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CY15V108QI-20LPXI

Infineon Technologies

CY15V108QI-20LPXI by Infineon Technologies

Infineon CY15V108QI-20LPXI FRAM offers 1MX8 organization, 20MHz clock frequency, and 1000000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with SPI serial bus interface in a small outline package.

Median Price

$34.169

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 850 parts In-Stock

1+ parts

$23.260

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$23.260

-

-

-

Chip1Stop

Japan . 445 parts In-Stock

1+ parts

$37.400

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$37.400

-

-

-

Newark

USA . 105 parts In-Stock

1+ parts

$41.670

100+ parts

$36.640

1k+ parts

-

10k+ parts

-

105

$41.670

$36.640

-

-

Element14

Singapore . 794 parts In-Stock

1+ parts

$2,611.430

100+ parts

$2,425.270

1k+ parts

-

10k+ parts

-

794

$2,611.430

$2,425.270

-

-

Flip Electronics (Authorized)

USA . 2,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,940

-

-

-

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Rochester

USA . 1,414 parts In-Stock

1+ parts

-

100+ parts

$24.750

1k+ parts

$22.140

10k+ parts

$20.840

1,414

-

$24.750

$22.140

$20.840

Verical

USA . 761 parts In-Stock

1+ parts

-

100+ parts

$30.938

1k+ parts

$27.675

10k+ parts

$26.050

761

-

$30.938

$27.675

$26.050

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 681 parts In-Stock

1+ parts

$19.000

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$19.000

-

-

-

Nova Conductors

Japan . 21 parts In-Stock

1+ parts

$27.289

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$27.289

-

-

-

Flip Electronics

USA . 1,470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,470

-

-

-

-

Vyrian

USA . 675 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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675

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 586 parts In-Stock

1+ parts

$17.000

100+ parts

-

1k+ parts

-

10k+ parts

-

586

$17.000

-

-

-

Corphita

USA . 523 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$18.000

-

-

-

Continental Prestige Electronics

USA . 850 parts In-Stock

1+ parts

$23.260

100+ parts

-

1k+ parts

-

10k+ parts

-

850

$23.260

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$27.289

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$27.289

-

-

-

Component Stockers USA

USA . 2,536 parts In-Stock

1+ parts

$28.830

100+ parts

$21.620

1k+ parts

-

10k+ parts

-

2,536

$28.830

$21.620

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Overview

Unlock the power of data storage with the CY15V108QI-20LPXI from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality FRAMs that offer unparalleled reliability and performance. Ideal for a wide range of applications, this product provides customers with a seamless experience that ensures their data is safe and secure. With advanced features like write protection and endurance of up to 1 quadrillion cycles, the CY15V108QI-20LPXI guarantees peace of mind and maximum efficiency. Elevate your data storage solutions with this cutting-edge product today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring a longer lifespan.

Surface Mount: YES

Makes it easy to mount the FRAM on circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

Allows for synchronized data transfers and operations, enhancing overall performance.

Nominal Supply Voltage: 1.8 V

Operates at a low voltage, making it energy-efficient and suitable for power-sensitive applications.

No. of Terminals: 8

Provides a sufficient number of connection points for integrating the FRAM into various electronic systems.

Write Protection: HARDWARE/SOFTWARE

Offers multiple layers of write protection, ensuring data security and preventing accidental data loss.

Technology: CMOS

Utilizes CMOS technology, which is known for low power consumption and high speed, enhancing the overall performance of the FRAM.

Endurance: 1000000000000000 Write/Erase Cycles

Provides a high number of write/erase cycles, offering long-term reliability and durability for data storage.

Memory IC Type: FRAM

Utilizes Ferroelectric RAM technology, which offers fast read/write speeds, high endurance, and low power consumption.

Maximum Standby Current: 0.00011 Amp

Consumes minimal standby power, making it suitable for battery-powered devices and energy-efficient applications.

Technical Specifications

FRAMs CY15V108QI-20LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.2,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00011 Amp

Minimum Standby Voltage:

1.71 V

Maximum Supply Current:

1.75 mA

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15V108QI-20LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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