Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10;
Median Price
$41.214
Lifecycle Status
Suppliers In-Stock
17
In-Stock Inventory
1k+
Farnell
1+ parts
$34.930
100+ parts
$28.920
1k+ parts
-
10k+ parts
Chip1Stop
$38.300
$31.500
Arrow
$40.268
$35.814
Mouser Electronics
$44.280
$37.240
Newark
DigiKey
$44.300
$37.655
Element14
$3,637.600
$3,012.580
Flip Electronics (Authorized)
Avnet
$37.420
$36.850
Verical
$42.160
Rochester
$30.800
$27.560
$25.940
Digiode
$32.594
Vyrian
$34.310
Flip Electronics
LIBRA Elektronik GmbH
Component Sense
ACDS - Activité Composants Distribution Service
Native Components
$1.020
Northwest PG Solutions
$1.122
Corphita
$30.879
Component Stockers USA
$35.020
$29.960
iodParts Technologies Inc.
Perfect Parts
Authorized Procurement Solutions
S.R.D Solutions
FRAMs FM22LD16-55-BG attributes and parameters. Explore more FRAMs devices from Infineon Technologies
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FM22LD16-55-BG Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
ABS25-32.768KHZ-1-T
Abracon
Abracon's ABS25-32.768KHZ-1-T crystal oscillator offers 10 ppm frequency tolerance, 126% stability, and 50000 ohm series resistance. Ideal for applications requiring 0.032768 MHz nominal operating frequency, such as IoT devices and precision timing systems.
OPA2227UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
CRCW06030000Z0EAHP
Vishay Intertechnology
Vishay Intertechnology's CRCW06030000Z0EAHP is a 0 ohm jumper resistor with METAL GLAZE/THICK FILM tech. Operating temp range -55 to 155 °C, it's SMT package style makes it ideal for automotive applications meeting AEC-Q200 standard.
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
LM555CN
Rca Solid State
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
LM317T
Motorola
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Package Code: TO-220; Terminal Form: THROUGH-HOLE; No. of Outputs: 1; Package Equivalence Code: SIP3,.1TB;
1N4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Surface Mount: NO; Config: SINGLE; Peak Reflow Temperature (C): 260; No. of Phases: 1; Diode Element Material: SILICON;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
FDN306P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Maximum Drain Current (Abs) (ID): 2.6 A; Operating Mode: ENHANCEMENT MODE;
LM358N
Taejin Technology
OPERATIONAL AMPLIFIER; Temperature Grade: AUTOMOTIVE; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Moisture Sensitivity Level (MSL): 1; Maximum Operating Temperature: 150 Cel;
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
2N2222A
Texas Instruments
2N2222A by Texas Instruments is a small signal NPN bipolar junction transistor (BJT) with a max collector-emitter voltage of 40V and a max collector current of 0.8A. It is commonly used for switching applications due to its fast turn on/off times (35ns/285ns) and high transition frequency (300MHz).
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H/883
Linear Technology
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
SN65HVD230DR
SN65HVD230DR by Texas Instruments is a BICMOS technology interface circuit with 1Mbps data rate, suitable for industrial applications. It operates at 3.3V, has 8 terminals in a small outline package, and can withstand temperatures from -40 to 85°C.
0462-201-16141
TE Connectivity
TE Connectivity's 0462-201-16141 is a CRIMP terminal with MACHINED contact design. It operates b/w -55 to 125 °C, suitable for wire gauges from 20 to 16 AWG. With a rated current of 13A, it is ideal for applications requiring FEMALE ROUND PIN-SOCKET contacts.
Onsemi
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
CY15B104Q-SXIT
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 5.28 mm; Minimum Supply Voltage (Vsup): 2 V;
CY15V116QSN-108BKXQT
Infineon Technologies
FRAM;
CY15B108QN-20LPXIT
Infineon CY15B108QN-20LPXIT is a 1MX8 FRAM with 20MHz clock frequency, SPI interface, and 3.3V supply voltage. Ideal for applications requiring high endurance, such as industrial automation and IoT devices due to its 1000000000000000 write/erase cycles capability.
CY15B104QI-20LPXCT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Endurance: 1000000000000000 Write/Erase Cycles;
FM24V05-G
Infineon's FM24V05-G FRAM offers 64KX8 organization, operates at 3.4 MHz clock frequency, and has a memory density of 524288 bit. Ideal for applications requiring high endurance like industrial automation systems or IoT devices due to its 100000000000000 Write/Erase Cycles capability.
