Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
FM24CL64B-DGTR by Infineon Technologies is a FRAM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates in synchronous mode at a max clock frequency of 1 MHz via I2C serial bus. Ideal for applications requiring high endurance with up to 100000000000000 write/erase cycles.
Median Price
$3.680
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14
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1k+
Newark
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$3.250
100+ parts
$2.800
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$2.600
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Farnell
$3.180
$3.000
DigiKey
$3.930
$3.400
$3.131
$3.007
Element14
$4.070
$3.310
$3.130
Mouser Electronics
$4.330
$3.740
$3.440
$3.340
RS (Exports)
$4.537
$3.597
$3.279
Future Electronics
$1.800
Arrow
$2.081
Verical
$2.082
Nova Conductors
$3.760
Digiode
$3.866
IBS Electronics
$3.282
Vyrian
ComSIT Distribution GmbH
Semicontronic
$3.040
$2.964
$2.949
Advanced Electronics
$3.090
$2.936
Corphita
$3.663
Aranea Global
$3.685
$3.537
Argo Parts USA
Continental Prestige Electronics
Component Stockers USA
$4.470
$3.540
$3.230
$3.070
GreenTree Electronics
Authorized Procurement Solutions
QUARKTWIN TECHNOLOGY LTD
Futuretech Components
Robosynatics
$35.132
Lucentia Tech
Durable material that offers good protection for the internal components of the FRAM.
Allows for efficient data transfer and processing within the FRAM.
Optimal supply voltage for stable performance of the FRAM.
Offers a large storage capacity for data in the FRAM.
High endurance ensures long-lasting durability and reliability of the FRAM.
Supports efficient serial communication for data transfer.
FRAMs FM24CL64B-DGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Additional Features:
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Serial Bus Type:
Maximum Standby Current:
Minimum Standby Voltage:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
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Width:
Write Protection:
FM24CL64B-DGTR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
PCN Design/Specification - F-FRAM Marking Changes 30/Aug/2013 Datasheet Update 27/Feb/2014
PCN Assembly/Origin - Alternate Wafer Fab Site 01/Oct/2020
PCN Packaging - Date Code/Shelf Life Chgs 18/Jul/2019 Ship Label REV
PCN Other - MSL Standardization 15/Dec/2014
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148WT
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
BAT54C-7-F
Diodes Incorporated
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
IRLML6402TRPBF
IRLML6402TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 20V DS Breakdown Voltage, 22A IDM, and 0.065 ohm RDS(on). With a small outline package and matte tin finish, it operates in temperatures from -55 to 150 °C.
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
General Semiconductor
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CY15V102QN-50SXE
Infineon's CY15V102QN-50SXE is a FRAM with 256KX8 organization, operates at 50 MHz clock frequency, and has 10000000000000 Write/Erase cycles. It is used in applications requiring high endurance memory with SPI serial bus interface.
FM24C64B-G
Infineon Technologies' FM24C64B-G is a FRAM with 8KX8 organization, operating at 5V. It offers 100000000000000 write/erase cycles, serial I2C interface, and operates in synchronous mode up to 1 MHz. Ideal for applications requiring high endurance non-volatile memory with small outline package style.
FM25V02A-DGQ
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Additional Features: 2kv ESD available; Width: 4 mm;
FM24C16A-G
Ramtron International
FM24C16A-G by Ramtron International is a 2Kx8 FRAM with 1MHz clock frequency, I2C serial bus, and 1000000000000 write/erase cycles. It operates at -40 to 85 °C, ideal for low-power applications like IoT devices and wearables. The small outline package with dual terminals makes it suitable for space-constrained designs.
FM28V202-TGTR
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4;
CY15V104QSN-108SXIT
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Package Style (Meter): SMALL OUTLINE;
FM24CL64B-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; Minimum Standby Voltage: 2.7 V;
CY15V108QN-20LPXIT
Infineon's CY15V108QN-20LPXIT is a 1MX8 FRAM with 20 MHz clock frequency, SPI interface, and 1.8V supply voltage. Ideal for applications requiring high endurance, fast write speeds, and low power consumption such as IoT devices and industrial sensors.
