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CY15B104Q-SXIT

Infineon Technologies

CY15B104Q-SXIT by Infineon Technologies

Infineon's CY15B104Q-SXIT is a FRAM with 512Kx8 organization, operating at 3.3V. It offers synchronous operation, 40MHz clock frequency, and SPI serial bus type. Ideal for applications requiring high endurance with 100T write/erase cycles, such as IoT devices and industrial automation systems.

Median Price

$22.530

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,125 parts In-Stock

1+ parts

$22.530

100+ parts

$19.660

1k+ parts

$19.540

10k+ parts

-

1,125

$22.530

$19.660

$19.540

-

Verical

USA . 1,125 parts In-Stock

1+ parts

$22.530

100+ parts

$19.660

1k+ parts

$19.540

10k+ parts

-

1,125

$22.530

$19.660

$19.540

-

DigiKey

USA . 2,481 parts In-Stock

1+ parts

$32.320

100+ parts

$27.543

1k+ parts

$26.626

10k+ parts

$24.639

2,481

$32.320

$27.543

$26.626

$24.639

Mouser Electronics

USA . 2,030 parts In-Stock

1+ parts

$32.320

100+ parts

$27.550

1k+ parts

$26.310

10k+ parts

$24.630

2,030

$32.320

$27.550

$26.310

$24.630

Flip Electronics (Authorized)

USA . 27,517 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,517

-

-

-

-

Chip1Stop

Japan . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$18.260

2,000

-

-

-

$18.260

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 128 parts In-Stock

1+ parts

$25.204

100+ parts

-

1k+ parts

-

10k+ parts

-

128

$25.204

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$26.879

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$26.879

-

-

-

Flip Electronics

USA . 26,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,827

-

-

-

-

Vyrian

USA . 5,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,520

-

-

-

-

Chip Stock

USA . 4,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,570

-

-

-

-

LIBRA Elektronik GmbH

Germany . 130 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

130

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,451 parts In-Stock

1+ parts

$15.520

100+ parts

-

1k+ parts

-

10k+ parts

-

5,451

$15.520

-

-

-

Corphita

USA . 975 parts In-Stock

1+ parts

$23.877

100+ parts

-

1k+ parts

-

10k+ parts

-

975

$23.877

-

-

-

Continental Prestige Electronics

USA . 3,933 parts In-Stock

1+ parts

$26.879

100+ parts

-

1k+ parts

-

10k+ parts

$26.342

3,933

$26.879

-

-

$26.342

Netroflash

USA . 100 parts In-Stock

1+ parts

$26.879

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$26.879

-

-

-

Advanced Electronics

New Zealand . 2,898 parts In-Stock

1+ parts

$123.600

100+ parts

$117.420

1k+ parts

$117.420

10k+ parts

-

2,898

$123.600

$117.420

$117.420

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,340

-

-

-

-

Argo Parts USA

USA . 4,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,252

-

-

-

-

Overview

Discover the cutting-edge CY15B104Q-SXIT from Infineon Technologies, a superior FRAM memory IC designed to revolutionize your electronics. With a focus on quality and reliability, Infineon Technologies delivers exceptional products that exceed industry standards. This versatile memory device offers unparalleled value with its wide range of applications, including data storage, industrial controls, and automotive systems. Upgrade your devices with the CY15B104Q-SXIT and experience the benefits of faster read/write speeds, increased endurance, and enhanced performance. Trust Infineon Technologies for innovative solutions that elevate your technology to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring a long lifespan.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Enables synchronized data transfers, resulting in efficient performance and data integrity.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a commonly used voltage level, making it compatible with various systems and devices.

No. of Terminals: 8

Offers sufficient I/O connections for interfacing with external devices, increasing versatility and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable operation in diverse environmental conditions.

Organization: 512KX8

Provides a large memory capacity with efficient data organization, suitable for storing and accessing a significant amount of data.

Write Protection: HARDWARE/SOFTWARE

Allows for flexible and customizable write protection options, enhancing data security and preventing unauthorized access.

Maximum Clock Frequency (fCLK): 40 MHz

Supports high-speed data transfer, improving overall system performance and responsiveness.

Memory Width: 8

Provides a wide memory interface, enabling efficient data processing and access to multiple data bits simultaneously.

Technical Specifications

FRAMs CY15B104Q-SXIT attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

5.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00025 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104Q-SXIT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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