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CY15B108QI-20LPXIT

Infineon Technologies

CY15B108QI-20LPXIT by Infineon Technologies

Infineon CY15B108QI-20LPXIT is a 1MX8 FRAM with 20MHz clock frequency, SPI interface, and 1.8V supply voltage. Ideal for applications requiring high endurance, fast data retention, and low standby current consumption in compact designs.

Median Price

$23.210

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 12,573 parts In-Stock

1+ parts

-

100+ parts

$19.516

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12,573

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$19.516

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DigiKey

USA . 6,000 parts In-Stock

1+ parts

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$31.440

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6,000

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$31.440

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Flip Electronics (Authorized)

USA . 6,000 parts In-Stock

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6,000

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Rochester

USA . 1,971 parts In-Stock

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100+ parts

$23.210

1k+ parts

$20.770

10k+ parts

$19.540

1,971

-

$23.210

$20.770

$19.540

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 205 parts In-Stock

1+ parts

$31.440

100+ parts

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205

$31.440

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DigiKey Marketplace

USA . 13,596 parts In-Stock

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13,596

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Flip Electronics

USA . 6,000 parts In-Stock

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Digiode

USA . 956 parts In-Stock

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956

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,580 parts In-Stock

1+ parts

$26.720

100+ parts

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5,580

$26.720

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Microchip USA

USA . 4,121 parts In-Stock

1+ parts

$56.775

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4,121

$56.775

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Corphita

USA . 457 parts In-Stock

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457

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Experience unparalleled reliability and performance with the CY15B108QI-20LPXIT by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality FRAMs that provide exceptional value and benefits to customers. Whether you're looking for high-speed data logging, industrial automation, or IoT applications, this product offers unmatched endurance with 1 quadrillion write/erase cycles. Trust Infineon Technologies for cutting-edge technology and superior memory solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the FRAM, ensuring reliable performance.

Surface Mount: YES

Being surface mountable makes the FRAM easy to integrate into circuit boards, saving space and simplifying the assembly process.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for efficient data transfer and processing, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage helps in reducing power consumption and is suitable for battery-operated devices.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The compact and thin profile of the package saves space on PCBs, making it ideal for applications with size constraints.

Maximum Operating Temperature: 85 °C

With a high operating temperature range, this FRAM can withstand extreme environmental conditions, ensuring reliability in various applications.

Memory Width: 8

The memory width of 8 bits allows for efficient data storage and retrieval, making the FRAM suitable for a wide range of applications.

Serial Bus Type: SPI

The Serial Peripheral Interface (SPI) bus type offers high-speed data transfer and communication, enhancing the overall performance of the FRAM.

Technical Specifications

FRAMs CY15B108QI-20LPXIT attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.2,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00011 Amp

Minimum Standby Voltage:

1.71 V

Maximum Supply Current:

1.75 mA

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B108QI-20LPXIT Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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