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CY15B104QN-50SXIT

Infineon Technologies

CY15B104QN-50SXIT by Infineon Technologies

Infineon CY15B104QN-50SXIT is a 512Kx8 FRAM with synchronous operation, 50 MHz clock frequency, and SPI serial bus. It offers 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed non-volatile memory with low power consumption.

Median Price

$15.930

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,999 parts In-Stock

1+ parts

$15.930

100+ parts

$13.629

1k+ parts

$12.848

10k+ parts

$12.201

1,999

$15.930

$13.629

$12.848

$12.201

Mouser Electronics

USA . 1,288 parts In-Stock

1+ parts

$15.930

100+ parts

$13.630

1k+ parts

$12.770

10k+ parts

$11.950

1,288

$15.930

$13.630

$12.770

$11.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 12,010 parts In-Stock

1+ parts

-

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12,010

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Digiode

USA . 524 parts In-Stock

1+ parts

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524

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Vyrian

USA . 335 parts In-Stock

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335

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 167 parts In-Stock

1+ parts

$16.230

100+ parts

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167

$16.230

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AZTECH Wire

Italy . 335 parts In-Stock

1+ parts

$17.786

100+ parts

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335

$17.786

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Microchip USA

USA . 5,199 parts In-Stock

1+ parts

$51.352

100+ parts

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5,199

$51.352

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Component Stockers USA

USA . 593 parts In-Stock

1+ parts

$192.950

100+ parts

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593

$192.950

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Corphita

USA . 395 parts In-Stock

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395

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience the next level of data storage with the CY15B104QN-50SXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon's FRAM memory offers unparalleled durability and reliability for a wide range of applications. From automotive to industrial, this product provides high-speed read and write capabilities, ensuring optimal performance and longevity. Upgrade your systems today with the value and benefits that only Infineon can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and protection for the internal components of the FRAM, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs and saves space, making the FRAM suitable for compact electronic devices.

Operating Mode: SYNCHRONOUS

Synchronous operation enables efficient and synchronized data transfers, enhancing the performance of the FRAM in data-intensive applications.

Nominal Supply Voltage: 3V

Operating at a nominal supply voltage of 3V provides compatibility with a wide range of electronic systems, offering flexibility in design and power requirements.

Organization: 512KX8

With an organization of 512KX8, the FRAM provides a large memory capacity for storing data efficiently, making it suitable for applications with high storage demands.

Write Protection: HARDWARE/SOFTWARE

The option for hardware/software write protection adds an extra layer of security to the FRAM, safeguarding stored data from unauthorized access or modification.

Maximum Clock Frequency (fCLK): 50 MHz

Operating at a maximum clock frequency of 50 MHz enables high-speed data processing and retrieval, making the FRAM ideal for applications requiring quick access to stored information.

Technology: CMOS

CMOS technology offers low power consumption and high reliability, ensuring energy-efficient operation and long-term performance for the FRAM in various electronic devices.

Endurance: 1000000000000000 Write/Erase Cycles

With an impressive endurance of 1 quadrillion write/erase cycles, the FRAM provides reliable and long-lasting data storage capabilities, outperforming traditional memory technologies.

Serial Bus Type: SPI

Utilizing the SPI serial bus type enables easy interfacing with microcontrollers and other peripheral devices, enhancing the connectivity and versatility of the FRAM in diverse applications.

Technical Specifications

FRAMs CY15B104QN-50SXIT attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

5.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.03 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104QN-50SXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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