Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Fujitsu's MB89R118C1-DIAP15-P1 is a FRAM-EMBEDDED memory IC with 2Kx8 organization, 2048 words, and 16384-bit memory density. It offers 1000000000000 write/erase cycles, -20 to 85 °C operating temp range, ideal for applications requiring high endurance and fast data retention.
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Surface mount technology allows for easy and reliable installation on PCBs, saving space and reducing assembly time.
Uncased chip design allows for flexibility in mounting options and integration into a variety of electronic devices.
High maximum operating temperature ensures reliable performance even in harsh or elevated temperature environments.
Efficient organization of 2K words in a row of 8 bits each allows for quick and precise data access and manipulation.
Low minimum operating temperature enables operation in cold or extreme weather conditions without compromising performance.
CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems.
Upper terminal position simplifies installation and connection in electronic circuits, improving overall reliability and ease of use.
8-bit memory width allows for efficient storage and retrieval of data in byte-sized chunks, compatible with many existing microcontroller architectures.
Extremely high endurance rating ensures long-lasting reliability and durability for frequent read/write operations without degradation in performance.
FRAM-embedded memory technology offers fast read/write speeds, low power consumption, and non-volatile storage characteristics, making it ideal for various applications.
FRAMs MB89R118C1-DIAP15-P1 attributes and parameters. Explore more FRAMs devices from Fujitsu
Additional Features:
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No. of Words:
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MB89R118C1-DIAP15-P1 Memory ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Fujitsu Ltd delivers total solutions in the field of information and communication technology. The company provides solutions/system integration services focused on information system consulting and construction, and infrastructure services centered on outsourcing services. Fujitsu provides services across a wide range of countries and regions, including Europe, the Americas, Asia, and Oceania. It operates in three segments namely, Technology Solutions; Ubiqitous Solutions and Device Solutions. Ubiquitous Solutions consists of PCs, mobile phones, and mobilewear. In PCs, Fujitsu's lineup includes desktop and laptop PCs known for energy efficiency, security, and other enhanced features, as well as water- and dust-resistant tablets.
DS18B20U+
Analog Devices
DS18B20U+ by Analog Devices is a 12-bit temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, offering ±0.5°C accuracy. Suitable for applications requiring digital output and surface mounting feature.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Fagor Electronica S Coop
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
4554
Jw Miller Magnetics
Other Semiconductors;
LL4148
Microsemi
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
STM32H753ZIT6
STMicroelectronics
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
LM358AN
2N2222A
Telcom Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
SN6505BDBVR
Texas Instruments
SN6505BDBVR by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -55 to 125°C and supports a max output current of 1.5A at supply voltages ranging from 2.25V to 5.5V. Ideal for military-grade applications requiring compact design and high reliability.
Daco Semiconductor
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
Samsung
EU2B-YS3103F
Idec
ROTARY SWITCH;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
CY15V104QSN-108LPXI
CY15V104QSN-108LPXI by Infineon is a FRAM with 512KX8 organization, operating at 108 MHz clock frequency. It offers 100000000000000 write/erase cycles endurance and uses SPI serial bus type. Ideal for applications requiring high-speed data storage in compact devices.
MB85RS128BPNF-G-JNE1
Fujitsu
Fujitsu's MB85RS128BPNF-G-JNE1 FRAM features 16KX8 organization, SPI serial bus type, and 1000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing with low power consumption in a compact small outline package style.
FM24W256-EGTR
Ramtron International
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Data Retention Time: 10; Operating Mode: SYNCHRONOUS;
CY15V108QSN-108BKXQT
FRAM;
FM25V05-GTR
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Nominal Supply Voltage / Vsup (V): 3.3; Terminal Position: DUAL;
FM28V102A-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Density: 1048576 bit; Moisture Sensitivity Level (MSL): 3;
CY15V104QN-50LPXI
Infineon CY15V104QN-50LPXI FRAM offers 512Kx8 organization, operates at 50MHz clock frequency, and has 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage with low power consumption in compact designs.
CY15B108QN-20LPXIT
FRAM; No. of Terminals: 8; Package Code: VSON; Package Shape: RECTANGULAR; Technology: CMOS; Maximum Operating Temperature: 85 Cel;
FM25L04B-GA
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; No. of Words: 512 words;
FM24CL04B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Seated Height: 1.75 mm; Maximum Supply Current: .3 mA;
FM24CL64B-GATR
FM24CL64B-GATR by Cypress Semiconductor is an 8KX8 FRAM with 65536 bit memory density. It operates at 1 MHz clock frequency, has a supply voltage of 3.3V, and offers 10000000000000 Write/Erase Cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in automotive electronics due to AEC-Q100 screening level compliance.
CY15B104QN-50SXAT
Infineon CY15B104QN-50SXAT is a FRAM with 512Kx8 organization, operates at 50MHz clock frequency, and has SPI serial bus type. It is suitable for automotive applications due to AEC-Q100 screening level and endurance of 10^14 write/erase cycles.
FM25L04B-GATR
Infineon's FM25L04B-GATR is a FRAM with 512x8 organization, operating at 3.3V. It offers 10MHz clock frequency, SPI serial bus type, and AEC-Q100 screening level. Ideal for applications requiring high endurance, such as automotive electronics and industrial control systems.
FM25W256-G
FM25W256-G by Infineon Technologies is a FRAM with 32KX8 organization, operating at 3.3V. It offers 100000000000000 write/erase cycles, SPI serial bus type, and can withstand temperatures from -40 to 85 °C. Ideal for applications requiring high endurance and low power consumption.
FM24C16B-GTR
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Qualification: Not Qualified; Technology: CMOS;
CY15B064Q-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Operating Mode: SYNCHRONOUS; No. of Words Code: 8K;
FM24CL64B-GTR
FM24CL64B-GTR by Infineon Technologies is a FRAM memory IC with 8Kx8 organization and 65536-bit memory density. It operates in synchronous mode with a max clock frequency of 1 MHz. This small outline package is suitable for applications requiring high endurance, such as industrial automation and automotive systems.
FM18W08-SG
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.4; Minimum Standby Voltage: 2.7 V;
FM25C160B-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 5.5 V; Serial Bus Type: SPI;
CY15V108QN-20LPXIT
Infineon's CY15V108QN-20LPXIT is a 1MX8 FRAM with 20 MHz clock frequency, SPI interface, and 1.8V supply voltage. Ideal for applications requiring high endurance, fast write speeds, and low power consumption such as IoT devices and industrial sensors.
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MB89R118C1-DIAB15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -20 Cel; No. of Functions: 1; Organization: 2KX8;
MB89R118C1-DIAP15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words: 2048 words; Memory Width: 8; Package Equivalence Code: DIE OR CHIP;
MB89R118C2-DIAB15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Additional Features: DATA RETENTION TIME @ 70 DEGREE CENTIGRADE; No. of Functions: 1; Package Equivalence Code: DIE OR CHIP;
MB89R118C2-DIAP15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Organization: 2KX8; No. of Words: 2048 words; Technology: CMOS;
MB89R118C2-DIAP15-P1
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; No. of Words: 2048 words; Memory Width: 8; JESD-30 Code: X-XUUC-N;
MB89R118C1-DI15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Minimum Operating Temperature: -20 Cel; Maximum Operating Temperature: 85 Cel; Package Body Material: PLASTIC/EPOXY;
MB89R118C2-DI15
FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Additional Features: DATA RETENTION TIME @ 70 DEGREE CENTIGRADE; Package Equivalence Code: DIE OR CHIP; Organization: 2KX8;
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