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FM24C64B-G

Infineon Technologies

FM24C64B-G by Infineon Technologies

Infineon Technologies' FM24C64B-G is a FRAM with 8KX8 organization, operating at 5V. It offers 100000000000000 write/erase cycles, serial I2C interface, and operates in synchronous mode up to 1 MHz. Ideal for applications requiring high endurance non-volatile memory with small outline package style.

Median Price

$2.040

Lifecycle Status

Suppliers In-Stock

28

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 2,615 parts In-Stock

1+ parts

$1.930

100+ parts

$1.930

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$1.930

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2,615

$1.930

$1.930

$1.930

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Chip1Stop

Japan . 1,677 parts In-Stock

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$2.000

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Farnell

UK . 588 parts In-Stock

1+ parts

$2.040

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$1.820

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$1.790

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588

$2.040

$1.820

$1.790

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Arrow

USA . 2,981 parts In-Stock

1+ parts

$2.415

100+ parts

$2.134

1k+ parts

$1.665

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2,981

$2.415

$2.134

$1.665

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Element14

Singapore . 813 parts In-Stock

1+ parts

$3.112

100+ parts

$2.807

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$2.561

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813

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$2.561

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Mouser Electronics

USA . 4,944 parts In-Stock

1+ parts

$3.170

100+ parts

$2.690

1k+ parts

$2.190

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$2.160

4,944

$3.170

$2.690

$2.190

$2.160

Flip Electronics (Authorized)

USA . 54,345 parts In-Stock

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DigiKey

USA . 12,027 parts In-Stock

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$1.920

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Verical

USA . 10,000 parts In-Stock

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$2.212

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$2.212

Rochester

USA . 2,590 parts In-Stock

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$1.810

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$1.620

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$1.530

2,590

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$1.620

$1.530

Future Electronics

Canada . 2,336 parts In-Stock

1+ parts

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$1.530

1k+ parts

$1.480

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2,336

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$1.530

$1.480

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RS (Exports)

UK . 2,027 parts In-Stock

1+ parts

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100+ parts

$3.466

1k+ parts

$2.979

10k+ parts

$2.817

2,027

-

$3.466

$2.979

$2.817

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 870 parts In-Stock

1+ parts

$1.834

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870

$1.834

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SOS electronic

Slovakia . 200 parts In-Stock

1+ parts

$2.186

100+ parts

$1.208

1k+ parts

$1.164

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200

$2.186

$1.208

$1.164

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.080

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500

$3.080

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TME

Poland . 671 parts In-Stock

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$4.270

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671

$4.270

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Flip Electronics

USA . 46,197 parts In-Stock

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46,197

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Chip Stock

USA . 40,050 parts In-Stock

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Vyrian

USA . 6,742 parts In-Stock

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6,742

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IBS Electronics

USA . 6,025 parts In-Stock

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$2.693

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$2.651

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6,025

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$2.693

$2.651

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DigiKey Marketplace

USA . 3,897 parts In-Stock

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3,897

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NAC Semi

USA . 1,940 parts In-Stock

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$2.870

1,940

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$2.870

Rutronik

Germany . 1,067 parts In-Stock

1+ parts

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$2.610

1k+ parts

$2.120

10k+ parts

$2.080

1,067

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$2.610

$2.120

$2.080

Schukat

Germany . 900 parts In-Stock

1+ parts

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$1.272

1k+ parts

$1.217

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900

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$1.272

$1.217

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Avant Electronics Limited

UK . 240 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 155 parts In-Stock

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Netsource Technology, Inc.

USA . 50 parts In-Stock

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50

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Semtec, LLC

USA . 9 parts In-Stock

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9

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Distributors (Availability)

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Corphita

USA . 911 parts In-Stock

1+ parts

$1.737

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911

$1.737

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Benley Electronics

USA . 2 parts In-Stock

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$2.000

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2

$2.000

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.080

100+ parts

$3.018

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$3.080

$3.018

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Argo Parts USA

USA . 1,124 parts In-Stock

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$3.080

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Continental Prestige Electronics

USA . 2,816 parts In-Stock

1+ parts

$3.770

100+ parts

$2.690

1k+ parts

$2.490

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2,816

$3.770

$2.690

$2.490

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Component Stockers USA

USA . 636 parts In-Stock

1+ parts

$99.990

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636

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QUARKTWIN TECHNOLOGY LTD

USA . 20,163 parts In-Stock

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Kepictronics

USA . 7,849 parts In-Stock

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Lixinc

USA . 6,022 parts In-Stock

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Perfect Parts

USA . 5,513 parts In-Stock

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5,513

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Infinite Electronics LLP (Excess)

. 2,959 parts In-Stock

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2,959

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GreenTree Electronics

Israel . 1,940 parts In-Stock

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Metaverse IC Inc.

Canada . 800 parts In-Stock

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800

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Allen Electronics Distributors

USA . 256 parts In-Stock

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$2.300

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256

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Advanced Electronics

New Zealand . 45 parts In-Stock

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Overview

Unlock the power of innovation with the FM24C64B-G by Infineon Technologies, a leading manufacturer in FRAM technology. This versatile memory IC offers unparalleled reliability and endurance with 100 quadrillion write/erase cycles, making it ideal for industrial, automotive, and consumer applications. With a compact design and low power consumption, this serial FRAM provides high-speed data storage and retrieval while ensuring data integrity. Trust Infineon Technologies to deliver cutting-edge solutions that drive performance and efficiency in your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FRAM lightweight and durable, suitable for various applications.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures efficient and precise data transfer within the FRAM.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, making it compatible with most systems.

Write Protection: HARDWARE

The hardware write protection feature provides added security to the data stored in the FRAM.

Maximum Clock Frequency (fCLK): 1 MHz

With a maximum clock frequency of 1MHz, the FRAM can handle high-speed data transfer efficiently.

Technology: CMOS

Using CMOS technology ensures low power consumption and improved performance in the FRAM.

Endurance: 100000000000000 Write/Erase Cycles

The high endurance level of the FRAM enables frequent write and erase operations without degradation.

Serial Bus Type: I2C

Being compatible with the I2C serial bus type allows for easy integration and communication with other devices.

Technical Specifications

FRAMs FM24C64B-G attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00001 Amp

Sub-Category:

SRAMs

Maximum Supply Current:

.4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

FM24C64B-G Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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