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CY15B104Q-PZXI

Infineon Technologies

CY15B104Q-PZXI by Infineon Technologies

Infineon's CY15B104Q-PZXI FRAM features 512KX8 organization, 40 MHz clock frequency, and SPI serial bus type. Ideal for applications requiring high endurance with 1000000000000000 write/erase cycles, such as industrial control systems and automotive electronics.

Median Price

$5.790

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 759 parts In-Stock

1+ parts

$5.190

100+ parts

$4.080

1k+ parts

$3.750

10k+ parts

-

759

$5.190

$4.080

$3.750

-

DigiKey

USA . 387 parts In-Stock

1+ parts

$5.790

100+ parts

$5.097

1k+ parts

$4.693

10k+ parts

$4.584

387

$5.790

$5.097

$4.693

$4.584

Mouser Electronics

USA . 80 parts In-Stock

1+ parts

$6.070

100+ parts

$4.840

1k+ parts

$4.330

10k+ parts

-

80

$6.070

$4.840

$4.330

-

Element14

Singapore . 790 parts In-Stock

1+ parts

$6.604

100+ parts

$5.263

1k+ parts

$4.711

10k+ parts

-

790

$6.604

$5.263

$4.711

-

Newark

USA . 760 parts In-Stock

1+ parts

$7.250

100+ parts

$6.230

1k+ parts

$5.880

10k+ parts

-

760

$7.250

$6.230

$5.880

-

Flip Electronics (Authorized)

USA . 321,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

321,200

-

-

-

-

Rochester

USA . 65,426 parts In-Stock

1+ parts

-

100+ parts

$3.750

1k+ parts

$3.360

10k+ parts

$3.160

65,426

-

$3.750

$3.360

$3.160

Verical

USA . 669 parts In-Stock

1+ parts

-

100+ parts

$4.900

1k+ parts

$4.425

10k+ parts

-

669

-

$4.900

$4.425

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 986 parts In-Stock

1+ parts

$3.962

100+ parts

-

1k+ parts

-

10k+ parts

-

986

$3.962

-

-

-

Vyrian

USA . 619 parts In-Stock

1+ parts

$4.170

100+ parts

-

1k+ parts

-

10k+ parts

-

619

$4.170

-

-

-

Flip Electronics

USA . 42,135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

42,135

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Northwest PG Solutions

USA . 1,683 parts In-Stock

1+ parts

$3.227

100+ parts

-

1k+ parts

-

10k+ parts

-

1,683

$3.227

-

-

-

Corphita

USA . 180 parts In-Stock

1+ parts

$3.753

100+ parts

-

1k+ parts

-

10k+ parts

-

180

$3.753

-

-

-

Component Stockers USA

USA . 1,767 parts In-Stock

1+ parts

$5.840

100+ parts

$4.650

1k+ parts

-

10k+ parts

-

1,767

$5.840

$4.650

-

-

Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 18,960 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,960

-

-

-

-

Native Components

USA . 706 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.846

10k+ parts

-

706

-

-

$2.846

-

Overview

Unlock the power of reliable and high-performance memory with the CY15B104Q-PZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch FRAMs that offer unparalleled value to customers. With advanced features like synchronous operation and hardware/software write protection, this product is ideal for a variety of applications. Experience the benefits of fast data retention, low power consumption, and endurance of up to 1000000000000000 Write/Erase cycles. Trust Infineon Technologies to provide you with the quality and innovation you need for your memory storage needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and reliability of the product, making it suitable for various applications.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and control, enhancing the efficiency of data transfers.

Nominal Supply Voltage: 3.3V

This voltage level is commonly used in many electronic devices, making the product compatible with a wide range of applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures the product can perform reliably in different environmental conditions.

No. of Words: 524288 words

High word capacity allows for storing a large amount of data efficiently and effectively.

Technology: CMOS

CMOS technology provides low power consumption, increasing the energy efficiency of the product.

Memory IC Type: FRAM

FRAM technology offers fast read/write speeds, high endurance, and low power consumption, making it a reliable choice for memory applications.

Technical Specifications

FRAMs CY15B104Q-PZXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

Length:

9.779 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Maximum Seated Height:

4.572 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Write Protection:

HARDWARE/SOFTWARE

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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