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CY15B108QN-20LPXC

Infineon Technologies

CY15B108QN-20LPXC by Infineon Technologies

Infineon CY15B108QN-20LPXC FRAM offers 1MX8 organization, 20 MHz clock frequency, and 3.2 mA supply current. Ideal for applications requiring high endurance, such as industrial automation systems or IoT devices.

Median Price

$22.520

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 254 parts In-Stock

1+ parts

$21.200

100+ parts

-

1k+ parts

-

10k+ parts

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254

$21.200

-

-

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Arrow

USA . 1 parts In-Stock

1+ parts

$21.310

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$21.310

-

-

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DigiKey

USA . 523 parts In-Stock

1+ parts

$39.690

100+ parts

$33.785

1k+ parts

-

10k+ parts

-

523

$39.690

$33.785

-

-

Flip Electronics (Authorized)

USA . 5,726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,726

-

-

-

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Rochester

USA . 669 parts In-Stock

1+ parts

-

100+ parts

$22.520

1k+ parts

$20.150

10k+ parts

$18.970

669

-

$22.520

$20.150

$18.970

Verical

USA . 474 parts In-Stock

1+ parts

-

100+ parts

$28.150

1k+ parts

$25.188

10k+ parts

$23.712

474

-

$28.150

$25.188

$23.712

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 221 parts In-Stock

1+ parts

$19.950

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$19.950

-

-

-

Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$26.482

100+ parts

-

1k+ parts

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10k+ parts

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79

$26.482

-

-

-

Flip Electronics

USA . 4,746 parts In-Stock

1+ parts

-

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4,746

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-

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Vyrian

USA . 510 parts In-Stock

1+ parts

-

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510

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Cyclops Electronics Ltd

UK . 439 parts In-Stock

1+ parts

-

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439

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 692 parts In-Stock

1+ parts

$16.830

100+ parts

$16.409

1k+ parts

$16.325

10k+ parts

-

692

$16.830

$16.409

$16.325

-

Ampacity Inc.

Singapore . 511 parts In-Stock

1+ parts

$18.270

100+ parts

-

1k+ parts

-

10k+ parts

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511

$18.270

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-

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Corphita

USA . 996 parts In-Stock

1+ parts

$18.900

100+ parts

-

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10k+ parts

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996

$18.900

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Continental Prestige Electronics

USA . 6,623 parts In-Stock

1+ parts

$26.482

100+ parts

-

1k+ parts

-

10k+ parts

$25.952

6,623

$26.482

-

-

$25.952

Netroflash

USA . 50 parts In-Stock

1+ parts

$26.482

100+ parts

-

1k+ parts

$25.158

10k+ parts

$24.628

50

$26.482

-

$25.158

$24.628

Component Stockers USA

USA . 227 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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227

$99.990

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 5,302 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,302

-

-

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Argo Parts USA

USA . 2,607 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,607

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-

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Overview

Discover the cutting-edge CY15B108QN-20LPXC by Infineon Technologies, a top-tier manufacturer known for its superior quality and innovation. As a part of the FRAMs category, this product offers unmatched reliability and performance in various applications. With its advanced features and benefits, including high endurance, low power consumption, and secure write protection, customers can trust that their data is safe and accessible at all times. Experience the value and advantages that the CY15B108QN-20LPXC brings to your projects, setting new standards in memory technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material for better handling and protection of the internal components.

Operating Mode: SYNCHRONOUS

Enables synchronized operation with other devices, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for efficient and reliable operation of the FRAM.

No. of Terminals: 8

Simplified interface with other components, reducing complexity in system integration.

Maximum Operating Temperature: 70 °C

High operating temperature range for versatility in various environmental conditions.

Technology: CMOS

Low power consumption and high speed operation for energy-efficient performance.

Parallel or Serial: SERIAL

Serial interface for efficient data transfer and communication with other devices.

Memory IC Type: FRAM

Utilizes Ferroelectric RAM technology for fast read/write operations and high endurance.

Technical Specifications

FRAMs CY15B108QN-20LPXC attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00012 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B108QN-20LPXC Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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