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FM24CL64B-GTR

Infineon Technologies

FM24CL64B-GTR by Infineon Technologies

FM24CL64B-GTR by Infineon Technologies is a FRAM memory IC with 8Kx8 organization and 65536-bit memory density. It operates in synchronous mode with a max clock frequency of 1 MHz. This small outline package is suitable for applications requiring high endurance, such as industrial automation and automotive systems.

Median Price

$2.434

Lifecycle Status

Suppliers In-Stock

35

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 4,739 parts In-Stock

1+ parts

$1.670

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$1.670

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$1.670

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$1.670

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Chip1Stop

Japan . 1,113 parts In-Stock

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$2.430

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$2.160

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Arrow

USA . 1,253 parts In-Stock

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$2.437

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$2.147

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$1.803

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$2.437

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DigiKey

USA . 15,508 parts In-Stock

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$2.820

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$2.441

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$2.250

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$2.176

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$2.441

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$2.176

Mouser Electronics

USA . 15,020 parts In-Stock

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$2.910

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Element14

Singapore . 1,154 parts In-Stock

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Farnell

UK . 1,539 parts In-Stock

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Flip Electronics (Authorized)

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Verical

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Future Electronics

Canada . 10,000 parts In-Stock

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Avnet

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Rochester

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RS (Exports)

UK . 1,345 parts In-Stock

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Distributors (In-Stock)

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EXC GmbH

Germany . 1,250 parts In-Stock

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SOS electronic

Slovakia . 2,055 parts In-Stock

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Digiode

USA . 727 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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IBS Electronics

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Schukat

Germany . 8,330 parts In-Stock

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$0.760

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Rutronik

Germany . 5,000 parts In-Stock

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Rebound Electronics

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NAC Semi

USA . 2,500 parts In-Stock

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Amalfi Trading

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Micros sp.j. W. Kędra i J. Lic

Poland . 500 parts In-Stock

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$0.834

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Micros

Poland . 390 parts In-Stock

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ComSIT Distribution GmbH

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Partservice

France . 215 parts In-Stock

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HZD GmbH

Germany . 200 parts In-Stock

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Semicontronic

India . 28,773 parts In-Stock

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$1.190

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$1.160

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Ampacity Inc.

Singapore . 28,747 parts In-Stock

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Corphita

USA . 467 parts In-Stock

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Argo Parts USA

USA . 358 parts In-Stock

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Component Stockers USA

USA . 41,052 parts In-Stock

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$2.910

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$2.230

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$2.070

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$1.960

41,052

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$2.230

$2.070

$1.960

Continental Prestige Electronics

USA . 4,207 parts In-Stock

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$3.190

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$2.240

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$2.020

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$103.000

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$97.850

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$97.850

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$103.000

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Perfect Parts

USA . 81,966 parts In-Stock

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Authorized Procurement Solutions

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Singapore . 11,400 parts In-Stock

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iodParts Technologies Inc.

India . 9,934 parts In-Stock

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GreenTree Electronics

Israel . 5,527 parts In-Stock

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Kepictronics

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Benley Electronics

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Infinite Electronics LLP (Excess)

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Eastek

USA . 2,500 parts In-Stock

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Lixinc

USA . 2,384 parts In-Stock

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

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Speed Components Ltd (Excess)

Israel . 1,998 parts In-Stock

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Allen Electronics Distributors

USA . 1,966 parts In-Stock

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Component Connect

USA . 1,841 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$2.366

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$2.316

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Cyclops Electronics Ltd (Excess)

UK . 100 parts In-Stock

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Glotronic Ltd.

UK . 80 parts In-Stock

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Overview

Experience the next level of data storage with the FM24CL64B-GTR by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality and reliability. This product belongs to the FRAMs category, offering exceptional performance and durability. With its sleek and compact design, it is perfect for space-constrained applications. The FM24CL64B-GTR operates in synchronous mode, ensuring seamless data transfer. It boasts a wide range of applications, including consumer electronics, automotive systems, and industrial control. Unlock the value and benefits this product brings, such as high-speed read and write operations, low power consumption, and extensive endurance. Trust Infineon Technologies for all your data storage needs and elevate your devices to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and helps protect the internal components of the product. It makes this FRAM a reliable and long-lasting choice.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into various electronic devices. It ensures a seamless assembly process, making this FRAM suitable for efficient production.

No. of Functions: 1

With one function, this FRAM simplifies the design and operation of the product. It is ideal for applications that require a straightforward and efficient solution.

Package Shape: RECTANGULAR

The rectangular shape of the package provides compatibility with standard PCB layouts. It allows for easy placement and fitting in electronic systems, making it a convenient choice for design and manufacturing.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise timing and synchronization of data, enhancing the overall performance and reliability of the product. It makes this FRAM suitable for applications that require accurate data storage and retrieval.

Nominal Supply Voltage/Vsup (V): 3.3

The nominal supply voltage of 3.3V provides compatibility with a wide range of electronic systems. It offers flexibility in power requirements, making this FRAM compatible with various devices and platforms.

Power Supplies (V): 3/3.3

With its support for dual power supply options of 3V and 3.3V, this FRAM caters to different voltage requirements of diverse applications. It offers versatility and compatibility with various electronic systems.

No. of Terminals: 8

The 8 terminals enable easy connection and integration into electronic circuits. It simplifies the installation process and makes this FRAM suitable for compact designs where space is limited.

Package Style (Meter): SMALL OUTLINE

The small outline package style ensures a compact form factor, making this FRAM suitable for space-constrained designs. It is an excellent choice for applications that require high-density memory in a small footprint.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FRAM can withstand high-temperature environments. It ensures reliable operation even in rugged conditions, making it suitable for industrial and automotive applications.

