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CY15B102N-ZS60XAT

Infineon Technologies

CY15B102N-ZS60XAT by Infineon Technologies

Infineon's CY15B102N-ZS60XAT FRAM offers 128Kx16 organization, operates at 33MHz with 3.3V supply voltage. Ideal for applications requiring high endurance, such as industrial automation and automotive systems due to its 100000000000000 Write/Erase Cycles capability.

Median Price

$20.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 24,738 parts In-Stock

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DigiKey

USA . 7,866 parts In-Stock

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$20.250

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Distributors (In-Stock)

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Nova Conductors

Japan . 61 parts In-Stock

1+ parts

$27.685

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61

$27.685

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Vyrian

USA . 15,920 parts In-Stock

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Flip Electronics

USA . 9,606 parts In-Stock

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DigiKey Marketplace

USA . 5,866 parts In-Stock

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Digiode

USA . 50 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 15,852 parts In-Stock

1+ parts

$17.210

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Netroflash

USA . 2,000 parts In-Stock

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$27.685

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$27.131

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Continental Prestige Electronics

USA . 1,154 parts In-Stock

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$27.685

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Component Stockers USA

USA . 435 parts In-Stock

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$242.370

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Argo Parts USA

USA . 2,011 parts In-Stock

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Corphita

USA . 837 parts In-Stock

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Overview

Unlock the potential of your applications with the CY15B102N-ZS60XAT by Infineon Technologies. As a leading manufacturer in FRAMs, Infineon delivers unparalleled quality and reliability. This versatile product offers customers the value of high endurance with 100 quadrillion write/erase cycles, ensuring long-lasting performance. With a compact package style and synchronous operation, this FRAM is perfect for a wide range of industries. Experience the benefits of Infineon's cutting-edge technology and elevate your designs with the CY15B102N-ZS60XAT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Surface Mount: YES

This surface mount feature allows for easy installation and space-saving design, making it suitable for compact applications.

Package Shape: RECTANGULAR

The rectangular package shape offers a standardized form factor, ensuring compatibility with various systems and designs.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enables efficient synchronization with other components, enhancing overall system performance.

Nominal Supply Voltage: 3.3V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and power sources.

No. of Terminals: 44

With 44 terminals, this product offers versatile connectivity options for seamless integration into different circuits and interfaces.

Package Style: SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style saves space, making it suitable for applications with limited room for components.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows for reliable performance in various environmental conditions.

Organization: 128KX16

The 128KX16 organization provides ample memory capacity and efficient data storage for demanding applications.

Minimum Standby Voltage: 2V

The low minimum standby voltage of 2V helps conserve power during idle periods, extending battery life in portable devices.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers high conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position provides flexibility in circuit layout and connectivity options, making it versatile for various applications.

Maximum Seated Height: 1.194 mm

The maximum seated height of 1.194 mm allows for a low-profile design, ideal for space-constrained applications.

Maximum Clock Frequency (fCLK): 33 MHz

The high maximum clock frequency of 33 MHz enables fast data processing and efficient operation in high-speed applications.

Width: 10.16 mm

The width of 10.16 mm offers a compact form factor, suitable for integration into small electronic devices and systems.

Minimum Supply Voltage: 2V

The low minimum supply voltage of 2V ensures compatibility with a wide range of power sources and systems, enhancing flexibility.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for easy and reliable soldering during component assembly.

Length: 18.415 mm

The length of 18.415 mm provides a balanced size for easy integration into various electronic designs and systems.

Technology: CMOS

The CMOS technology offers low power consumption and high reliability, making this product energy-efficient and durable.

Parallel or Serial: PARALLEL

The parallel data transfer mode offers fast and efficient communication between the memory and other components in the system.

Terminal Form: GULL WING

The gull wing terminal form provides secure connectivity and easy soldering, ensuring robust electrical connections in the circuit.

Maximum Supply Current: 12 mA

The maximum supply current of 12 mA ensures stable operation and power efficiency, making it suitable for battery-powered devices.

No. of Words: 131072 words

With 131072 words of memory capacity, this product offers ample storage space for data-intensive applications.

Memory Width: 16

The memory width of 16 bits allows for efficient data processing and storage, suitable for a wide range of applications.

Minimum Data Retention Time: 10

The minimum data retention time of 10 years ensures long-term data integrity and reliability, making it ideal for critical data storage applications.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch offers precise connectivity and easy layout, enabling efficient circuit design and assembly.

No. of Words Code: 128K

The 128K words code provides a standardized format for efficient data handling and compatibility with various systems.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates a moderate sensitivity to moisture, ensuring reliability in typical operating environments.

Maximum Supply Voltage: 3.6V

The maximum supply voltage of 3.6V allows for compatibility with a wide range of power sources, enhancing flexibility in system design.

Endurance: 100000000000000 Write/Erase Cycles

The high endurance of 100000000000000 write/erase cycles ensures long-term reliability and durability, ideal for frequent data updates.

Memory Density: 2097152 bit

With a memory density of 2097152 bits, this product offers ample storage capacity for diverse data requirements in modern applications.

Memory IC Type: FRAM

The FRAM memory IC type combines the benefits of non-volatile memory with fast write speeds, offering a reliable and efficient data storage solution.

Maximum Standby Current: 0.00025 Amp

The low maximum standby current of 0.00025 Amp helps conserve power during idle periods, extending battery life in energy-efficient devices.

Maximum Access Time: 70 ns

The fast maximum access time of 70 ns enables quick data retrieval and efficient operation in time-sensitive applications.

Technical Specifications

FRAMs CY15B102N-ZS60XAT attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

70 ns

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

33 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e4

Length:

18.415 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.194 mm

Maximum Standby Current:

.00025 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

CY15B102N-ZS60XAT Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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