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CY15V108QN-20LPXI

Infineon Technologies

CY15V108QN-20LPXI by Infineon Technologies

Infineon CY15V108QN-20LPXI is a 1MX8 FRAM with 20MHz clock frequency, SPI interface, and 1.8V supply voltage. Ideal for applications requiring high endurance, fast data retention, and low standby current consumption in compact designs.

Median Price

$24.370

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 925 parts In-Stock

1+ parts

$24.370

100+ parts

-

1k+ parts

-

10k+ parts

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925

$24.370

-

-

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Arrow

USA . 480 parts In-Stock

1+ parts

$29.310

100+ parts

-

1k+ parts

$25.960

10k+ parts

-

480

$29.310

-

$25.960

-

Flip Electronics (Authorized)

USA . 4,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,585

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-

-

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Verical

USA . 1,756 parts In-Stock

1+ parts

-

100+ parts

$29.962

1k+ parts

$26.813

10k+ parts

$25.225

1,756

-

$29.962

$26.813

$25.225

Rochester

USA . 1,745 parts In-Stock

1+ parts

-

100+ parts

$24.030

1k+ parts

$21.500

10k+ parts

$20.230

1,745

-

$24.030

$21.500

$20.230

DigiKey

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

$21.530

1k+ parts

-

10k+ parts

-

1,645

-

$21.530

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 262 parts In-Stock

1+ parts

$21.481

100+ parts

-

1k+ parts

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10k+ parts

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262

$21.481

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-

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Vyrian

USA . 985 parts In-Stock

1+ parts

$21.530

100+ parts

-

1k+ parts

-

10k+ parts

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985

$21.530

-

-

-

Flip Electronics

USA . 4,585 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

4,585

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 336 parts In-Stock

1+ parts

$0.240

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

336

$0.240

-

-

$0.230

Northwest PG Solutions

USA . 1,352 parts In-Stock

1+ parts

$0.264

100+ parts

-

1k+ parts

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10k+ parts

$0.233

1,352

$0.264

-

-

$0.233

Corphita

USA . 496 parts In-Stock

1+ parts

$20.351

100+ parts

-

1k+ parts

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10k+ parts

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496

$20.351

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

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Lixinc

USA . 961 parts In-Stock

1+ parts

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1k+ parts

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961

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Component Stockers USA

USA . 904 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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904

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-

Overview

Unlock limitless possibilities with the CY15V108QN-20LPXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies ensures top-notch quality and reliability in their FRAM category products. This versatile memory module offers unparalleled value with its high-end features and benefits, perfect for a wide range of applications. From enhanced data retention to seamless integration, the CY15V108QN-20LPXI provides customers with an efficient solution that sets them apart from the competition. Elevate your projects with this cutting-edge product and experience the difference Infineon Technologies brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making the product easy to handle and long-lasting.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving space and simplifying the manufacturing process.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures precise and coordinated data transfers, improving overall performance and reliability.

Nominal Supply Voltage (Vsup): 1.8V

The low nominal supply voltage helps in reducing power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 85°C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without compromising performance.

Organization: 1MX8

The organization of 1MX8 indicates a high memory capacity and data processing capability, suitable for demanding applications.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection ensures data security and prevents unauthorized access or modifications.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, making the product energy-efficient and fast.

Technical Specifications

FRAMs CY15V108QN-20LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00011 Amp

Minimum Standby Voltage:

1.71 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15V108QN-20LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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