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CY15B102QN-50SXE

Infineon Technologies

CY15B102QN-50SXE by Infineon Technologies

Infineon CY15B102QN-50SXE FRAM offers 256Kx8 organization, operates at 50MHz clock frequency, and has a 3.3V nominal voltage. Ideal for applications requiring high endurance with 100T write/erase cycles, such as automotive electronics and industrial control systems.

Median Price

$13.000

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 120 parts In-Stock

1+ parts

$9.383

100+ parts

$9.040

1k+ parts

-

10k+ parts

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120

$9.383

$9.040

-

-

Arrow

USA . 353 parts In-Stock

1+ parts

$13.000

100+ parts

$11.723

1k+ parts

-

10k+ parts

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353

$13.000

$11.723

-

-

Chip1Stop

Japan . 244 parts In-Stock

1+ parts

$15.300

100+ parts

-

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-

10k+ parts

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244

$15.300

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-

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RS (Exports)

UK . 52 parts In-Stock

1+ parts

$16.587

100+ parts

$13.303

1k+ parts

-

10k+ parts

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52

$16.587

$13.303

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Rochester

USA . 1,033 parts In-Stock

1+ parts

-

100+ parts

$8.680

1k+ parts

$7.770

10k+ parts

$7.310

1,033

-

$8.680

$7.770

$7.310

DigiKey

USA . 940 parts In-Stock

1+ parts

-

100+ parts

$14.230

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-

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940

-

$14.230

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Flip Electronics (Authorized)

USA . 940 parts In-Stock

1+ parts

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940

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Verical

USA . 698 parts In-Stock

1+ parts

-

100+ parts

$10.850

1k+ parts

$9.713

10k+ parts

$9.137

698

-

$10.850

$9.713

$9.137

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 402 parts In-Stock

1+ parts

$11.182

100+ parts

-

1k+ parts

-

10k+ parts

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402

$11.182

-

-

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IBS Electronics

USA . 1,073 parts In-Stock

1+ parts

$14.716

100+ parts

$14.222

1k+ parts

$14.014

10k+ parts

-

1,073

$14.716

$14.222

$14.014

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Nova Conductors

Japan . 43 parts In-Stock

1+ parts

$14.875

100+ parts

-

1k+ parts

-

10k+ parts

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43

$14.875

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-

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Maritex

Poland . 1 parts In-Stock

1+ parts

$15.411

100+ parts

$9.907

1k+ parts

-

10k+ parts

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1

$15.411

$9.907

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-

Flip Electronics

USA . 940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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940

-

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Sensible Micro Corp

USA . 674 parts In-Stock

1+ parts

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674

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Vyrian

USA . 581 parts In-Stock

1+ parts

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581

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 610 parts In-Stock

1+ parts

$9.310

100+ parts

-

1k+ parts

-

10k+ parts

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610

$9.310

-

-

-

Semicontronic

India . 577 parts In-Stock

1+ parts

$9.310

100+ parts

$9.077

1k+ parts

$9.031

10k+ parts

-

577

$9.310

$9.077

$9.031

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Corphita

USA . 711 parts In-Stock

1+ parts

$10.593

100+ parts

-

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711

$10.593

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Continental Prestige Electronics

USA . 4,013 parts In-Stock

1+ parts

$12.427

100+ parts

-

1k+ parts

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10k+ parts

$12.178

4,013

$12.427

-

-

$12.178

Component Stockers USA

USA . 5,980 parts In-Stock

1+ parts

$13.720

100+ parts

$10.810

1k+ parts

$11.880

10k+ parts

-

5,980

$13.720

$10.810

$11.880

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$14.578

100+ parts

-

1k+ parts

$13.994

10k+ parts

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500

$14.578

-

$13.994

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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100+ parts

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10,000

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Argo Parts USA

USA . 2,120 parts In-Stock

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2,120

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Glotronic Ltd.

UK . 411 parts In-Stock

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411

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Advanced Electronics

New Zealand . 24 parts In-Stock

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24

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Overview

Experience the cutting-edge technology of the CY15B102QN-50SXE FRAM by Infineon Technologies. With a reputation for excellence, Infineon delivers top-quality products that exceed expectations. This FRAM is ideal for applications requiring high endurance and low power consumption, making it a valuable asset for customers seeking reliable and efficient memory solutions. Trust in Infineon for superior performance and innovation in memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving space and improving reliability.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and reliability, making this product suitable for automotive applications where durability is crucial.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer and better synchronization between the memory and the system, improving overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V provides a good balance between power consumption and performance.

No. of Terminals: 8

Having 8 terminals allows for easy integration into systems and provides more options for connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for applications where size is a constraint.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without losing performance.

Minimum Standby Voltage: 1.8 V

The low minimum standby voltage helps in reducing power consumption during standby mode, making it energy efficient.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation even in extreme cold conditions.

Terminal Finish: PURE TIN

Pure tin terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection options adds an extra layer of security to prevent accidental data loss or corruption.

Maximum Clock Frequency (fCLK): 50 MHz

Operating at a maximum clock frequency of 50MHz allows for fast data transfer speeds and efficient performance.

Minimum Data Retention Time: 11

With a minimum data retention time of 11 years, this product ensures that data stored in the memory remains intact for a long period.

Memory Density: 2097152 bit

With a high memory density, this product can store a large amount of data, making it suitable for applications requiring high storage capacity.

Technical Specifications

FRAMs CY15B102QN-50SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

5.28 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00035 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B102QN-50SXE Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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