Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's FM16W08-SGTR FRAM offers 8KX8 organization, 3.3V nominal voltage, and 100000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with fast access time in a small outline package.
Median Price
$4.369
Lifecycle Status
Suppliers In-Stock
12
In-Stock Inventory
1k+
Chip1Stop
1+ parts
$6.860
100+ parts
$4.920
1k+ parts
-
10k+ parts
Flip Electronics (Authorized)
Arrow
$4.178
$4.070
Verical
$4.560
$4.360
Rochester
$3.750
$3.360
$3.160
Digiode
$3.848
Nova Conductors
$4.800
Bristol Electronics
$9.000
TME
$9.900
$8.500
Flip Electronics
Vyrian
IBS Electronics
$5.026
Ampacity Inc.
$3.150
Corphita
$3.645
Component Stockers USA
$4.220
$3.850
$4.100
Aranea Global
$4.704
$4.516
Perfect Parts
QUARKTWIN TECHNOLOGY LTD
Lixinc
Kepictronics
GreenTree Electronics
Futuretech Components
Authorized Procurement Solutions
CPlus Electronics
Metaverse IC Inc.
The use of plastic/epoxy material makes this FRAM lightweight and durable, suitable for a variety of applications.
The surface mount capability allows for easy installation and saves space on the PCB, making it a convenient choice for compact designs.
The rectangular shape of the package provides a standard form factor, ensuring compatibility with a wide range of equipment.
The asynchronous operating mode allows for fast and efficient data transfer, enhancing performance in real-time applications.
The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.
With support for 3V and 5V power supplies, this FRAM offers versatility and flexibility in different operating environments.
The 28 terminals provide ample connectivity options, enabling seamless integration with other components in the system.
The small outline package style saves space and facilitates efficient PCB layout, ideal for space-constrained applications.
The high maximum operating temperature of 85°C ensures reliable performance in harsh environmental conditions.
The 8Kx8 organization offers a good balance between memory capacity and access speed, suitable for a wide range of data storage applications.
The low minimum standby voltage of 2.7V helps conserve power in standby mode, extending the battery life of portable devices.
The low minimum operating temperature of -40°C allows for reliable operation in extreme cold environments.
The pure tin terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection over time.
The dual terminal position allows for secure mounting on the PCB, minimizing the risk of connectivity issues during operation.
The low maximum seated height of 2.67mm helps reduce the overall profile of the FRAM, making it suitable for slim devices.
The compact width of 7.505mm makes this FRAM suitable for applications where space is limited.
The low minimum supply voltage requirement of 2.7V ensures compatibility with a wide range of power sources.
The maximum time at peak reflow temperature of 30 seconds ensures proper soldering during assembly, reducing the risk of defects.
The peak reflow temperature of 260°C allows for reliable soldering of the FRAM onto the PCB, ensuring a secure connection.
The length of 17.905mm provides a standard form factor, making this FRAM compatible with existing designs and systems.
The CMOS technology used in this FRAM offers low power consumption and high speed, enhancing overall performance efficiency.
The parallel data transfer mode allows for fast and efficient communication with other components, making it suitable for high-speed applications.
The gull wing terminal form provides a secure and reliable connection, minimizing the risk of signal loss or interference.
The low maximum supply current of 12mA helps conserve power and reduce heat generation, making it suitable for energy-efficient designs.
The 8192 words capacity offers ample storage space for data, suitable for a wide range of applications.
The memory width of 8 bits provides a good balance between data storage capacity and access speed, making it suitable for versatile use cases.
The minimum data retention time of 10 years ensures that stored data remains intact for extended periods, suitable for long-term applications.
The small terminal pitch of 1.27mm allows for high-density mounting on the PCB, saving space and enabling compact designs.
The 8K words code indicates the capacity of the FRAM, providing a clear reference for system integration and compatibility.
The MSL level of 3 indicates the FRAM's resistance to moisture and humidity, ensuring reliable performance in various environmental conditions.
The high maximum supply voltage of 5.5V ensures compatibility with a wide range of power sources and systems.
The high endurance rating of 100 trillion write/erase cycles ensures long-lasting reliability and durability for frequent data read/write operations.
The memory density of 65536 bits provides ample storage space for data-intensive applications, suitable for various memory storage requirements.
The FRAM memory IC type offers fast read/write speeds and non-volatile data storage, making it ideal for high-performance applications.
The low maximum standby current of 0.00005A helps conserve power in idle mode, extending the battery life of the device.
The fast maximum access time of 80 nanoseconds ensures quick retrieval of data, enhancing overall system performance and efficiency.
FRAMs FM16W08-SGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Maximum Access Time:
Additional Features:
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
FM16W08-SGTR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
1N4148WS
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Gec Plessey Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
OHN3140U
Tt Electronics Plc
OHN3140U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 2mT. It features an output range of 25mA and operates b/w -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields in various industries.
2N7002-7-F
SPC TECHNOLOGY/ MULTICOMP
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Form: GULL WING; Package Shape: RECTANGULAR;
2N2222A
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; JESD-609 Code: e3; Minimum DS Breakdown Voltage: 60 V;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Good-ark Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): 1.8 W; Maximum Collector Current (IC): .8 A;
1N4148
Terry Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Maximum Reverse Recovery Time: .004 us; Config: SINGLE; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
L7805CV
STMicroelectronics
L7805CV by STMicroelectronics is a fixed positive single output standard regulator with an output voltage of 5V and max current of 1.5A. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring stable voltage regulation in electronic circuits.
