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FM28V020-TG

Infineon Technologies

FM28V020-TG by Infineon Technologies

FRAM; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; Terminal Pitch: .5 mm; Length: 11.8 mm;

Median Price

$10.114

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 246 parts In-Stock

1+ parts

$9.227

100+ parts

$7.713

1k+ parts

-

10k+ parts

-

246

$9.227

$7.713

-

-

Chip1Stop

Japan . 297 parts In-Stock

1+ parts

$11.000

100+ parts

-

1k+ parts

-

10k+ parts

-

297

$11.000

-

-

-

Mouser Electronics

USA . 504 parts In-Stock

1+ parts

$12.860

100+ parts

$10.690

1k+ parts

$10.410

10k+ parts

-

504

$12.860

$10.690

$10.410

-

DigiKey

USA . 307 parts In-Stock

1+ parts

$12.860

100+ parts

$11.298

1k+ parts

$10.262

10k+ parts

-

307

$12.860

$11.298

$10.262

-

Flip Electronics (Authorized)

USA . 16,932 parts In-Stock

1+ parts

-

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-

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16,932

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-

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Verical

USA . 12,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$5.516

10k+ parts

-

12,720

-

-

$5.516

-

Rochester

USA . 1,798 parts In-Stock

1+ parts

-

100+ parts

$6.990

1k+ parts

$6.260

10k+ parts

$5.890

1,798

-

$6.990

$6.260

$5.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 88 parts In-Stock

1+ parts

$5.672

100+ parts

-

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-

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88

$5.672

-

-

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Vyrian

USA . 190 parts In-Stock

1+ parts

$5.970

100+ parts

-

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-

10k+ parts

-

190

$5.970

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-

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Flip Electronics

USA . 12,720 parts In-Stock

1+ parts

-

100+ parts

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12,720

-

-

-

-

Chip Stock

USA . 7,500 parts In-Stock

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-

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7,500

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-

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Bristol Electronics

USA . 2,557 parts In-Stock

1+ parts

-

100+ parts

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2,557

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Classic Components Corporation

USA . 107 parts In-Stock

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107

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Benley Electronics

USA . 3 parts In-Stock

1+ parts

$2.000

100+ parts

-

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3

$2.000

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Corphita

USA . 727 parts In-Stock

1+ parts

$5.373

100+ parts

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727

$5.373

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Component Stockers USA

USA . 1,694 parts In-Stock

1+ parts

$7.980

100+ parts

$7.500

1k+ parts

-

10k+ parts

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1,694

$7.980

$7.500

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-

Native Components

USA . 889 parts In-Stock

1+ parts

$621.710

100+ parts

$609.276

1k+ parts

$603.059

10k+ parts

$596.842

889

$621.710

$609.276

$603.059

$596.842

Northwest PG Solutions

USA . 1,489 parts In-Stock

1+ parts

$683.881

100+ parts

-

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1,489

$683.881

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QUARKTWIN TECHNOLOGY LTD

USA . 18,505 parts In-Stock

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18,505

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A-Z Elektronik GmbH

Germany . 7,320 parts In-Stock

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7,320

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Alle Elektronik GmbH

Germany . 4,880 parts In-Stock

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-

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4,880

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

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4,500

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RC Electronics

USA . 2,958 parts In-Stock

1+ parts

-

100+ parts

$10.000

1k+ parts

$9.120

10k+ parts

$8.850

2,958

-

$10.000

$9.120

$8.850

Perfect Parts

USA . 745 parts In-Stock

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745

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Technical Specifications

FRAMs FM28V020-TG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

140 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G32

Length:

11.8 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.53,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00015 Amp

Minimum Standby Voltage:

2 V

Maximum Supply Current:

8 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

8 mm

Trade Compliance

FM28V020-TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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