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CY15E004Q-SXE

Infineon Technologies

CY15E004Q-SXE by Infineon Technologies

Infineon's CY15E004Q-SXE FRAM features 512x8 organization, 16MHz clock frequency, and 10000000000000 write/erase cycles. Ideal for automotive applications due to AEC-Q100 screening level, SPI serial bus type, and -40 to 125°C operating temperature range.

Median Price

$1.680

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 80 parts In-Stock

1+ parts

$1.630

100+ parts

$1.410

1k+ parts

$1.340

10k+ parts

-

80

$1.630

$1.410

$1.340

-

Chip1Stop

Japan . 485 parts In-Stock

1+ parts

$1.730

100+ parts

$1.500

1k+ parts

$1.190

10k+ parts

$1.100

485

$1.730

$1.500

$1.190

$1.100

DigiKey

USA . 664 parts In-Stock

1+ parts

$1.810

100+ parts

$1.568

1k+ parts

$1.448

10k+ parts

$1.360

664

$1.810

$1.568

$1.448

$1.360

Mouser Electronics

USA . 917 parts In-Stock

1+ parts

$2.200

100+ parts

$1.910

1k+ parts

$1.670

10k+ parts

$1.650

917

$2.200

$1.910

$1.670

$1.650

Flip Electronics (Authorized)

USA . 4,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,438

-

-

-

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Verical

USA . 485 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.500

10k+ parts

-

485

-

$1.530

$1.500

-

Rochester

USA . 184 parts In-Stock

1+ parts

-

100+ parts

$1.530

1k+ parts

$1.270

10k+ parts

$1.130

184

-

$1.530

$1.270

$1.130

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 788 parts In-Stock

1+ parts

$1.188

100+ parts

-

1k+ parts

-

10k+ parts

-

788

$1.188

-

-

-

Vyrian

USA . 580 parts In-Stock

1+ parts

$1.250

100+ parts

-

1k+ parts

-

10k+ parts

-

580

$1.250

-

-

-

Flip Electronics

USA . 4,438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,438

-

-

-

-

DigiKey Marketplace

USA . 236 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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236

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 94 parts In-Stock

1+ parts

$1.125

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$1.125

-

-

-

Component Stockers USA

USA . 1,371 parts In-Stock

1+ parts

$1.280

100+ parts

$1.530

1k+ parts

$1.430

10k+ parts

-

1,371

$1.280

$1.530

$1.430

-

Lixinc

USA . 16,611 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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16,611

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,192 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,192

-

-

-

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Alle Elektronik GmbH

Germany . 4,128 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,128

-

-

-

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Northwest PG Solutions

USA . 1,579 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,579

-

-

-

-

Native Components

USA . 562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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562

-

-

-

-

Overview

Experience the next level of reliability and performance with the CY15E004Q-SXE by Infineon Technologies. As a leading manufacturer in the industry, Infineon guarantees top-notch quality and innovation in their FRAMs category. This versatile product offers a wide range of applications, from automotive to industrial sectors. With its advanced features such as synchronous operation and hardware/software write protection, this FRAM delivers exceptional value and benefits to customers looking for a reliable memory solution. Trust Infineon to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FRAM, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Ensures high reliability and quality, making it suitable for automotive applications where harsh conditions may be present.

Operating Mode: SYNCHRONOUS

Enables synchronous operation with other components, enhancing performance and efficiency.

Nominal Supply Voltage: 5V

Compatible with standard voltage requirements in many electronic systems, ensuring easy integration.

No. of Terminals: 8

Provides necessary connectivity options while keeping the design simple and compact.

Package Style: SMALL OUTLINE

Compact package style saves space on the PCB and allows for high-density mounting.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, making it suitable for industrial and automotive applications.

Organization: 512X8

Offers a good balance of storage capacity and access speed for various applications.

Terminal Finish: PURE TIN

Provides good conductivity and corrosion resistance, ensuring reliable connections.

Write Protection: HARDWARE/SOFTWARE

Allows for flexible write protection options, enhancing data security and integrity.

Technology: CMOS

CMOS technology provides low power consumption and fast operation, making the FRAM energy-efficient and responsive.

Serial Bus Type: SPI

SPI interface offers high-speed communication and easy integration with various microcontrollers and systems.

Endurance: 10000000000000 Write/Erase Cycles

High endurance ensures long lifespan and reliable data storage, suitable for frequent read/write operations.

Technical Specifications

FRAMs CY15E004Q-SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

16 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15E004Q-SXE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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