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CY15V116QI-20BKXC

Infineon Technologies

CY15V116QI-20BKXC by Infineon Technologies

Infineon's CY15V116QI-20BKXC FRAM offers 2MX8 organization, operates at 20MHz clock frequency, and has a 1.8V nominal voltage. Ideal for applications requiring high endurance with 1000000000000000 write/erase cycles, such as IoT devices or industrial automation systems.

Median Price

$55.860

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 94 parts In-Stock

1+ parts

$54.590

100+ parts

$46.730

1k+ parts

-

10k+ parts

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94

$54.590

$46.730

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DigiKey

USA . 20 parts In-Stock

1+ parts

$54.590

100+ parts

$46.346

1k+ parts

-

10k+ parts

-

20

$54.590

$46.346

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-

Mouser Electronics

USA . 100 parts In-Stock

1+ parts

$55.860

100+ parts

$46.080

1k+ parts

-

10k+ parts

-

100

$55.860

$46.080

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-

Farnell

UK . 94 parts In-Stock

1+ parts

$56.407

100+ parts

$47.088

1k+ parts

-

10k+ parts

-

94

$56.407

$47.088

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Element14

Singapore . 94 parts In-Stock

1+ parts

$57.918

100+ parts

$46.513

1k+ parts

-

10k+ parts

-

94

$57.918

$46.513

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 684 parts In-Stock

1+ parts

$44.508

100+ parts

-

1k+ parts

-

10k+ parts

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684

$44.508

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-

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Vyrian

USA . 285 parts In-Stock

1+ parts

$46.850

100+ parts

-

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10k+ parts

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285

$46.850

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 828 parts In-Stock

1+ parts

$1.301

100+ parts

-

1k+ parts

-

10k+ parts

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828

$1.301

-

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Northwest PG Solutions

USA . 1,855 parts In-Stock

1+ parts

$1.431

100+ parts

-

1k+ parts

-

10k+ parts

-

1,855

$1.431

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Corphita

USA . 26 parts In-Stock

1+ parts

$42.165

100+ parts

-

1k+ parts

-

10k+ parts

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26

$42.165

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Continental Prestige Electronics

USA . 94 parts In-Stock

1+ parts

$51.460

100+ parts

$43.830

1k+ parts

-

10k+ parts

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94

$51.460

$43.830

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Overview

Unlock the power of cutting-edge memory technology with the CY15V116QI-20BKXC by Infineon Technologies. As a leading manufacturer in the industry, Infineon offers top-notch quality and reliability. This FRAM device is perfect for applications requiring high endurance and fast read/write speeds. With a wide range of features including hardware/software write protection and low power consumption, this product provides exceptional value and performance to customers. Experience seamless data storage and retrieval with the CY15V116QI-20BKXC - the perfect solution for your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

The rectangular shape is commonly used and facilitates easy placement on circuit boards.

Power Supplies (V): 3.3/5

Offers flexibility in power requirements, making it compatible with a variety of systems.

No. of Terminals: 20

Provides ample connection points for interfacing with other components in the circuit.

Maximum Operating Temperature: 125 °C

Can operate effectively in high-temperature environments, suitable for various applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, ensuring functionality in a wide range of operating conditions.

Terminal Finish: TIN

The tin finish is corrosion-resistant, enhancing the longevity of the product.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the level of moisture protection, ensuring reliability in humid environments.

Technical Specifications

FRAMs CY15V116QI-20BKXC attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PBGA-B24

Length:

8 mm

Memory Density:

16777216 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2097152 words

No. of Words Code:

2M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA24,5X5,40

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE

Parallel or Serial:

SERIAL

Maximum Seated Height:

1.2 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.0001425 Amp

Maximum Supply Current:

2.4 mA

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

BALL

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

6 mm

Write Protection:

HARDWARE/SOFTWARE

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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