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FM22L16-55-TGTR

Infineon Technologies

FM22L16-55-TGTR by Infineon Technologies

Infineon's FM22L16-55-TGTR FRAM offers 256Kx16 organization, operates at 3.3V with 100 trillion write/erase cycles. Ideal for applications requiring high endurance and fast access times in a compact package.

Median Price

$33.600

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 638 parts In-Stock

1+ parts

$47.040

100+ parts

$40.011

1k+ parts

$36.723

10k+ parts

-

638

$47.040

$40.011

$36.723

-

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$26.880

1k+ parts

$24.050

10k+ parts

$22.630

4,000

-

$26.880

$24.050

$22.630

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$33.600

1k+ parts

$30.063

10k+ parts

$28.288

4,000

-

$33.600

$30.063

$28.288

Flip Electronics (Authorized)

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,310

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 324 parts In-Stock

1+ parts

$37.981

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$37.981

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$42.160

100+ parts

-

1k+ parts

-

10k+ parts

-

600

$42.160

-

-

-

Vyrian

USA . 3,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,184

-

-

-

-

Flip Electronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

NAC Semi

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$54.590

10k+ parts

-

1,000

-

-

$54.590

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 3,034 parts In-Stock

1+ parts

$20.310

100+ parts

$19.802

1k+ parts

$19.701

10k+ parts

-

3,034

$20.310

$19.802

$19.701

-

Ampacity Inc.

Singapore . 3,279 parts In-Stock

1+ parts

$22.410

100+ parts

-

1k+ parts

-

10k+ parts

-

3,279

$22.410

-

-

-

Corphita

USA . 625 parts In-Stock

1+ parts

$35.982

100+ parts

-

1k+ parts

-

10k+ parts

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625

$35.982

-

-

-

Continental Prestige Electronics

USA . 750 parts In-Stock

1+ parts

$42.160

100+ parts

-

1k+ parts

-

10k+ parts

$41.317

750

$42.160

-

-

$41.317

Netroflash

USA . 500 parts In-Stock

1+ parts

$42.160

100+ parts

-

1k+ parts

$40.052

10k+ parts

$39.209

500

$42.160

-

$40.052

$39.209

Component Stockers USA

USA . 6,756 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$26.260

10k+ parts

-

6,756

-

-

$26.260

-

Authorized Procurement Solutions

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

-

Argo Parts USA

USA . 2,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,680

-

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,240

-

-

-

-

Kepictronics

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Advanced Electronics

New Zealand . 55 parts In-Stock

1+ parts

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100+ parts

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55

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Overview

Unlock the power of innovative memory solutions with the FM22L16-55-TGTR by Infineon Technologies. Built with top-quality materials and advanced technology, this FRAM offers unparalleled data retention and endurance, making it ideal for a wide range of applications. From automotive to industrial use, this product guarantees reliable performance under extreme conditions. Elevate your projects with the superior value, benefits, and advantages that only Infineon Technologies can provide. Trust in our expertise and experience to take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material makes the product lightweight and durable, ideal for portable devices.

Nominal Supply Voltage / Vsup: 3.3V

The 3.3V supply voltage ensures compatibility with a wide range of systems and provides stable operation.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for efficient data transfers and multitasking capabilities.

Organization: 256KX16

The 256KX16 organization provides ample memory capacity for storing data and running applications smoothly.

Technology: CMOS

The CMOS technology offers low power consumption and high speed performance, making it energy efficient.

Endurance: 100000000000000 Write/Erase Cycles

The high endurance of 100000000000000 write/erase cycles ensures reliability and longevity of the product.

Technical Specifications

FRAMs FM22L16-55-TGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

110 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00027 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

FM22L16-55-TGTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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