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CY15B102QN-50PZXI

Infineon Technologies

CY15B102QN-50PZXI by Infineon Technologies

Infineon's CY15B102QN-50PZXI FRAM offers 256Kx8 organization, operates at 50MHz clock frequency via SPI serial bus. With 1000000000000000 write/erase cycles endurance, it suits applications requiring high-speed data storage and retrieval in industrial environments.

Median Price

$4.142

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 727 parts In-Stock

1+ parts

$3.770

100+ parts

$3.250

1k+ parts

$3.080

10k+ parts

-

727

$3.770

$3.250

$3.080

-

Newark

USA . 48 parts In-Stock

1+ parts

$4.370

100+ parts

$3.850

1k+ parts

$3.640

10k+ parts

-

48

$4.370

$3.850

$3.640

-

DigiKey

USA . 344 parts In-Stock

1+ parts

$4.860

100+ parts

$4.283

1k+ parts

$3.946

10k+ parts

$3.854

344

$4.860

$4.283

$3.946

$3.854

Element14

Singapore . 794 parts In-Stock

1+ parts

$5.752

100+ parts

$4.595

1k+ parts

$4.225

10k+ parts

-

794

$5.752

$4.595

$4.225

-

Rochester

USA . 1,497 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

$2.800

10k+ parts

$2.630

1,497

-

$3.130

$2.800

$2.630

Verical

USA . 1,093 parts In-Stock

1+ parts

-

100+ parts

$3.913

1k+ parts

$3.500

10k+ parts

$3.288

1,093

-

$3.913

$3.500

$3.288

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 333 parts In-Stock

1+ parts

$3.296

100+ parts

-

1k+ parts

-

10k+ parts

-

333

$3.296

-

-

-

Vyrian

USA . 147 parts In-Stock

1+ parts

$3.470

100+ parts

-

1k+ parts

-

10k+ parts

-

147

$3.470

-

-

-

Flip Electronics

USA . 6,360 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,360

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 202 parts In-Stock

1+ parts

$1.270

100+ parts

-

1k+ parts

-

10k+ parts

-

202

$1.270

-

-

-

Northwest PG Solutions

USA . 101 parts In-Stock

1+ parts

$1.397

100+ parts

-

1k+ parts

-

10k+ parts

-

101

$1.397

-

-

-

Corphita

USA . 880 parts In-Stock

1+ parts

$3.123

100+ parts

-

1k+ parts

-

10k+ parts

-

880

$3.123

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 13,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,479

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Overview

Unlock the power of reliable data storage with the CY15B102QN-50PZXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality FRAMs that offer unparalleled advantages in various applications. With a focus on innovation and efficiency, this product provides customers with a valuable solution that ensures optimal performance and durability. Experience the benefits of seamless operation, high endurance, and advanced technology with the CY15B102QN-50PZXI, setting a new standard for memory ICs in the market.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures data is transferred efficiently and reliably within the memory.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V provides a good balance between power consumption and performance.

Organization: 256KX8

The 256KX8 organization allows for efficient data storage and retrieval processes.

Memory IC Type: FRAM

FRAM technology offers fast read and write speeds, high endurance, and low power consumption, making it a reliable choice for memory applications.

Technical Specifications

FRAMs CY15B102QN-50PZXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; 2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDIP-T8

Length:

9.398 mm

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Maximum Seated Height:

4.572 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00007 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B102QN-50PZXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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