Loading...

FM22L16-55-TG

Infineon Technologies

FM22L16-55-TG by Infineon Technologies

Infineon's FM22L16-55-TG FRAM offers 256KX16 organization, 3.3V nominal voltage, and 85°C max operating temp. Ideal for applications requiring high endurance with 100T write/erase cycles, this CMOS memory IC features a parallel interface and thin profile package for compact designs.

Median Price

$46.900

Lifecycle Status

Suppliers In-Stock

22

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 308 parts In-Stock

1+ parts

$46.900

100+ parts

-

1k+ parts

-

10k+ parts

-

308

$46.900

-

-

-

Mouser Electronics

USA . 1,300 parts In-Stock

1+ parts

$47.010

100+ parts

$39.570

1k+ parts

-

10k+ parts

-

1,300

$47.010

$39.570

-

-

DigiKey

USA . 249 parts In-Stock

1+ parts

$47.040

100+ parts

$41.044

1k+ parts

$39.569

10k+ parts

-

249

$47.040

$41.044

$39.569

-

Arrow

USA . 825 parts In-Stock

1+ parts

$47.342

100+ parts

$39.311

1k+ parts

$37.335

10k+ parts

-

825

$47.342

$39.311

$37.335

-

Rochester

USA . 9,565 parts In-Stock

1+ parts

-

100+ parts

$26.880

1k+ parts

$24.050

10k+ parts

$22.630

9,565

-

$26.880

$24.050

$22.630

Verical

USA . 8,671 parts In-Stock

1+ parts

-

100+ parts

$33.600

1k+ parts

$30.063

10k+ parts

$28.288

8,671

-

$33.600

$30.063

$28.288

Flip Electronics (Authorized)

USA . 2,310 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,310

-

-

-

-

Avnet

USA . 175 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$28.068

175

-

-

-

$28.068

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 154 parts In-Stock

1+ parts

$25.232

100+ parts

-

1k+ parts

-

10k+ parts

-

154

$25.232

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$35.488

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$35.488

-

-

-

IBS Electronics

USA . 525 parts In-Stock

1+ parts

$43.379

100+ parts

$41.851

1k+ parts

$36.353

10k+ parts

$34.670

525

$43.379

$41.851

$36.353

$34.670

Chip Stock

USA . 10,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,300

-

-

-

-

Vyrian

USA . 1,722 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,722

-

-

-

-

Rutronik

Germany . 810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$40.650

10k+ parts

-

810

-

-

$40.650

-

Flip Electronics

USA . 341 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

341

-

-

-

-

DigiKey Marketplace

USA . 276 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

276

-

-

-

-

J2 Sourcing AB

Sweden . 43 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

43

-

-

-

-

Semtec, LLC

USA . 38 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

38

-

-

-

-

Prism Electronics

USA . 36 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

36

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 34 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

34

-

-

-

-

Sogenti Electronics

Canada . 22 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

22

-

-

-

-

NexGen Digital

USA . 4 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,758 parts In-Stock

1+ parts

$15.730

100+ parts

-

1k+ parts

-

10k+ parts

-

1,758

$15.730

-

-

-

Corphita

USA . 492 parts In-Stock

1+ parts

$23.904

100+ parts

-

1k+ parts

-

10k+ parts

-

492

$23.904

-

-

-

Component Stockers USA

USA . 12,049 parts In-Stock

1+ parts

$28.210

100+ parts

$26.870

1k+ parts

$25.750

10k+ parts

-

12,049

$28.210

$26.870

$25.750

-

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$28.640

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$28.640

-

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$34.778

100+ parts

-

1k+ parts

$33.387

10k+ parts

-

1,000

$34.778

-

$33.387

-

Advanced Electronics

New Zealand . 196 parts In-Stock

1+ parts

$66.950

100+ parts

$63.603

1k+ parts

$63.602

10k+ parts

-

196

$66.950

$63.603

$63.602

-

Lixinc

USA . 17,331 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

17,331

-

-

-

-

Perfect Parts

USA . 6,901 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,901

-

-

-

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Argo Parts USA

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,967

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,796

-

-

-

-

GreenTree Electronics

Israel . 1,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,350

-

-

-

-

Futuretech Components

Singapore . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

-

-

-

-

Infinite Electronics LLP (Excess)

. 210 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

210

-

-

-

-

Overview

Unlock the power of reliable, high-performance data storage with the FM22L16-55-TG by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality FRAMs that guarantee seamless operation and durability. Ideal for a wide range of applications, this memory module offers unmatched value and benefits to customers seeking efficient data management solutions. Experience the advantages of Infineon's innovative technology with the FM22L16-55-TG and elevate your performance to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the FRAM, ensuring durability and long-term reliability.

Operating Mode: ASYNCHRONOUS

Allows for independent operation without the need for synchronization, making it versatile and easy to integrate into various systems.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage to ensure stable and efficient performance of the FRAM.

No. of Terminals: 44

Sufficient number of terminals for connecting and interfacing with other components in the system.

Maximum Operating Temperature: 85 °C

Can withstand high temperature environments, making it suitable for a wide range of applications.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation, resulting in energy efficiency and fast data access.

Memory Density: 4194304 bit

High memory density allows for storing a large amount of data, making it suitable for applications requiring extensive data processing and storage.

Endurance: 100000000000000 Write/Erase Cycles

Exceptionally high endurance ensures long-term reliability and durability of the FRAM, making it a cost-effective solution for frequent read/write operations.

Technical Specifications

FRAMs FM22L16-55-TG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

110 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;2.5KV ESD AVAILABLE;ALSO CONFIGURABLE AS 512KX8

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G44

Length:

18.41 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

16

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

44

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX16

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP44,.46,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.00027 Amp

Minimum Standby Voltage:

2.7 V

Maximum Supply Current:

12 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10.16 mm

Trade Compliance

FM22L16-55-TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11