Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
FM24C64B-GTR by Infineon Technologies is an 8KX8 FRAM with 65536 bit memory density. It operates at 5V, has a clock frequency of 1 MHz, and offers 100000000000000 write/erase cycles. Ideal for applications requiring high endurance non-volatile memory in small outline packages.
Median Price
$3.112
Lifecycle Status
Suppliers In-Stock
31
In-Stock Inventory
1k+
Bürklin Elektronik
1+ parts
$2.810
100+ parts
$2.290
1k+ parts
$2.070
10k+ parts
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Chip1Stop
$3.160
$2.780
Newark
$3.580
$3.100
$2.940
Mouser Electronics
$3.810
$3.290
$3.030
$2.930
Element14
$3.857
$3.052
$2.792
Farnell
$4.208
$2.969
$2.853
Arrow
$1.567
Flip Electronics (Authorized)
Rochester
$1.810
$1.620
$1.530
Verical
$2.025
$1.913
DigiKey
$3.064
Digiode
$1.378
SOS electronic
$2.187
$1.725
$1.659
Nova Conductors
$3.130
Bristol Electronics
$7.296
$3.429
Chip Stock
Flip Electronics
Vyrian
Cyclops Electronics Ltd
IBS Electronics
$1.742
Schukat
$1.065
$1.011
Rutronik
$2.260
NAC Semi
$3.760
LIBRA Elektronik GmbH
ACDS - Activité Composants Distribution Service
Holdelec - ElecDif-Pro
Amalfi Trading
Micros
$1.673
$1.622
ComSIT Distribution GmbH
Partservice
$1.631
$1.582
Micros sp.j. W. Kędra i J. Lic
$1.590
Corphita
$1.305
CoreStaff
$2.860
$2.530
Continental Prestige Electronics
$2.050
Argo Parts USA
Advanced Electronics
$3.341
$3.074
$2.880
Component Stockers USA
$3.500
$2.750
Glotronic Ltd.
QUARKTWIN TECHNOLOGY LTD
Perfect Parts
Eastek
Lixinc
Kepictronics
Authorized Procurement Solutions
GreenTree Electronics
S.R.D Solutions
Metaverse IC Inc.
iodParts Technologies Inc.
Robosynatics
$0.013
Lucentia Tech
ChipstoGo Electronic ltd
PLASTIC/EPOXY - This durable material enhances the product's longevity and reliability.
YES - Allows for easy and efficient installation on circuit boards.
RECTANGULAR - Provides a standard shape for compatibility with various systems.
SYNCHRONOUS - Ensures precise and coordinated operations for optimal performance.
5 - Offers a stable power supply for consistent functionality.
5 - Compatible with standard power sources for seamless integration.
8 - Provides sufficient connectivity options for versatile applications.
SMALL OUTLINE - Enables space-saving installation in compact devices.
85 °C - Allows for reliable operation in a range of environmental conditions.
8KX8 - Organized memory structure for efficient data storage and retrieval.
40 °C - Ensures operation in harsh temperature conditions.
PURE TIN - Corrosion-resistant finish for long-lasting performance.
DUAL - Provides flexibility in board placement for convenient integration.
HARDWARE - Offers added security for data integrity.
1.727 mm - Low-profile design for space-efficient assembly.
1 MHz - Supports high-speed data transfer for quick processing.
3.8985 mm - Compact dimensions for easy fitting into tight spaces.
4.5 V - Allows for operation with lower power sources if needed.
30 - Resistant to heat exposure during assembly processes.
260 - Withstands high temperatures for manufacturing without damage.
4.889 mm - Balanced dimensions for a streamlined design.
CMOS - Ensures low power consumption for energy efficiency.
SERIAL - Enables efficient data transfer in a sequential manner.
GULL WING - Secure terminal design for stable connections.
0.4 mA - Low power consumption for energy-efficient operation.
8192 words - Offers ample memory capacity for data storage.
8 - Supports data transfer and processing in 8-bit units.
10 - Retains data reliably for extended periods.
1.27 mm - Standard pitch for compatibility with various systems.
8K - Indicates the capacity of the memory in a standardized code.
3 - Resistant to moisture for reliable performance in various environments.
5.5 V - Safely operates within standard voltage limits.
100000000000000 Write/Erase Cycles - High endurance for prolonged use without degradation.
I2C - Supports communication via a widely used serial bus protocol.
65536 bit - Offers a high-density memory for storing large amounts of data.
FRAM - Utilizes Ferroelectric RAM technology for fast and reliable data storage.
0.00001 Amp - Ultra-low standby current for energy-efficient standby mode.
FRAMs FM24C64B-GTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Additional Features:
Maximum Clock Frequency (fCLK):
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
Maximum Seated Height:
Serial Bus Type:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Write Protection:
FM24C64B-GTR Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
MC33269T-3.3G
Onsemi
MC33269T-3.3G by Onsemi is a fixed positive single output LDO regulator with a max output current of 0.8 A and a dropout voltage of 1.35 V. It is commonly used in applications that require stable voltage regulation, such as power supplies for electronic devices.
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
SS14
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
2N7002
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
Diotec Semiconductor Ag
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; Maximum Time At Peak Reflow Temperature (s): 10;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
LM317T
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; JESD-30 Code: R-PSFM-T3; Adjustability: ADJUSTABLE; Package Equivalence Code: SIP3,.1TB;
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
NUP2105LT1G
NUP2105LT1G by Onsemi is a Transient Suppression Device with 350W power dissipation, 29.1V breakdown voltage, and 44V clamping voltage. Commonly used in electronic circuits for surge protection due to its bidirectional polarity and silicon diode element material.
NE555DR
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
MB85RC64APNF-G-JNE1
Fujitsu
Fujitsu's MB85RC64APNF-G-JNE1 FRAM features 8KX8 organization, 1MHz clock frequency, and 1000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with serial bus type I2C communication in a small outline package.
FM25W64-G
Infineon Technologies
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 20 MHz; Maximum Standby Current: .00001 Amp;
FM24CL64B-DG
Ramtron International
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Functions: 1; JESD-30 Code: R-PDSO-N8;
CY15B064Q-SXET
CY15B064Q-SXET by Infineon Technologies is a FRAM with 8Kx8 organization, operating at 3.3V. It has a max clock frequency of 16MHz and offers 10000000000000 write/erase cycles. This FRAM is commonly used in applications requiring high endurance and non-volatile memory storage.
MB85RS64VPNF-G-JNE1
Fujitsu's MB85RS64VPNF-G-JNE1 FRAM offers 8KX8 organization, operates at 3.3V with 20MHz clock frequency for applications requiring high endurance like IoT devices. It features SPI serial bus, 1000000000000 write/erase cycles, and compact small outline package suitable for space-constrained designs.
FM24V05-G
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; Memory Width: 8;
FM25L16B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Supply Voltage (Vsup): 2.7 V; Write Protection: HARDWARE/SOFTWARE;
FM22L16-55-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
CY15B256J-SXE
CY15B256J-SXE by Infineon Technologies is a FRAM with 32KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 262144 bit and offers 10000000000000 Write/Erase Cycles endurance. Ideal for applications requiring high-speed synchronous operation in automotive electronics due to AEC-Q100 screening level and small outline package style.
FM25V01A-G
FM25V01A-G by Infineon Technologies is a 16KX8 FRAM with SPI interface, 40 MHz clock frequency, and 3.3 V supply voltage. Ideal for applications requiring high endurance, such as industrial automation and IoT devices due to its 100000000000000 write/erase cycles capability.
FM25L04B-DG
FM25L04B-DG by Infineon Technologies is a FRAM with 512x8 organization, SPI serial bus type, and 20 MHz clock frequency. It operates at -40 to 85 °C, has 3 mA max supply current, and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data transfer and low power consumption in compact designs.
