Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES; Technology: CMOS;
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FRAMs WM71004-6-DGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies
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Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
Vishay Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
General Diode
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Terminal Finish: Tin/Lead (Sn/Pb); No. of Elements: 1;
IRLML6401TRPBF
Infineon Technologies
IRLML6401TRPBF by Infineon is a P-CHANNEL FET for SWITCHING applications. It features a 12V DS Breakdown Voltage, 34A IDM, and 0.05ohm RDS(on). With a small outline package style, it operates in an ambient temperature range of -55 to 150 °C.
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
2N2222A
STMicroelectronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Drain Current (ID): .2 A; Transistor Application: SWITCHING;
M24308/2-1F
Bel Fuse
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Mixed Contacts: NO;
SSL-LXA228SRC-TR11
Lumex
SSL-LXA228SRC-TR11 by Lumex is a 1.9mm SINGLE COLOR LED with peak wavelength of 660nm and max forward current of 0.03A. Ideal for applications requiring SUPER RED light emission, such as indicator lights in electronic devices due to its clear lens and surface mounting feature.
INA826AIDGKR
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
Hi-tron Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148WS-7-F
Diodes Incorporated
1N4148WS-7-F by Diodes Inc. is a single rectifier diode with max reverse recovery time of 0.004 us and max reverse current of 1 uA. It operates b/w -65 to 150 °C, ideal for applications requiring small outline surface mount diodes with a max output current of 0.15 A.
SMBJ18CA
Yageo
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
SPC TECHNOLOGY/ MULTICOMP
FM24W256-EGTR
Ramtron International
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 10; Operating Mode: SYNCHRONOUS;
CY15V104QSN-108LPXI
CY15V104QSN-108LPXI by Infineon is a FRAM with 512KX8 organization, operating at 108 MHz clock frequency. It offers 100000000000000 write/erase cycles endurance and uses SPI serial bus type. Ideal for applications requiring high-speed data storage in compact devices.
CY15B102QN-50SXI
Infineon CY15B102QN-50SXI is a 256Kx8 FRAM with 50MHz clock frequency, SPI serial bus, and 3.3V supply voltage. Ideal for applications requiring high endurance, fast write speeds, and low power consumption like IoT devices and industrial sensors.
FM25H20-DGTR
Cypress Semiconductor
FM25H20-DGTR by Cypress Semiconductor is a FRAM with 256KX8 organization, SPI serial bus type, and 40 MHz clock frequency. It operates at -40 to 85 °C and has 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage in compact devices.
CYRS15B102Q-GGMB
Infineon's CYRS15B102Q-GGMB is a 256Kx8 FRAM with synchronous operation, 25 MHz clock frequency, and SPI serial bus type. It offers 10000000000000 write/erase cycles endurance, ideal for applications requiring high-speed data storage in compact designs. With a small outline package style and metal-sealed co-fired ceramic body material, it suits space-constrained environments.
CY15B104Q-PZXI
Infineon's CY15B104Q-PZXI FRAM features 512KX8 organization, 40 MHz clock frequency, and SPI serial bus type. Ideal for applications requiring high endurance with 1000000000000000 write/erase cycles, such as industrial control systems and automotive electronics.
CY15B256J-SXE
CY15B256J-SXE by Infineon Technologies is a FRAM with 32KX8 organization, operating at 3.4 MHz clock frequency. It has a memory density of 262144 bit and offers 10000000000000 Write/Erase Cycles endurance. Ideal for applications requiring high-speed synchronous operation in automotive electronics due to AEC-Q100 screening level and small outline package style.
FM28V020-SG
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Standby Current: .00015 Amp; Memory Density: 262144 bit;
CY15V104QN-50SXA
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Operating Mode: SYNCHRONOUS;
FM24CL16B-GTR
FM24CL16B-GTR by Infineon Technologies is a FRAM with 2Kx8 organization, operating at 3.3V. It offers synchronous operation, 1MHz clock frequency, and 100 trillion write/erase cycles. Ideal for applications requiring high-speed data writing and low power consumption in compact designs.
CY15B104QI-20LPXI
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 20 MHz; Endurance: 1000000000000000 Write/Erase Cycles;
FM24VN10-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Maximum Standby Current: .00015 Amp;
FM25CL64B-DG
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Terminal Pitch: .95 mm; JESD-30 Code: R-PDSO-N8;
FM25V02-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G8; Peak Reflow Temperature (C): 260;
MB85RC256VPF-G-JNERE2
Fujitsu
Fujitsu's MB85RC256VPF-G-JNERE2 FRAM features 32KX8 organization, 1 MHz clock frequency, and 1000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with serial I2C interface in a small outline package.
CY15B102QN-50LHXIT
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3; Maximum Supply Voltage (Vsup): 3.6 V;
CY15B102Q-SXM
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Package Style (Meter): SMALL OUTLINE;
MB85RC64PNF-G-JNE1
Fujitsu Semiconductor America
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS; Memory Density: 65536 bit;
FM25L16B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 2K; JESD-30 Code: R-PDSO-G8;
FM25V40-DCG
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Clock Frequency (fCLK): 40 MHz; No. of Words: 524288 words;
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WM71008-6-DGTR
FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Terminal Form: NO LEAD; Length: 3 mm;
WM71016-6-DGTR
FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Equivalence Code: SOLCC8.12SQ,25; Terminal Form: NO LEAD;
WM71004-6-DGTR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Technology: CMOS; Package Body Material: PLASTIC/EPOXY;
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; No. of Words: 512 words; Length: 3 mm;
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Memory Width: 16; Parallel or Serial: SERIAL;
WM71004-NBSD-DATR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE;
WM71004-NBSD-DA
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: .65 mm;
WM71008-NBSD-DATR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Equivalence Code: SOLCC8,.12,25; Package Body Material: PLASTIC/EPOXY;
WM71008-NBSD-DA
WM71016-NBSD-DATR
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE; No. of Words Code: 1K;
WM71016-NBSD-DA
FRAM; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Surface Mount: YES; JESD-30 Code: S-PDSO-N8;
FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Terminal Pitch: .65 mm; Length: 3 mm;
FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Length: 3 mm; Terminal Form: NO LEAD;
FRAM-EMBEDDED; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: SOLCC8.12SQ,25;
Supply Digital Components
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