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CY15B108QN-20LPXI

Infineon Technologies

CY15B108QN-20LPXI by Infineon Technologies

Infineon CY15B108QN-20LPXI is a 1MX8 FRAM with 20MHz clock frequency, SPI interface, and 3.3V supply voltage. Ideal for applications requiring high endurance, fast write speeds, and low power consumption like IoT devices and industrial sensors.

Median Price

$27.980

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 4,105 parts In-Stock

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DigiKey

USA . 2,145 parts In-Stock

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$27.980

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$27.980

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Verical

USA . 1,960 parts In-Stock

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$32.312

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1,960

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Rochester

USA . 137 parts In-Stock

1+ parts

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100+ parts

$22.520

1k+ parts

$20.150

10k+ parts

$18.970

137

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$22.520

$20.150

$18.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 71 parts In-Stock

1+ parts

$33.787

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Flip Electronics

USA . 4,105 parts In-Stock

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Vyrian

USA . 2,844 parts In-Stock

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DigiKey Marketplace

USA . 2,145 parts In-Stock

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Digiode

USA . 420 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,810 parts In-Stock

1+ parts

$21.280

100+ parts

$20.748

1k+ parts

$20.642

10k+ parts

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1,810

$21.280

$20.748

$20.642

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Ampacity Inc.

Singapore . 2,960 parts In-Stock

1+ parts

$23.780

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$23.780

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Aranea Global

USA . 100 parts In-Stock

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$33.112

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$31.787

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100

$33.112

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$31.787

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Continental Prestige Electronics

USA . 3,324 parts In-Stock

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$33.787

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$33.112

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$33.787

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$33.112

Argo Parts USA

USA . 2,092 parts In-Stock

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Corphita

USA . 926 parts In-Stock

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926

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Overview

Unlock the power of reliable and high-quality memory solutions with the CY15B108QN-20LPXI by Infineon Technologies. As a leading manufacturer in the field, Infineon Technologies brings you the best FRAM technology for your applications. Whether you are working on IoT devices, automotive systems, or industrial controls, this product offers unparalleled value with its endurance of 1 quadrillion write/erase cycles, ensuring long-lasting performance and data integrity. Trust Infineon Technologies to deliver cutting-edge memory solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Enables high-speed data transfer and communication between the FRAM and the system, improving performance.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal voltage level ensures stable and reliable operation of the FRAM.

Width: 3.23 mm

Compact size allows for efficient use of space on the circuit board, ideal for applications with limited area.

Technology: CMOS

Utilizes CMOS technology for low power consumption, making the FRAM energy-efficient.

Endurance: 1000000000000000 Write/Erase Cycles

With a high number of write/erase cycles, the FRAM offers a reliable and long-lasting memory solution.

Technical Specifications

FRAMs CY15B108QN-20LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00012 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B108QN-20LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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