Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Infineon's FM22L16-55-TG FRAM offers 256KX16 organization, 3.3V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high endurance with 100T write/erase cycles, this CMOS memory IC features a parallel interface and thin profile package for compact designs.
Median Price
$43.340
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Suppliers In-Stock
22
In-Stock Inventory
1k+
Arrow
1+ parts
100+ parts
$39.475
1k+ parts
$39.222
10k+ parts
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Chip1Stop
$46.900
Mouser Electronics
$47.010
$39.570
DigiKey
$47.040
$41.044
$39.569
Rochester
$26.880
$24.050
$22.630
Verical
$33.600
$30.063
$28.288
Flip Electronics (Authorized)
Avnet
$28.068
Digiode
$25.232
Nova Conductors
$35.488
IBS Electronics
$43.379
$41.851
$36.353
$34.670
Chip Stock
Vyrian
Rutronik
$39.710
Flip Electronics
DigiKey Marketplace
J2 Sourcing AB
Semtec, LLC
Prism Electronics
ACDS - Activité Composants Distribution Service
Sogenti Electronics
NexGen Digital
Ampacity Inc.
$15.730
Corphita
$23.904
Component Stockers USA
$28.210
$26.870
$25.750
Continental Prestige Electronics
$28.640
Aranea Global
$34.778
$33.387
Advanced Electronics
$66.950
$63.603
$63.602
Lixinc
Perfect Parts
Kepictronics
Authorized Procurement Solutions
Argo Parts USA
A-Z Elektronik GmbH
GreenTree Electronics
Futuretech Components
Infinite Electronics LLP (Excess)
This material provides good protection for the internal components of the FRAM, ensuring durability and long-term reliability.
Allows for independent operation without the need for synchronization, making it versatile and easy to integrate into various systems.
Optimal supply voltage to ensure stable and efficient performance of the FRAM.
Sufficient number of terminals for connecting and interfacing with other components in the system.
Can withstand high temperature environments, making it suitable for a wide range of applications.
Utilizes CMOS technology for low power consumption and high speed operation, resulting in energy efficiency and fast data access.
High memory density allows for storing a large amount of data, making it suitable for applications requiring extensive data processing and storage.
Exceptionally high endurance ensures long-term reliability and durability of the FRAM, making it a cost-effective solution for frequent read/write operations.
FRAMs FM22L16-55-TG attributes and parameters. Explore more FRAMs devices from Infineon Technologies
Maximum Access Time:
Additional Features:
Minimum Data Retention Time:
Endurance:
JESD-30 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Standby Current:
Minimum Standby Voltage:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
FM22L16-55-TG Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.71
SB
8542.32.00.70
Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.
CEO
Jochen Hanebeck
Chief Financial Officer
Sven Schneider
Chief Marketing Officer
Andreas Urschitz
Villach 300mm
Fabrication
Fab Initiation
2011
Austria
Villach
Wafer Capacity
11,000
Kulim 2
2016
Malaysia
Kulim
79,500
Dresden - Module 3
1999
Germany
Dresden
58,000
Villach Building
2,000
Regensburg
1986
60,000
Dresden 200 - Module 1
1995
28,000
Dresden 200 - Module 2
1996
Building 38
2005
500
Building 47
Kulim 1
2006
110,000
Mesa Facility
1990
USA
Mesa
3,000
Villach 150mm
1981
35,000
Villach 200mm
68,000
Temecula
30,000
2021
2018
5,000
Kulim 3
2024
Fab 25
Austin
31,000
Dresden - Module 4
2026
1N4148
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
2N2222A
Tt Electronics Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
LM358N
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
SMBJ18CA
Semitron
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Rochester Electronics
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Additional Features: LOGIC LEVEL COMPATIBLE; Qualification: Not Qualified;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
New Jersey Semiconductor Products
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Vishay Semiconductors
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: J BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS84PH6327XTSA2
Infineon Technologies
BSS84PH6327XTSA2 by Infineon is a P-CHANNEL FET with 60V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and operates in enhancement mode. With a max drain current of 0.17A and on-resistance of 8 ohm, it offers reliable performance in small outline packages.
MBR130T1G
MBR130T1G by Onsemi is a Schottky rectifier diode with max output current of 1A and max repetitive peak reverse voltage of 30V. It operates b/w -65 to 125°C, suitable for surface mount applications in electronics requiring low forward voltage drop.
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Meritek Electronics
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358AN
NXP Semiconductors
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
M24308/2-1F
Cinch Connectivity Solutions
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Dielectric Withstanding Voltage (V): 1750VAC; No. of Connectors: ONE; Body Depth: .375 inch;
National Semiconductor
LL4148
Kec
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CY15B102QN-50PZXI
Infineon's CY15B102QN-50PZXI FRAM offers 256Kx8 organization, operates at 50MHz clock frequency via SPI serial bus. With 1000000000000000 write/erase cycles endurance, it suits applications requiring high-speed data storage and retrieval in industrial environments.