CY15B102QN-50LHXI
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Form: NO LEAD; No. of Words: 262144 words;
CY15B104QI-20LPXC
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; Serial Bus Type: SPI;
FM22L16-55-TG
Infineon's FM22L16-55-TG FRAM offers 256KX16 organization, 3.3V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high endurance with 100T write/erase cycles, this CMOS memory IC features a parallel interface and thin profile package for compact designs.
FM25V05-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Maximum Supply Voltage (Vsup): 3.6 V;
FM24W256-EGTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Maximum Clock Frequency (fCLK): 1 MHz;
CY15V102QN-50LHXI
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Write Protection: HARDWARE/SOFTWARE; Maximum Seated Height: .8 mm;
FM28V020-SGTR
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Terminal Form: GULL WING;
CY15B064Q-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; No. of Words Code: 8K;
FM24CL04B-GTR
Infineon's FM24CL04B-GTR is a FRAM with 512x8 organization, operates at 3.3V, and has a clock frequency of 1MHz. Ideal for applications requiring high endurance, such as IoT devices or industrial sensors due to its low standby current and write/erase cycles.
CY15B108QN-40LPXI
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Length: 3.28 mm; Terminal Form: NO LEAD;
MB85RS64PNF-G-JNERE1
Fujitsu
Fujitsu's MB85RS64PNF-G-JNERE1 is a FRAM with 8KX8 organization, 20 MHz clock frequency, and SPI serial bus type. It operates at -40 to 85 °C and has 1000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption.
FM28V020-T28GTR
FRAM; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; Minimum Standby Voltage: 2 V; Nominal Supply Voltage / Vsup (V): 3.3;
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FM24CL64B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Terminal Position: DUAL;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.65 V; Package Body Material: PLASTIC/EPOXY;
FM24CL64B-GTR by Infineon Technologies is a FRAM memory IC with 8Kx8 organization and 65536-bit memory density. It operates in synchronous mode with a max clock frequency of 1 MHz. This small outline package is suitable for applications requiring high endurance, such as industrial automation and automotive systems.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Terminal Form: GULL WING;
Infineon Technologies' FM24CL64B-G is a FRAM with 8KX8 organization, operating at 3.3V, featuring 8192 words and 65536-bit memory density. It offers synchronous operation, hardware write protection, and serial bus type I2C. Ideal for applications requiring high endurance with up to 100T write/erase cycles in a small outline package style.
FM24W256-GTR
Infineon's FM24W256-GTR FRAM offers 32Kx8 organization, operates at 1MHz clock frequency, and has a memory density of 262144 bits. Ideal for applications requiring high endurance with 100T write/erase cycles, such as IoT devices and industrial automation systems.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Minimum Supply Voltage (Vsup): 2.7 V;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25; Maximum Time At Peak Reflow Temperature (s): 30;
FM24CL16B-GTR
FM24CL16B-GTR by Infineon Technologies is a FRAM with 2Kx8 organization, operating at 3.3V. It offers synchronous operation, 1MHz clock frequency, and 100 trillion write/erase cycles. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Maximum Standby Current: .000006 Amp;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Serial Bus Type: I2C;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512X8; Package Body Material: PLASTIC/EPOXY;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm; Maximum Supply Current: .3 mA;
FM24W256-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: I2C; Moisture Sensitivity Level (MSL): 1;
FM24W256-G by Infineon Technologies is a FRAM memory IC with 32KX8 organization, operating at 3.3V. It features a max clock frequency of 1 MHz and offers high endurance with 100T write/erase cycles. Ideal for applications requiring fast and reliable non-volatile memory storage in compact electronic devices.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Minimum Operating Temperature: -40 Cel;
FM24V10-GTR
Infineon's FM24V10-GTR is a FRAM with 128KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 1048576 bit and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Write Protection: HARDWARE;
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