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FM25L04B-GA

Infineon Technologies

FM25L04B-GA by Infineon Technologies

Infineon Technologies' FM25L04B-GA is a 512x8 FRAM with synchronous operation and a max clock frequency of 10 MHz. It has a small outline package style, making it suitable for applications requiring high endurance, such as automotive systems and industrial control.

Median Price

$3.901

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 10,894 parts In-Stock

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Verical

USA . 5,040 parts In-Stock

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$6.272

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Rochester

USA . 2,790 parts In-Stock

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$1.530

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$1.270

10k+ parts

$1.130

2,790

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$1.530

$1.270

$1.130

Distributors (In-Stock)

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Vyrian

USA . 10,798 parts In-Stock

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USA . 10,394 parts In-Stock

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DigiKey Marketplace

USA . 5,994 parts In-Stock

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$5.427

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Digiode

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Nova Conductors

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Semicontronic

India . 10,824 parts In-Stock

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$10.000

100+ parts

$9.750

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$9.700

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$10.000

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QUARKTWIN TECHNOLOGY LTD

USA . 13,704 parts In-Stock

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Component Stockers USA

USA . 8,298 parts In-Stock

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$5.330

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$5.330

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Kepictronics

USA . 5,000 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Argo Parts USA

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Perfect Parts

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Continental Prestige Electronics

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Glotronic Ltd.

UK . 616 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the FM25L04B-GA by Infineon Technologies, a high-quality FRAM that combines advanced technology with reliable performance. Designed for various applications, this product offers exceptional value and benefits to customers. With its durable plastic/epoxy package body material and AEC-Q100 screening level, it ensures long-lasting operation even in challenging environments. Its compact rectangular shape and small outline package style make it easy to integrate into any design. Whether you need hardware or software write protection, this FRAM has got you covered. Experience the advantages of its synchronous operating mode, wide temperature range, and impressive endurance of 10 trillion write/erase cycles. Unlock limitless possibilities with the FM25L04B-GA and stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection, making this product suitable for various environments and applications.

Surface Mount: YES

With the ability to be surface mounted, this product offers easy and flexible integration onto circuit boards, saving valuable space and simplifying the manufacturing process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that this product meets the stringent automotive industry standards, making it a reliable and high-quality choice for automotive applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient utilization of board space, making it compatible with a wide range of systems and applications.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enables precise and synchronized communication with other components, enhancing overall system performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

At a nominal supply voltage of 3.3V, this product offers efficient power consumption while maintaining reliable operation, making it suitable for low-power applications.

No. of Terminals: 8

With 8 terminals, this product provides sufficient connectivity options, allowing for easy integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compatibility with compact designs, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high-temperature environments, ensuring reliable performance even in demanding conditions.

Organization: 512X8

The organization of 512 words by 8 bits provides a sufficient memory capacity and data width, accommodating diverse data storage and retrieval requirements.

Minimum Standby Voltage: 3V

With a minimum standby voltage of 3V, this product minimizes power consumption during idle periods, contributing to overall energy efficiency.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance in extreme cold environments.

Terminal Position: DUAL

The dual terminal position offers flexibility and ease of connection, allowing for simplified integration into various circuit layouts.

Write Protection: HARDWARE/SOFTWARE

The availability of both hardware and software write protection options provides enhanced data security, ensuring that critical data remains protected from unauthorized access or modification.

Maximum Seated Height: 1.727 mm

With a maximum seated height of 1.727 mm, this product offers a compact profile, enabling integration into space-limited applications.

Maximum Clock Frequency (fCLK): 10 MHz

The maximum clock frequency of 10 MHz enables fast and efficient data transfer, supporting high-speed operations and reducing processing times.

Width: 3.8985 mm

With a width of 3.8985 mm, this product offers a compact form factor, allowing for utilization in tightly spaced designs.

Minimum Supply Voltage (Vsup): 3V

The minimum supply voltage requirement of 3V ensures compatibility with various power sources, making it suitable for a wide range of applications.

Length: 4.889 mm

The length of 4.889 mm ensures a compact footprint, making this product appropriate for designs with limited space availability.

Technology: CMOS

Utilizing CMOS technology, this product offers low power consumption, high noise immunity, and fast switching speeds, resulting in efficient and reliable operation.

Parallel or Serial: SERIAL

With a serial interface, this product allows for simplified data transfer and integration, reducing the complexity of the system design.

Terminal Form: GULL WING

The gull wing terminal form provides ease of soldering, ensuring secure and reliable connections during the manufacturing process.

Maximum Supply Current: 2 mA

With a maximum supply current of 2 mA, this product efficiently utilizes power resources, making it suitable for low-power applications.

No. of Words: 512 words

Offering a memory capacity of 512 words, this product enables ample storage for data, programs, or configurations, meeting the requirements of various applications.

Memory Width: 8

With a memory width of 8 bits, this product allows for efficient data handling, providing compatibility with systems that utilize 8-bit data paths.

Minimum Data Retention Time: 11

The minimum data retention time of 11 years ensures data integrity and reliability over an extended period, making it suitable for long-term applications.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this product offers compatibility with standard spacing on circuit boards, facilitating easy integration and reducing assembly complexities.

No. of Words Code: 512

The availability of 512 words code enables efficient addressing and management of data, enhancing overall system performance and flexibility.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product offers a wide voltage range for compatibility with various power sources, ensuring reliable operation in different environments.

Endurance: 10000000000000 Write/Erase Cycles

With an endurance of 10 trillion write/erase cycles, this product provides exceptional durability and reliability, ensuring long-lasting performance for extensive data read/write operations.

Serial Bus Type: SPI

Utilizing the Serial Peripheral Interface (SPI), this product offers a widely supported communication protocol, enabling easy integration with a variety of microcontrollers and other devices.

Memory Density: 4096 bit

With a memory density of 4096 bits, this product offers ample storage capacity, accommodating diverse data storage requirements.

Memory IC Type: FRAM

Being an FRAM (Ferroelectric Random-Access Memory) type, this product combines the benefits of non-volatility, high-speed operation, and endurance, making it a superior choice for a wide range of applications.

Maximum Standby Current: 0.00002 Amp

With a maximum standby current of 0.00002 Amps, this product offers low power consumption during idle periods, optimizing energy efficiency and battery life.

Technical Specifications

FRAMs FM25L04B-GA attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

10 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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