FM28V202-TGTR
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Finish: NICKEL PALLADIUM GOLD; JESD-609 Code: e4;
CY15B108QN-50BKXQT
FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Serial Bus Type: SPI;
FM24V05-GTR
Cypress Semiconductor
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Pitch: 1.27 mm; Package Style (Meter): SMALL OUTLINE;
MB85RDP16LXPN-G-AMEWE1
Fujitsu
Fujitsu's MB85RDP16LXPN-G-AMEWE1 is a FRAM with 2Kx8 organization, operating at 15MHz clock frequency. It features SPI serial bus type, 16384-bit memory density, and 10000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in compact electronic devices.
CY15V116QI-20BKXC
Infineon's CY15V116QI-20BKXC FRAM offers 2MX8 organization, operates at 20MHz clock frequency, and has a 1.8V nominal voltage. Ideal for applications requiring high endurance with 1000000000000000 write/erase cycles, such as IoT devices or industrial automation systems.
FM1808-120-S
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 32K; Memory Density: 262144 bit;
FM24CL64-S
Ramtron International
FM24CL64-S by Ramtron International is an 8KX8 FRAM with 3V supply, operating at -40 to 85°C. It features I2C serial bus, 1MHz clock frequency, and 0.4mA max current. Ideal for applications requiring fast, non-volatile data storage in a compact form factor.
FM24CL64B-GATR
FM24CL64B-GATR by Cypress Semiconductor is an 8KX8 FRAM with 65536 bit memory density. It operates at 1 MHz clock frequency, has a supply voltage of 3.3V, and offers 10000000000000 Write/Erase Cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in automotive electronics due to AEC-Q100 screening level compliance.
CY15E016J-SXE
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Minimum Standby Voltage: 4.5 V; Technology: CMOS;
FM28V020-SGTR
FRAM; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 3.6 V; Terminal Form: GULL WING;
CY15B108QN-40SXI
Infineon CY15B108QN-40SXI is a 1MX8 FRAM with 40MHz clock frequency, 3.3V supply voltage, and SPI serial bus type. It operates synchronously at -40 to 85°C, offering 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed non-volatile memory with low power consumption.
MB85RS128APNF-G-JNE1
Fujitsu Semiconductor America
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Endurance: 10000000000 Write/Erase Cycles; No. of Words Code: 16K;
CY15E064J-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Length: 4.889 mm; Maximum Seated Height: 1.727 mm;
FM25V01A-GTR
FM25V01A-GTR by Infineon Technologies is a FRAM memory IC with 16KX8 organization and 131072 bit memory density. It operates in synchronous mode with a max clock frequency of 40 MHz. This small outline package is suitable for applications requiring high endurance and write protection, such as industrial control systems and automotive electronics.
CY15B108QI-20LPXCT
CY15B108QI-20LPXCT by Infineon Technologies is a 1MX8 FRAM with 3.3V supply voltage, 20MHz clock frequency, and SPI serial bus type. It offers 1000000000000000 write/erase cycles endurance for applications requiring high-speed data writing and low power consumption in compact designs.
CY15E016J-SXET
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; Peak Reflow Temperature (C): 260;
FM25L256-G
FM25L256-G by Ramtron International is a 32KX8 FRAM with SPI serial bus, 20 MHz clock frequency, and 262144 bit memory density. It operates at -25 to 85 °C and is ideal for applications requiring fast, non-volatile data storage in compact designs.
FM25CL64B-GA
FM25CL64B-GA by Cypress Semiconductor is a FRAM with 8KX8 organization, operating at 3.3V. It offers 16 MHz clock frequency, SPI serial bus type, and 10000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data writing and low power consumption in automotive electronics and industrial control systems.
FM24V05-G
FRAM; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Terminal Form: GULL WING; Memory Width: 8;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
FM22L16-55-TGTR
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Memory Width: 16; Maximum Operating Temperature: 85 Cel;
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Operating Mode: ASYNCHRONOUS;
Infineon's FM22L16-55-TGTR FRAM offers 256Kx16 organization, operates at 3.3V with 100 trillion write/erase cycles. Ideal for applications requiring high endurance and fast access times in a compact package.
FM22L16-55-TG
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Endurance: 100000000000000 Write/Erase Cycles; Package Style (Meter): SMALL OUTLINE, THIN PROFILE;
FRAM; No. of Terminals: 44; Package Code: TSOP2; Package Shape: RECTANGULAR; Terminal Position: DUAL; No. of Words Code: 256K;
FM22LD16-55-BG
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Technology: CMOS; Minimum Data Retention Time: 10;
FM22LD16-55-BGTR
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Access Time: 110 ns; Technology: CMOS;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH; Memory Width: 16;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Package Equivalence Code: BGA48,6X8,30;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH;
FRAM; No. of Terminals: 48; Package Code: TFBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 12 mA; Length: 8 mm;
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