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FM25V20A-DGQ

Infineon Technologies

FM25V20A-DGQ by Infineon Technologies

FM25V20A-DGQ by Infineon: 256KX8 FRAM with 3.3V, SPI interface, and 33MHz clock freq. Ideal for IoT devices due to low power consumption (3mA) and high endurance (100T cycles). Package style is small outline with dual terminals, suitable for compact designs.

Median Price

$18.500

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 170 parts In-Stock

1+ parts

$14.200

100+ parts

$10.960

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170

$14.200

$10.960

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Arrow

USA . 70 parts In-Stock

1+ parts

$17.772

100+ parts

$14.701

1k+ parts

$13.934

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70

$17.772

$14.701

$13.934

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$18.500

100+ parts

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20

$18.500

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Newark

USA . 191 parts In-Stock

1+ parts

$18.870

100+ parts

$14.900

1k+ parts

$14.270

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191

$18.870

$14.900

$14.270

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DigiKey

USA . 4,877 parts In-Stock

1+ parts

$20.550

100+ parts

$17.748

1k+ parts

$16.523

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-

4,877

$20.550

$17.748

$16.523

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Mouser Electronics

USA . 611 parts In-Stock

1+ parts

$20.550

100+ parts

$16.500

1k+ parts

$16.300

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611

$20.550

$16.500

$16.300

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Element14

Singapore . 1,030 parts In-Stock

1+ parts

$26.420

100+ parts

$22.260

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1,030

$26.420

$22.260

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Verical

USA . 76 parts In-Stock

1+ parts

-

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$13.440

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76

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$13.440

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Flip Electronics (Authorized)

USA . 76 parts In-Stock

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76

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Rochester

USA . 25 parts In-Stock

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-

100+ parts

$11.380

1k+ parts

$10.180

10k+ parts

$9.580

25

-

$11.380

$10.180

$9.580

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 803 parts In-Stock

1+ parts

$12.008

100+ parts

-

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803

$12.008

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$16.524

100+ parts

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100

$16.524

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Chip Stock

USA . 905 parts In-Stock

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905

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Vyrian

USA . 303 parts In-Stock

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303

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Prism Electronics

USA . 117 parts In-Stock

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117

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Flip Electronics

USA . 76 parts In-Stock

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76

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 306 parts In-Stock

1+ parts

$10.510

100+ parts

$10.247

1k+ parts

$10.195

10k+ parts

-

306

$10.510

$10.247

$10.195

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Ampacity Inc.

Singapore . 82 parts In-Stock

1+ parts

$10.510

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82

$10.510

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Corphita

USA . 237 parts In-Stock

1+ parts

$11.376

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237

$11.376

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Component Stockers USA

USA . 1,473 parts In-Stock

1+ parts

$13.830

100+ parts

$10.590

1k+ parts

$12.390

10k+ parts

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1,473

$13.830

$10.590

$12.390

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Continental Prestige Electronics

USA . 648 parts In-Stock

1+ parts

$14.100

100+ parts

$11.050

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648

$14.100

$11.050

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$48.204

100+ parts

$45.794

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$45.794

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900

$48.204

$45.794

$45.794

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A-Z Elektronik GmbH

Germany . 5,724 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,816 parts In-Stock

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3,816

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Argo Parts USA

USA . 1,416 parts In-Stock

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Perfect Parts

USA . 354 parts In-Stock

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Ashlea Components Ltd (Excess)

UK . 172 parts In-Stock

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172

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Overview

Discover the Infineon Technologies FM25V20A-DGQ, a cutting-edge FRAM memory solution that offers unparalleled quality and reliability. With a manufacturer known for their excellence in semiconductor technology, this product guarantees superior performance and endurance for various applications. From industrial automation to automotive systems, this FRAM memory device provides fast read/write speeds and low power consumption, making it ideal for demanding environments. Upgrade your products with the value and benefits of the FM25V20A-DGQ, ensuring optimal performance and longevity for your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FRAM, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount design allows for easy installation and integration into electronic devices, saving time and effort during production.

Package Shape: RECTANGULAR

The rectangular shape of the package ensures efficient use of space on PCBs, making it suitable for compact designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures precise and synchronized data transfer, making it ideal for applications requiring accurate timing.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage offers compatibility with a wide range of systems, providing flexibility in design and implementation.

No. of Terminals: 8

With 8 terminals, this FRAM offers multiple connection options for interfacing with other components, enhancing versatility.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style makes this FRAM suitable for space-constrained applications.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions, making it a robust choice.

Organization: 256KX8

The 256Kx8 organization provides ample memory capacity for storing data, making it suitable for memory-intensive applications.

Minimum Standby Voltage: 2 V

The low minimum standby voltage helps in reducing power consumption during idle periods, making it energy-efficient.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the FRAM to function in extreme cold conditions, making it suitable for outdoor applications.

Terminal Finish: PURE TIN

The pure tin terminal finish offers excellent conductivity and corrosion resistance, ensuring reliable connections in various environments.

Terminal Position: DUAL

The dual terminal position provides redundancy and flexibility in circuit design, enhancing reliability and ease of installation.

Write Protection: HARDWARE/SOFTWARE

The hardware/software write protection feature offers security for stored data, preventing unauthorized access or modification.

Maximum Seated Height: 0.8 mm

The low maximum seated height allows for slim and compact device designs, making it suitable for space-constrained applications.

Maximum Clock Frequency (fCLK): 33 MHz

The high maximum clock frequency enables fast data transfer rates, making it suitable for applications requiring high-speed performance.

Technical Specifications

FRAMs FM25V20A-DGQ attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

33 MHz

Minimum Data Retention Time:

11

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

6 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00025 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

FM25V20A-DGQ Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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