C. This product can operate efficiently at high temperatures, ensuring reliable performance in demanding environments.

Organization:

512KX8. The organization of 512Kx8 provides a large memory capacity, accommodating extensive data storage requirements.

Minimum Standby Voltage:

2 V. With a low standby voltage requirement of 2V, this product optimizes power consumption during idle periods, enhancing energy efficiency.

Minimum Operating Temperature:

40 °C. This product is designed to function reliably even in extremely low temperature conditions, making it suitable for various applications.

Terminal Finish:

PURE TIN. The terminal finish of pure tin offers excellent conductivity and corrosion resistance, ensuring long-lasting and reliable connections.

Terminal Position:

DUAL. The dual terminal position offers flexible installation options and support for different circuit board layouts.

Write Protection:

HARDWARE/SOFTWARE. The write protection feature can be controlled either through hardware or software mechanisms, enhancing data security and preventing accidental modifications.

Maximum Seated Height:

0.8 mm. The low seated height of only 0.8mm enables compatibility with compact and slim designs while ensuring efficient component placement.

Maximum Clock Frequency (fCLK):

40 MHz. With a maximum clock frequency of 40MHz, this product allows for fast and efficient data processing in high-performance applications.

Width:

5 mm. The compact width of 5mm provides flexibility in board design and space-constrained applications.

Minimum Supply Voltage (Vsup):

2 V. The minimum supply voltage requirement of 2V allows for flexibility in power source selection, accommodating a wide range of system requirements.

Peak Reflow Temperature °C:

260. This product can withstand high peak reflow temperatures of 260°C during manufacturing processes, ensuring robustness and reliability.

Length:

6 mm. The small length of 6mm contributes to compact overall system designs, especially in applications with limited space availability.

Technology:

CMOS. Incorporating CMOS technology, this product offers low power consumption, high performance, and compatibility with a wide range of devices.

Parallel or Serial:

SERIAL. The serial interface of this product simplifies data transfer and communication, making it ideal for applications that require serial connectivity.

Terminal Form:

NO LEAD. This terminal form eliminates the need for leads, enabling straightforward installation and compatibility with lead-free soldering processes.

Maximum Supply Current:

3 mA. With a maximum supply current of 3mA, this product ensures efficient power consumption, extending battery life and reducing energy costs.

No. of Words:

524288 words. The significant number of words (524,288) this product can store allows for extensive data storage capabilities, accommodating diverse application needs.

Memory Width:

8. With a memory width of 8 bits, this product provides efficient data processing and compatibility with various systems and protocols.

Minimum Data Retention Time:

10. The minimum data retention time of 10 years ensures long-term data integrity and reliability, making it suitable for applications with extended storage requirements.

Terminal Pitch:

1.27 mm. The compact terminal pitch of 1.27mm offers space-efficient integration and compatibility with standard PCB designs.

No. of Words Code:

512K. The code representing the significant number of words (512K) indicates the high memory capacity of this product, enabling storage of large amounts of data.

Moisture Sensitivity Level (MSL):

3. This product has a moisture sensitivity level of 3, ensuring resistance to moisture damage during assembly and handling processes.

Maximum Supply Voltage (Vsup):

3.6 V. With a maximum supply voltage of 3.6V, this product allows for flexible power input, accommodating diverse operating conditions.

Endurance:

100000000000000 Write/Erase Cycles. The exceptional endurance of 100 trillion write/erase cycles ensures longevity and reliability, making this product ideal for applications requiring frequent data updates.

Serial Bus Type:

SPI. The Serial Peripheral Interface (SPI) bus type simplifies data communication and control, enabling seamless integration with SPI-compatible devices.

Memory Density:

4194304 bit. With a memory density of 4,194,304 bits, this product offers substantial storage capacity, facilitating the handling of large amounts of data.

Memory IC Type:

FRAM. Utilizing FRAM (Ferroelectric Random-Access Memory) technology, this product combines the advantages of non-volatile storage and fast write speeds, making it ideal for applications requiring high-speed data logging.

Maximum Standby Current:

0.00025 Amp. With an extremely low standby current of 0.00025 Amp, this product minimizes power consumption during idle periods, enhancing energy efficiency.

Technical Specifications

FRAMs CY15B104Q-LHXIT attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00025 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104Q-LHXIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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