FM24W256-GTR
Ramtron International
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Minimum Supply Voltage (Vsup): 2.7 V;
FM24VN10-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 8; JESD-30 Code: R-PDSO-G8;
CY15E004Q-SXE
Infineon's CY15E004Q-SXE FRAM features 512x8 organization, 16MHz clock frequency, and 10000000000000 write/erase cycles. Ideal for automotive applications due to AEC-Q100 screening level, SPI serial bus type, and -40 to 125°C operating temperature range.
CY15B108QN-20LPXC
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Peak Reflow Temperature (C): 260; Terminal Finish: NICKEL PALLADIUM GOLD;
CY15B108QI-20LPXC
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Width: 3.23 mm; Surface Mount: YES;
MB85RS256TYPNF-G-AWERE2
Fujitsu
Fujitsu's MB85RS256TYPNF-G-AWERE2 FRAM offers 32KX8 organization, operates at 33 MHz with 3.3V supply voltage. Ideal for applications requiring high endurance, such as industrial automation and IoT devices due to its 10000000000000 Write/Erase Cycles capability.
CY15E064Q-SXET
CY15E064Q-SXET by Infineon Technologies is a FRAM with 8Kx8 organization, operating at 5V. It offers synchronous operation, 16MHz clock frequency, and SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level and high endurance of 10^13 write/erase cycles.
CY15B104QSN-108SXI
Infineon's CY15B104QSN-108SXI is a FRAM with 512KX8 organization, operating at 108 MHz clock frequency. It offers 100000000000000 write/erase cycles endurance and operates on a supply voltage range of 1.8V to 3.6V. Ideal for applications requiring high-speed data storage in compact devices due to its small outline package and synchronous operation mode.
MB85RS64VPNF-G-JNERE1
Fujitsu's MB85RS64VPNF-G-JNERE1 FRAM offers 8KX8 organization, operates at 3.3V with 20MHz clock frequency. Ideal for applications requiring high endurance, such as IoT devices and industrial automation systems. Package style is small outline with SPI serial bus type for efficient data storage and retrieval.
FM24CL16B-G
Infineon's FM24CL16B-G FRAM features 2Kx8 organization, operates at 1MHz clock frequency, and offers 100000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with a serial I2C bus interface in compact designs.
CY15B108QN-40LPXIT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Terminal Pitch: .65 mm; Serial Bus Type: SPI;
MB85RS2MTAPNF-G-BDERE1
Sumitomo Electric Industries
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Organization: 256KX8; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE, 1.7V TO 2.7V @ 33MHz;
FM24CL04B-G
Infineon's FM24CL04B-G FRAM offers 512x8 organization, operates at 3.3V with 1MHz clock frequency. Ideal for applications requiring high endurance like IoT devices due to its 100T write/erase cycles and I2C serial bus interface. Measuring just 4.889mm x 3.8985mm, it is a compact solution for data storage in small electronic devices.
FM28V102-BG
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Seated Height: 1.2 mm; Endurance: 100000000000000 Write/Erase Cycles;
CY15B104QI-20LPXI
Infineon's CY15B104QI-20LPXI is a FRAM with 512KX8 organization, operating at 3.3V. It offers 20MHz clock frequency, SPI serial bus type, and 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage in compact designs with low power consumption.
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FM22L16-55-TGTR
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Width: 16; Maximum Operating Temperature: 85 Cel;
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Operating Mode: ASYNCHRONOUS;
Infineon's FM22L16-55-TGTR FRAM offers 256Kx16 organization, operates at 3.3V with 100 trillion write/erase cycles. Ideal for applications requiring high endurance and fast access times in a compact package.
FM22L16-55-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 256K;
Infineon's FM22L16-55-TG FRAM offers 256KX16 organization, 3.3V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high endurance with 100T write/erase cycles, this CMOS memory IC features a parallel interface and thin profile package for compact designs.
FM22LD16-55-BGTR
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 110 ns; Technology: CMOS;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH; Memory Width: 16;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: BGA48,6X8,30;
FM22LD16-55-BG
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 12 mA; Length: 8 mm;
Supply Digital Components
$106.00
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12,000 In-Stock
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