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FM16W08-SG

Infineon Technologies

FM16W08-SG by Infineon Technologies

FM16W08-SG by Infineon Technologies is an 8KX8 FRAM memory IC with 65536 bit memory density. It operates at a nominal voltage of 3.3V, offering fast access time of 80ns. Suitable for applications requiring high endurance, such as industrial automation and IoT devices due to its 100000000000000 Write/Erase Cycles capability.

Median Price

$4.820

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 101 parts In-Stock

1+ parts

$4.850

100+ parts

$4.520

1k+ parts

-

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101

$4.850

$4.520

-

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Flip Electronics (Authorized)

USA . 20,520 parts In-Stock

1+ parts

-

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20,520

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Arrow

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.789

10k+ parts

$4.712

116

-

-

$4.789

$4.712

Verical

USA . 116 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.893

10k+ parts

$4.790

116

-

-

$4.893

$4.790

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

5

-

$3.750

$3.360

$3.160

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 945 parts In-Stock

1+ parts

$3.743

100+ parts

-

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945

$3.743

-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$7.708

100+ parts

-

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-

10k+ parts

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450

$7.708

-

-

-

Schukat

Germany . 11 parts In-Stock

1+ parts

$8.351

100+ parts

$5.498

1k+ parts

-

10k+ parts

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11

$8.351

$5.498

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-

Flip Electronics

USA . 7,560 parts In-Stock

1+ parts

-

100+ parts

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7,560

-

-

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IBS Electronics

USA . 3,847 parts In-Stock

1+ parts

-

100+ parts

$5.236

1k+ parts

$5.012

10k+ parts

-

3,847

-

$5.236

$5.012

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Vyrian

USA . 3,430 parts In-Stock

1+ parts

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3,430

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ComSIT Distribution GmbH

Germany . 257 parts In-Stock

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257

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J2 Sourcing AB

Sweden . 194 parts In-Stock

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194

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Bristol Electronics

USA . 146 parts In-Stock

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146

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 890 parts In-Stock

1+ parts

$3.546

100+ parts

-

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890

$3.546

-

-

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Continental Prestige Electronics

USA . 6,481 parts In-Stock

1+ parts

$7.708

100+ parts

-

1k+ parts

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10k+ parts

$7.554

6,481

$7.708

-

-

$7.554

Netroflash

USA . 500 parts In-Stock

1+ parts

$7.708

100+ parts

-

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10k+ parts

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500

$7.708

-

-

-

Advanced Electronics

New Zealand . 4,931 parts In-Stock

1+ parts

$183.451

100+ parts

$166.940

1k+ parts

$150.430

10k+ parts

-

4,931

$183.451

$166.940

$150.430

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S.R.D Solutions

India . 171,000 parts In-Stock

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171,000

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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4,500

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QUARKTWIN TECHNOLOGY LTD

USA . 4,090 parts In-Stock

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4,090

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Metaverse IC Inc.

Canada . 1,800 parts In-Stock

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1,800

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Perfect Parts

USA . 1,637 parts In-Stock

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1,637

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Kepictronics

USA . 90 parts In-Stock

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90

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Glotronic Ltd.

UK . 80 parts In-Stock

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80

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Component Stockers USA

USA . 62 parts In-Stock

1+ parts

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100+ parts

$4.010

1k+ parts

$5.140

10k+ parts

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62

-

$4.010

$5.140

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Argo Parts USA

USA . 36 parts In-Stock

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36

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Overview

Discover the cutting-edge FM16W08-SG by Infineon Technologies, a top-tier FRAM memory device that guarantees exceptional quality and reliability. With Infineon's renowned expertise in semiconductor manufacturing, this product offers unparalleled performance and endurance for various applications. Unlock the benefits of faster access times, higher data retention, and lower power consumption with this innovative memory solution. Upgrade your projects with Infineon's FM16W08-SG and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FRAM, making it suitable for various environmental conditions.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a standard voltage, making it compatible with a wide range of systems.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for synchronization signals, providing flexibility in usage.

Memory Density: 65536 bit

Offers a high memory density, allowing for storage of large amounts of data in a compact form.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high temperatures during reflow processes for reliable assembly.

Endurance: 100000000000000 Write/Erase Cycles

Offers extremely high endurance, ensuring longevity and reliability for frequent read/write operations.

Technical Specifications

FRAMs FM16W08-SG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

80 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G28

Length:

17.905 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

2.67 mm

Maximum Standby Current:

.00005 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.505 mm

Trade Compliance

FM16W08-SG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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