LM358M
Texas Instruments
LM358M by Texas Instruments is an Operational Amplifier with 2 functions, featuring a max input offset voltage of 9000 uV and a nominal voltage of 5 V. It is commonly used in applications requiring high common mode rejection ratio and low bias current, such as sensor interfaces and signal conditioning circuits.
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
Semitron
RECTIFIER DIODE; Surface Mount: NO; JESD-609 Code: e0; Maximum Output Current: .15 A; Maximum Operating Temperature: 200 Cel; Maximum Reverse Recovery Time: .004 us;
Raytheon Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MB85RC64APNF-G-JNERE1
Fujitsu
Fujitsu's MB85RC64APNF-G-JNERE1 FRAM offers 8Kx8 organization, operates at 3.3V, and has a clock frequency of 1MHz. Ideal for applications requiring high endurance, such as IoT devices or industrial sensors due to its low standby current and wide operating temperature range.
CY15B102N-ZS60XET
Cypress Semiconductor
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Maximum Access Time: 105 ns; Maximum Supply Current: 20 mA;
FM24C64B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 65536 bit; Maximum Supply Voltage (Vsup): 5.5 V;
FM24V01A-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 1 mA; Maximum Time At Peak Reflow Temperature (s): 30;
CY15B104QN-50SXAT
Infineon Technologies
Infineon CY15B104QN-50SXAT is a FRAM with 512Kx8 organization, operates at 50MHz clock frequency, and has SPI serial bus type. It is suitable for automotive applications due to AEC-Q100 screening level and endurance of 10^14 write/erase cycles.
CY15B108QSN-108BKXI
Infineon CY15B108QSN-108BKXI FRAM offers 1MX8 organization, operates at 108 MHz clock frequency, and has a memory density of 8388608 bit. Ideal for applications requiring high endurance with 100T write/erase cycles, such as industrial automation and IoT devices.
FM22L16-55-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
FM28V100-TGTR
FRAM; No. of Terminals: 32; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Functions: 1;
FM25V20-GTR
Infineon's FM25V20-GTR is a FRAM with 256KX8 organization, SPI serial bus type, and 40 MHz clock frequency. It operates at -40 to 85 °C, offers 100000000000000 write/erase cycles endurance, and has a small outline package for applications requiring high-speed non-volatile memory.
CY15B256J-SXET
Infineon's CY15B256J-SXET is a FRAM with 32Kx8 organization, operating at 3.4MHz clock frequency. It features synchronous operation, I2C serial bus type, and AEC-Q100 screening level. Ideal for applications requiring high endurance with 10000000000000 write/erase cycles in automotive electronics and industrial control systems.
FM22LD16-55-BG
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10;
CY15B102QN-50PZXI
Infineon's CY15B102QN-50PZXI FRAM offers 256Kx8 organization, operates at 50MHz clock frequency via SPI serial bus. With 1000000000000000 write/erase cycles endurance, it suits applications requiring high-speed data storage and retrieval in industrial environments.
CY15B016Q-SXE
CY15B016Q-SXE by Infineon Technologies is a FRAM with 2Kx8 organization, operating at 16MHz clock frequency. It has a synchronous mode and supports SPI serial bus type. With AEC-Q100 screening level, it's ideal for automotive applications requiring high endurance of 10^13 write/erase cycles.
FM25V20A-DG
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Organization: 256KX8;
FM24CL04B-G
Infineon's FM24CL04B-G FRAM offers 512x8 organization, operates at 3.3V with 1MHz clock frequency. Ideal for applications requiring high endurance like IoT devices due to its 100T write/erase cycles and I2C serial bus interface. Measuring just 4.889mm x 3.8985mm, it is a compact solution for data storage in small electronic devices.
FM25VN10-GTR
Infineon's FM25VN10-GTR FRAM features 128KX8 organization, operates at 3.3V with 40MHz clock frequency. Ideal for applications requiring high endurance like industrial automation and IoT due to its 100Tb write/erase cycles and SPI serial bus interface.
CY15V104Q-PZXI
FRAM; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Equivalence Code: DIP8,.3; Memory Density: 4194304 bit;
MB85RC64PNF-G-JNE1
Fujitsu's MB85RC64PNF-G-JNE1 FRAM features 8KX8 organization, 3.3V supply, and 0.4 MHz clock frequency. Ideal for applications requiring high endurance, such as IoT devices or industrial automation systems.
FM25V05-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Terminal Position: DUAL;
CY15B104QI-20LPXCT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Endurance: 1000000000000000 Write/Erase Cycles;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FM16W08-SG
Ramtron International
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; Width: 7.5 mm;
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Operating Mode: ASYNCHRONOUS;
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; No. of Functions: 1; Memory Width: 8;
FM1608-120-P
FRAM; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL; Package Body Material: PLASTIC/EPOXY;
FM1608B-SG
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Package Style (Meter): SMALL OUTLINE;
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Memory Width: 8;
FM1608S-180SI
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Current: 25 mA; No. of Words Code: 8K;
FM1608B-SGTR
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Density: 65536 bit; Package Equivalence Code: SOP28,.4;
FM16W08-SGTR
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2.7 V; Minimum Supply Voltage (Vsup): 2.7 V;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved