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CY15B104QSN-108LPXI

Infineon Technologies

CY15B104QSN-108LPXI by Infineon Technologies

Infineon CY15B104QSN-108LPXI is a FRAM with 512KX8 organization, operating at 108 MHz clock frequency. It offers 100000000000000 write/erase cycles endurance and uses SPI serial bus type. Ideal for applications requiring high-speed data storage with low power consumption and small footprint.

Median Price

$27.000

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 367 parts In-Stock

1+ parts

$27.000

100+ parts

-

1k+ parts

-

10k+ parts

-

367

$27.000

-

-

-

DigiKey

USA . 94 parts In-Stock

1+ parts

$27.140

100+ parts

$23.126

1k+ parts

-

10k+ parts

-

94

$27.140

$23.126

-

-

Mouser Electronics

USA . 43 parts In-Stock

1+ parts

$27.140

100+ parts

$23.130

1k+ parts

-

10k+ parts

-

43

$27.140

$23.130

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-

Verical

USA . 7,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$15.148

10k+ parts

-

7,840

-

-

$15.148

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Flip Electronics (Authorized)

USA . 7,840 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,840

-

-

-

-

Rochester

USA . 5,039 parts In-Stock

1+ parts

-

100+ parts

$18.010

1k+ parts

$16.120

10k+ parts

$15.170

5,039

-

$18.010

$16.120

$15.170

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 341 parts In-Stock

1+ parts

$19.010

100+ parts

-

1k+ parts

-

10k+ parts

-

341

$19.010

-

-

-

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$21.610

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$21.610

-

-

-

Flip Electronics

USA . 12,200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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12,200

-

-

-

-

Vyrian

USA . 1,557 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,557

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,628 parts In-Stock

1+ parts

$17.010

100+ parts

-

1k+ parts

-

10k+ parts

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1,628

$17.010

-

-

-

Corphita

USA . 604 parts In-Stock

1+ parts

$18.009

100+ parts

-

1k+ parts

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10k+ parts

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604

$18.009

-

-

-

Continental Prestige Electronics

USA . 4,460 parts In-Stock

1+ parts

$21.610

100+ parts

-

1k+ parts

-

10k+ parts

$21.178

4,460

$21.610

-

-

$21.178

Argo Parts USA

USA . 4,774 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,774

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

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Overview

Unlock the power of reliable and efficient data storage with the CY15B104QSN-108LPXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-notch quality FRAMs that provide unparalleled performance and durability. Ideal for a variety of applications, this FRAM offers customers the value of high-speed operation, low power consumption, and enhanced security features. Say goodbye to data loss worries and hello to seamless functionality with the CY15B104QSN-108LPXI.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package ensures durability and protection for the internal components of the FRAM, making it a reliable choice for long-term use.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V allows for compatibility with a wide range of systems and applications, providing flexibility in the usage of the FRAM.

Write Protection: HARDWARE/SOFTWARE

Having both hardware and software write protection ensures that the data stored in the FRAM is secure from accidental or unauthorized modifications, enhancing data integrity.

Memory Density: 4194304 bit

With a high memory density of 4194304 bits, this FRAM can store a large amount of data efficiently, making it suitable for applications requiring extensive data storage.

Maximum Clock Frequency (fCLK): 108 MHz

The high maximum clock frequency of 108 MHz allows for fast data transfer and processing speeds, enabling swift and efficient operation of the FRAM in high-performance systems.

Technical Specifications

FRAMs CY15B104QSN-108LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

108 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00035 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

21 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B104QSN-108LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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