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CY15B104QN-50LPXI

Infineon Technologies

CY15B104QN-50LPXI by Infineon Technologies

CY15B104QN-50LPXI by Infineon Technologies is a FRAM with 512KX8 organization, operating at 50 MHz clock frequency. It has a memory density of 4194304 bit and offers 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage in compact devices.

Median Price

$18.428

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 2,940 parts In-Stock

1+ parts

-

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2,940

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-

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Rochester

USA . 887 parts In-Stock

1+ parts

-

100+ parts

$16.380

1k+ parts

$14.650

10k+ parts

$13.790

887

-

$16.380

$14.650

$13.790

Verical

USA . 521 parts In-Stock

1+ parts

-

100+ parts

$20.475

1k+ parts

$18.313

10k+ parts

$17.238

521

-

$20.475

$18.313

$17.238

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 615 parts In-Stock

1+ parts

$22.676

100+ parts

-

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615

$22.676

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-

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$22.925

100+ parts

-

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450

$22.925

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-

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Flip Electronics

USA . 1,960 parts In-Stock

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1,960

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Vyrian

USA . 1,357 parts In-Stock

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1,357

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Rutronik

Germany . 68 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$22.450

10k+ parts

-

68

-

-

$22.450

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,657 parts In-Stock

1+ parts

$20.290

100+ parts

-

1k+ parts

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10k+ parts

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1,657

$20.290

-

-

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Corphita

USA . 257 parts In-Stock

1+ parts

$21.483

100+ parts

-

1k+ parts

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257

$21.483

-

-

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Continental Prestige Electronics

USA . 6,166 parts In-Stock

1+ parts

$22.925

100+ parts

-

1k+ parts

-

10k+ parts

$22.466

6,166

$22.925

-

-

$22.466

Argo Parts USA

USA . 4,079 parts In-Stock

1+ parts

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4,079

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$22.466

1k+ parts

$21.779

10k+ parts

$21.320

100

-

$22.466

$21.779

$21.320

Overview

Unlock the power of cutting-edge technology with the CY15B104QN-50LPXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality FRAMs that offer unparalleled performance and reliability. Ideal for applications requiring high endurance and fast write speeds, this product provides customers with a cost-effective solution that maximizes efficiency and productivity. Say goodbye to data loss and hello to seamless operation with the CY15B104QN-50LPXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy integration onto circuit boards, saving space and simplifying assembly.

Operating Mode: SYNCHRONOUS

Enables synchronous data transfer, resulting in faster and more efficient operation.

Nominal Supply Voltage: 3V

Compatible with a standard voltage level, making it easy to power using common power sources.

Package Style: SMALL OUTLINE, VERY THIN PROFILE

Ideal for applications with space constraints, allowing for compact and efficient designs.

Technology: CMOS

Utilizes low-power CMOS technology for efficient operation and minimal power consumption.

Memory IC Type: FRAM

Utilizes Ferroelectric Random Access Memory technology, offering high speed read/write operations and non-volatility.

Technical Specifications

FRAMs CY15B104QN-50LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Minimum Standby Voltage:

3 V

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104QN-50LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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