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CY15B016Q-SXET

Infineon Technologies

CY15B016Q-SXET by Infineon Technologies

Infineon's CY15B016Q-SXET FRAM offers 2Kx8 organization, operates at 16MHz clock frequency, and has a memory density of 16384 bit. Ideal for automotive applications due to AEC-Q100 screening level, SPI serial bus type, and endurance of 10^13 write/erase cycles.

Median Price

$1.904

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 10,282 parts In-Stock

1+ parts

$2.020

100+ parts

$1.752

1k+ parts

$1.615

10k+ parts

-

10,282

$2.020

$1.752

$1.615

-

Mouser Electronics

USA . 6,960 parts In-Stock

1+ parts

$2.020

100+ parts

$1.760

1k+ parts

$1.620

10k+ parts

$1.300

6,960

$2.020

$1.760

$1.620

$1.300

Newark

USA . 2,481 parts In-Stock

1+ parts

$2.140

100+ parts

$1.760

1k+ parts

$1.620

10k+ parts

-

2,481

$2.140

$1.760

$1.620

-

Chip1Stop

Japan . 2,186 parts In-Stock

1+ parts

$2.880

100+ parts

$1.620

1k+ parts

$1.370

10k+ parts

$1.170

2,186

$2.880

$1.620

$1.370

$1.170

Verical

USA . 62,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.529

62,500

-

-

-

$1.529

Arrow

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.191

5,000

-

-

-

$1.191

Rochester

USA . 1,078 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.160

10k+ parts

$1.100

1,078

-

$1.300

$1.160

$1.100

RS (Exports)

UK . 100 parts In-Stock

1+ parts

-

100+ parts

$1.789

1k+ parts

$1.612

10k+ parts

-

100

-

$1.789

$1.612

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 594 parts In-Stock

1+ parts

$1.206

100+ parts

-

1k+ parts

-

10k+ parts

-

594

$1.206

-

-

-

Digiode

USA . 609 parts In-Stock

1+ parts

$1.776

100+ parts

-

1k+ parts

-

10k+ parts

-

609

$1.776

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 217 parts In-Stock

1+ parts

$0.912

100+ parts

-

1k+ parts

-

10k+ parts

-

217

$0.912

-

-

-

Northwest PG Solutions

USA . 358 parts In-Stock

1+ parts

$1.004

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$1.004

-

-

-

Corphita

USA . 289 parts In-Stock

1+ parts

$1.683

100+ parts

-

1k+ parts

-

10k+ parts

-

289

$1.683

-

-

-

Futuretech Components

Singapore . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Glotronic Ltd.

UK . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,000

-

-

-

-

Authorized Procurement Solutions

USA . 6,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,500

-

-

-

-

S.R.D Solutions

India . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 3,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,025

-

-

-

-

Overview

Unlock the power of reliable and high-performance memory storage with the CY15B016Q-SXET by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality FRAMs that offer unparalleled durability and efficiency. Ideal for a wide range of applications, this product provides customers with a cost-effective solution that ensures seamless operation and data protection. With its advanced technology and innovative features, the CY15B016Q-SXET guarantees optimal performance, making it the perfect choice for your memory storage needs. Experience the benefits of Infineon's cutting-edge products and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the FRAM, ensuring its longevity and reliability in various operating conditions.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient communication and data transfer within the FRAM, enabling high-speed performance and responsiveness.

Nominal Supply Voltage: 3.3V

Stable supply voltage of 3.3V ensures consistent and reliable power to the FRAM, optimizing its performance and reducing the risk of errors.

Memory Density: 16384 bit

High memory density of 16384 bit allows for storing a large amount of data in the FRAM, making it suitable for applications requiring a significant amount of memory storage.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures the FRAM can operate effectively in a wide range of temperature environments without compromising performance.

Endurance: 10000000000000 Write/Erase Cycles

Exceptional endurance of 10000000000000 write/erase cycles ensures longevity and reliability of the FRAM, making it a durable and long-lasting storage solution.

Serial Bus Type: SPI

Serial Peripheral Interface (SPI) allows for easy integration and communication with other devices, enhancing the versatility and compatibility of the FRAM.

Technical Specifications

FRAMs CY15B016Q-SXET attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

16 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

2KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00002 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B016Q-SXET Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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