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FM25L04B-DG

Infineon Technologies

FM25L04B-DG by Infineon Technologies

FM25L04B-DG by Infineon Technologies is a FRAM with 512x8 organization, SPI serial bus type, and 20 MHz clock frequency. It operates at -40 to 85 °C, has 3 mA max supply current, and offers 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data transfer and low power consumption in compact designs.

Median Price

$1.668

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 1,696 parts In-Stock

1+ parts

$1.150

100+ parts

$1.150

1k+ parts

$1.150

10k+ parts

$1.150

1,696

$1.150

$1.150

$1.150

$1.150

Chip1Stop

Japan . 4 parts In-Stock

1+ parts

$1.550

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$1.550

-

-

-

Arrow

USA . 1,977 parts In-Stock

1+ parts

$1.786

100+ parts

$1.541

1k+ parts

$1.492

10k+ parts

$1.272

1,977

$1.786

$1.541

$1.492

$1.272

Element14

Singapore . 1,565 parts In-Stock

1+ parts

$1.851

100+ parts

$1.485

1k+ parts

$1.463

10k+ parts

$1.455

1,565

$1.851

$1.485

$1.463

$1.455

Mouser Electronics

USA . 1,808 parts In-Stock

1+ parts

$1.940

100+ parts

$1.620

1k+ parts

$1.370

10k+ parts

$1.360

1,808

$1.940

$1.620

$1.370

$1.360

Farnell

UK . 1,565 parts In-Stock

1+ parts

$2.055

100+ parts

$1.443

1k+ parts

$1.365

10k+ parts

-

1,565

$2.055

$1.443

$1.365

-

Verical

USA . 1,974 parts In-Stock

1+ parts

-

100+ parts

$1.548

1k+ parts

$1.498

10k+ parts

$1.277

1,974

-

$1.548

$1.498

$1.277

Rochester

USA . 1,163 parts In-Stock

1+ parts

-

100+ parts

$1.300

1k+ parts

$1.080

10k+ parts

$0.962

1,163

-

$1.300

$1.080

$0.962

Flip Electronics (Authorized)

USA . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 398 parts In-Stock

1+ parts

$0.674

100+ parts

-

1k+ parts

-

10k+ parts

-

398

$0.674

-

-

-

Vyrian

USA . 290 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

290

$0.710

-

-

-

LIBRA Elektronik GmbH

Germany . 104 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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104

-

-

-

-

Schukat

Germany . 84 parts In-Stock

1+ parts

-

100+ parts

$1.367

1k+ parts

$1.312

10k+ parts

-

84

-

$1.367

$1.312

-

IBS Electronics

USA . 45 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.529

45

-

-

-

$1.529

Flip Electronics

USA . 32 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

32

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 831 parts In-Stock

1+ parts

$0.479

100+ parts

-

1k+ parts

-

10k+ parts

$0.460

831

$0.479

-

-

$0.460

Northwest PG Solutions

USA . 1,462 parts In-Stock

1+ parts

$0.527

100+ parts

-

1k+ parts

-

10k+ parts

$0.465

1,462

$0.527

-

-

$0.465

Corphita

USA . 65 parts In-Stock

1+ parts

$0.639

100+ parts

-

1k+ parts

-

10k+ parts

-

65

$0.639

-

-

-

Component Stockers USA

USA . 12,026 parts In-Stock

1+ parts

$0.950

100+ parts

$1.190

1k+ parts

$1.440

10k+ parts

-

12,026

$0.950

$1.190

$1.440

-

Continental Prestige Electronics

USA . 10 parts In-Stock

1+ parts

$1.540

100+ parts

$1.220

1k+ parts

$1.160

10k+ parts

-

10

$1.540

$1.220

$1.160

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,000

-

-

-

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Perfect Parts

USA . 944 parts In-Stock

1+ parts

-

100+ parts

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944

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Glotronic Ltd.

UK . 138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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138

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Overview

Unlock the power of high-quality memory storage with the FM25L04B-DG by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies provides top-notch FRAMs that offer unparalleled reliability and performance. Perfect for a wide range of applications, this product boasts a variety of advantages such as fast operating speeds, low power consumption, and durable construction. Experience the value and benefits of this cutting-edge technology, whether you're working on IoT devices, industrial automation, or consumer electronics. Upgrade your memory solutions with the FM25L04B-DG today and discover the difference it can make for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring long-term reliability.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transfers, enhancing overall performance.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for a wide range of operating environments.

Terminal Finish: PURE TIN

Pure tin finish offers excellent conductivity and corrosion resistance, ensuring stable connections over time.

Write Protection: HARDWARE/SOFTWARE

Multiple write protection options provide security and prevent accidental data loss or corruption.

Technology: CMOS

CMOS technology combines low power consumption with high speed, optimizing energy efficiency.

Memory IC Type: FRAM

Ferroelectric RAM technology provides fast read/write speeds and high endurance, ideal for applications requiring frequent data updates.

Technical Specifications

FRAMs FM25L04B-DG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

4.5 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000006 Amp

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

FM25L04B-DG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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