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FM24C04C-G

Infineon Technologies

FM24C04C-G by Infineon Technologies

FM24C04C-G by Infineon Technologies is a FRAM with 512x8 organization, operating at 5V. It offers 1MHz clock frequency, I2C serial bus type, and 1000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed synchronous operation in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 11,000 parts In-Stock

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Vyrian

USA . 1,020 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Digiode

USA . 134 parts In-Stock

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134

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Ampacity Inc.

Singapore . 960 parts In-Stock

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$5.000

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960

$5.000

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AZTECH Wire

Italy . 433 parts In-Stock

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$16.862

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433

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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Continental Prestige Electronics

USA . 6,835 parts In-Stock

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Kepictronics

USA . 4,563 parts In-Stock

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Argo Parts USA

USA . 3,853 parts In-Stock

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Corphita

USA . 660 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of reliable data storage with the FM24C04C-G by Infineon Technologies. As a leader in FRAM technology, Infineon ensures top-notch quality and performance in every product they deliver. Ideal for a wide range of applications, this FRAM offers unmatched durability and security. Experience the value of seamless integration, fast data access, and superior endurance with the FM24C04C-G. Trust Infineon to provide you with the cutting-edge solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the FRAM, ensuring long-term performance.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Enables synchronized operation with other components in the system, improving overall performance.

Nominal Supply Voltage / Vsup (V): 5

Standard voltage rating compatible with many systems, ensuring seamless integration.

Memory Density: 4096 bit

Provides ample storage capacity for data, making it suitable for a variety of applications.

Memory IC Type: FRAM

Utilizes Ferroelectric RAM technology for fast read/write speeds and high endurance, making it a reliable choice for data storage.

Maximum Operating Temperature: 85 °C

Capable of operating in a wide range of temperatures, suitable for various environmental conditions.

Endurance: 1000000000000 Write/Erase Cycles

Offers extremely high endurance, ensuring longevity and reliability for frequent read/write operations.

Technical Specifications

FRAMs FM24C04C-G attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Write Protection:

HARDWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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