Loading...

CY15B256J-SXA

Infineon Technologies

CY15B256J-SXA by Infineon Technologies

CY15B256J-SXA by Infineon Technologies is a FRAM with 32KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 262144 bit and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage in compact devices due to its small outline package style and synchronous operation mode.

Median Price

$7.220

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,059 parts In-Stock

1+ parts

$7.220

100+ parts

$6.260

1k+ parts

$6.200

10k+ parts

-

1,059

$7.220

$6.260

$6.200

-

Chip1Stop

Japan . 955 parts In-Stock

1+ parts

$9.390

100+ parts

$8.390

1k+ parts

-

10k+ parts

-

955

$9.390

$8.390

-

-

Mouser Electronics

USA . 395 parts In-Stock

1+ parts

$9.410

100+ parts

$7.890

1k+ parts

$7.400

10k+ parts

-

395

$9.410

$7.890

$7.400

-

DigiKey

USA . 230 parts In-Stock

1+ parts

$9.410

100+ parts

$8.086

1k+ parts

$7.576

10k+ parts

$7.408

230

$9.410

$8.086

$7.576

$7.408

Rochester

USA . 15,035 parts In-Stock

1+ parts

-

100+ parts

$5.060

1k+ parts

$4.530

10k+ parts

$4.260

15,035

-

$5.060

$4.530

$4.260

Verical

USA . 15,035 parts In-Stock

1+ parts

-

100+ parts

$6.325

1k+ parts

$5.662

10k+ parts

$5.325

15,035

-

$6.325

$5.662

$5.325

Arrow

USA . 485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.489

10k+ parts

$6.424

485

-

-

$6.489

$6.424

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 925 parts In-Stock

1+ parts

$5.348

100+ parts

-

1k+ parts

-

10k+ parts

-

925

$5.348

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$6.100

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$6.100

-

-

-

Vyrian

USA . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252

-

-

-

-

Flip Electronics

USA . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

233

-

-

-

-

DigiKey Marketplace

USA . 233 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

233

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 302 parts In-Stock

1+ parts

$4.790

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$4.790

-

-

-

Corphita

USA . 401 parts In-Stock

1+ parts

$5.067

100+ parts

-

1k+ parts

-

10k+ parts

-

401

$5.067

-

-

-

Component Stockers USA

USA . 1,617 parts In-Stock

1+ parts

$5.720

100+ parts

$5.760

1k+ parts

-

10k+ parts

-

1,617

$5.720

$5.760

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$5.978

100+ parts

-

1k+ parts

$5.739

10k+ parts

-

1,000

$5.978

-

$5.739

-

QUARKTWIN TECHNOLOGY LTD

USA . 15,107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

15,107

-

-

-

-

Authorized Procurement Solutions

USA . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Kepictronics

USA . 443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

443

-

-

-

-

Overview

Unlock the potential of your devices with the CY15B256J-SXA by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality FRAMs that are designed for high performance and reliability. Ideal for a wide range of applications, this product offers unparalleled value with its innovative features and benefits. Experience seamless operation, improved efficiency, and enhanced data security with the CY15B256J-SXA. Trust Infineon Technologies to provide you with cutting-edge solutions that exceed your expectations. Choose excellence, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components.

Surface Mount: YES

The surface mount design allows for easy and efficient PCB assembly, saving time and reducing production costs.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient use of space on the PCB, maximizing component placement flexibility.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and coordinated data transfers, improving overall system performance.

Nominal Supply Voltage (Vsup): 3.3V

The 3.3V supply voltage offers compatibility with a wide range of systems and applications.

No. of Terminals: 8

With 8 terminals, this FRAM offers connectivity options for versatile integration into different circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact designs and applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85°C ensures reliable performance in various environmental conditions.

Organization: 32KX8

The 32KX8 organization provides ample memory storage capacity for data-intensive applications.

Minimum Standby Voltage: 2V

The low minimum standby voltage requirement helps conserve power and extend battery life in portable devices.

Technical Specifications

FRAMs CY15B256J-SXA attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

3.4 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00015 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE

Trade Compliance

CY15B256J-SXA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20