MB85RS128APNF-G-JNE1
Fujitsu Semiconductor America
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 10000000000 Write/Erase Cycles; No. of Words Code: 16K;
FM25H20-DG
FM25H20-DG by Cypress Semiconductor is a 256KX8 FRAM with a synchronous operating mode and a max clock frequency of 40 MHz. It is commonly used in applications that require high endurance, such as data logging and real-time data storage.
FM24CL16B-DGTR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.65 V; JESD-30 Code: R-PDSO-N8;
MB85R256FPFCN-G-BNDE1
FRAM; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP28,.53,22; Surface Mount: YES;
FM28V020-SGTR
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Terminal Form: GULL WING;
CY15B256Q-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; Width: 3.8985 mm;
CY15V104QN-20LPXIT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Standby Current: .000065 Amp; JESD-609 Code: e4;
FM24CL64-GTR
FM24CL64-GTR by Ramtron International is an 8KX8 FRAM with 3V supply, operating at -40 to 85 °C. It features I2C serial bus, synchronous mode, and hardware write protection. Ideal for applications requiring fast non-volatile memory with low standby current.
FM25V02A-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 32KX8; Maximum Time At Peak Reflow Temperature (s): 30;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FM24CL64B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; Terminal Position: DUAL;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.65 V; Package Body Material: PLASTIC/EPOXY;
FM24CL64B-GTR by Infineon Technologies is a FRAM memory IC with 8Kx8 organization and 65536-bit memory density. It operates in synchronous mode with a max clock frequency of 1 MHz. This small outline package is suitable for applications requiring high endurance, such as industrial automation and automotive systems.
FM24CL64B-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.727 mm; Terminal Form: GULL WING;
Infineon Technologies' FM24CL64B-G is a FRAM with 8KX8 organization, operating at 3.3V, featuring 8192 words and 65536-bit memory density. It offers synchronous operation, hardware write protection, and serial bus type I2C. Ideal for applications requiring high endurance with up to 100T write/erase cycles in a small outline package style.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; Minimum Standby Voltage: 2.7 V;
FM24W256-GTR
Infineon's FM24W256-GTR FRAM offers 32Kx8 organization, operates at 1MHz clock frequency, and has a memory density of 262144 bits. Ideal for applications requiring high endurance with 100T write/erase cycles, such as IoT devices and industrial automation systems.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Minimum Supply Voltage (Vsup): 2.7 V;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP8,.25; Maximum Time At Peak Reflow Temperature (s): 30;
FM24CL16B-GTR
FM24CL16B-GTR by Infineon Technologies is a FRAM with 2Kx8 organization, operating at 3.3V. It offers synchronous operation, 1MHz clock frequency, and 100 trillion write/erase cycles. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Width: 3.9 mm; Maximum Standby Current: .000006 Amp;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Serial Bus Type: I2C;
FM24CL04B-GTR
Infineon's FM24CL04B-GTR is a FRAM with 512x8 organization, operates at 3.3V, and has a clock frequency of 1MHz. Ideal for applications requiring high endurance, such as IoT devices or industrial sensors due to its low standby current and write/erase cycles.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 512X8; Package Body Material: PLASTIC/EPOXY;
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm; Maximum Supply Current: .3 mA;
FM24W256-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Serial Bus Type: I2C; Moisture Sensitivity Level (MSL): 1;
FM24W256-G by Infineon Technologies is a FRAM memory IC with 32KX8 organization, operating at 3.3V. It features a max clock frequency of 1 MHz and offers high endurance with 100T write/erase cycles. Ideal for applications requiring fast and reliable non-volatile memory storage in compact electronic devices.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Minimum Operating Temperature: -40 Cel;
FM24V10-GTR
Infineon's FM24V10-GTR is a FRAM with 128KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 1048576 bit and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Position: DUAL; Write Protection: HARDWARE;
Supply Digital Components
$106.00
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12,000 In-Stock
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