Organization: 8KX8

The organization of 8KX8 means that the FRAM has a capacity of 8 kilobytes, with a byte-wide data organization. It provides sufficient memory space for data storage applications, making this FRAM suitable for various data-intensive tasks.

Minimum Standby Voltage: 2.7 V

The minimum standby voltage requirement of 2.7V ensures efficient power management, extending the battery life in portable devices. It makes this FRAM energy-efficient and suitable for low-power applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this FRAM can function reliably even in extremely cold environments. It is well-suited for applications that require operation in sub-zero conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance. It ensures secure connections and long-term reliability, making this FRAM suitable for demanding environments.

Terminal Position: DUAL

The dual terminal position allows for flexibility in connecting the FRAM to the electronic system. It provides options for different board layouts and improves compatibility in various applications.

Write Protection: HARDWARE

The hardware write protection feature adds an additional layer of security to prevent accidental or unauthorized data modifications. It ensures the integrity and confidentiality of stored data, making this FRAM suitable for secure applications.

Maximum Seated Height: 1.727 mm

With a maximum seated height of 1.727mm, this FRAM has a low-profile construction. It is well-suited for compact designs and applications where space constraints are critical.

Maximum Clock Frequency (fCLK): 1 MHz

The high maximum clock frequency of 1 MHz enables fast and efficient data read and write operations. It enhances the overall performance and responsiveness of the product, making it suitable for time-sensitive applications.

Width: 3.8985 mm

The compact width of 3.8985mm ensures a space-efficient design. It allows for integration into electronic systems with limited board space, making this FRAM suitable for miniaturized applications.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage requirement of 2.7V ensures compatibility with low-voltage power sources. It makes this FRAM suitable for energy-efficient and battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at the peak reflow temperature, this FRAM can withstand the reflow soldering process without compromising its functionality. It ensures reliable manufacturing and easy integration into electronic assemblies.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C indicates the FRAM's ability to withstand high-temperature soldering processes. It ensures proper solder joint formation and robust assembly, making this FRAM suitable for reliable manufacturing.

Length: 4.889 mm

The length of 4.889mm ensures a compact footprint, making this FRAM suitable for space-constrained designs. It allows for flexible placement and integration into electronic systems with limited space availability.

Technology: CMOS

The CMOS technology used in this FRAM provides low power consumption and high noise immunity. It ensures efficient operation and reliable performance, making it a suitable choice for power-sensitive applications.

Parallel or Serial: SERIAL

The serial data interface enables efficient communication and data transfer between the FRAM and other devices. It simplifies the design and integration process and makes this FRAM suitable for applications that require serial data processing.

Terminal Form: GULL WING

The gull-wing terminal form allows for easy soldering and secure connections. It ensures reliable electrical contacts and enhances the overall durability of the product, making this FRAM suitable for rugged environments.

Maximum Supply Current: 0.3 mA

With a maximum supply current of 0.3mA, this FRAM operates at low power consumption levels. It reduces energy requirements and makes it suitable for battery-powered or energy-conscious applications.

No. of Words: 8192 words

The 8192-word capacity offers ample space for data storage and retrieval requirements. It provides extensive memory capabilities, making this FRAM suitable for applications with large data sets.

Memory Width: 8

With a memory width of 8, this FRAM can store and retrieve data in byte-sized chunks. It ensures compatibility with standard data formats and makes it a versatile choice for various applications.

Minimum Data Retention Time: 10

The minimum data retention time of 10 years ensures long-term data integrity and storage. It makes this FRAM suitable for applications where data longevity and reliability are critical.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm provides compatibility with standard PCB layouts and facilitates easy integration into electronic assemblies. It ensures hassle-free installation and makes this FRAM suitable for streamlined production processes.

No. of Words Code: 8K

The 8K words code indicates the FRAM's memory capacity of 8 kilobytes. It offers sufficient storage space for small to medium-sized data sets, making this FRAM suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this FRAM has moderate moisture sensitivity. It can withstand normal levels of exposure to moisture during the manufacturing and assembly processes, ensuring reliable performance and product longevity.

Maximum Supply Voltage (Vsup): 3.65 V

The maximum supply voltage of 3.65V allows for compatibility with higher voltage power sources. It ensures versatility in power supply options, making this FRAM suitable for various electronic systems.

Endurance: 100000000000000 Write/Erase Cycles

With an endurance rating of 100 trillion write/erase cycles, this FRAM offers exceptional durability and longevity. It can handle extensive data read/write operations without compromising its performance or lifespan, making it an excellent choice for high-demand applications.

Serial Bus Type: I2C

The I2C serial bus type enables efficient and standardized communication between devices. It simplifies the integration process and makes this FRAM compatible with a wide range of systems and platforms.

Memory Density: 65536 bit

With a memory density of 65536 bits, this FRAM offers high storage capacity within a compact package. It ensures sufficient memory space for data-intensive applications, making it suitable for various tasks.

Memory IC Type: FRAM

The FRAM memory IC type combines the benefits of non-volatile memory and high-speed operation. It offers fast read/write operations, low power consumption, and high endurance, making this FRAM an excellent choice for applications that require reliable data storage and retrieval.

Maximum Standby Current: 0.000006 Amp

With a maximum standby current of 0.000006 Amp, this FRAM operates at extremely low power levels when not actively used. It minimizes power consumption and makes it ideal for energy-efficient applications.

Technical Specifications

FRAMs FM24CL64B-GTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

.3 mA

Maximum Supply Voltage (Vsup):

3.65 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

FM24CL64B-GTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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