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CY15B108QI-20LPXC

Infineon Technologies

CY15B108QI-20LPXC by Infineon Technologies

CY15B108QI-20LPXC by Infineon Technologies is a 1MX8 FRAM with 20 MHz clock frequency, SPI serial bus type, and 3.3V nominal voltage. It is ideal for applications requiring high endurance, such as industrial automation systems and IoT devices due to its 1000000000000000 write/erase cycles capability.

Median Price

$26.285

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 221 parts In-Stock

1+ parts

$19.360

100+ parts

$17.830

1k+ parts

$17.650

10k+ parts

-

221

$19.360

$17.830

$17.650

-

Chip1Stop

Japan . 44 parts In-Stock

1+ parts

$24.800

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$24.800

-

-

-

Mouser Electronics

USA . 183 parts In-Stock

1+ parts

$27.770

100+ parts

$23.640

1k+ parts

-

10k+ parts

-

183

$27.770

$23.640

-

-

DigiKey

USA . 490 parts In-Stock

1+ parts

$40.830

100+ parts

$34.754

1k+ parts

-

10k+ parts

-

490

$40.830

$34.754

-

-

Flip Electronics (Authorized)

USA . 12,913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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12,913

-

-

-

-

Rochester

USA . 1,324 parts In-Stock

1+ parts

-

100+ parts

$23.210

1k+ parts

$20.770

10k+ parts

$19.540

1,324

-

$23.210

$20.770

$19.540

Verical

USA . 758 parts In-Stock

1+ parts

-

100+ parts

$29.012

1k+ parts

$25.962

10k+ parts

$24.425

758

-

$29.012

$25.962

$24.425

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 710 parts In-Stock

1+ parts

$24.491

100+ parts

-

1k+ parts

-

10k+ parts

-

710

$24.491

-

-

-

Nova Conductors

Japan . 45 parts In-Stock

1+ parts

$29.950

100+ parts

-

1k+ parts

-

10k+ parts

-

45

$29.950

-

-

-

Flip Electronics

USA . 17,760 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,760

-

-

-

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Vyrian

USA . 1,964 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,964

-

-

-

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Chip Stock

USA . 352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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352

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,108 parts In-Stock

1+ parts

$21.910

100+ parts

-

1k+ parts

-

10k+ parts

-

2,108

$21.910

-

-

-

Corphita

USA . 942 parts In-Stock

1+ parts

$23.202

100+ parts

-

1k+ parts

-

10k+ parts

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942

$23.202

-

-

-

Continental Prestige Electronics

USA . 5,171 parts In-Stock

1+ parts

$27.700

100+ parts

-

1k+ parts

-

10k+ parts

$27.146

5,171

$27.700

-

-

$27.146

Aranea Global

USA . 500 parts In-Stock

1+ parts

$29.351

100+ parts

-

1k+ parts

$28.177

10k+ parts

-

500

$29.351

-

$28.177

-

Component Stockers USA

USA . 949 parts In-Stock

1+ parts

$36.450

100+ parts

$29.440

1k+ parts

$28.550

10k+ parts

-

949

$36.450

$29.440

$28.550

-

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,000

-

-

-

-

Argo Parts USA

USA . 347 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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347

-

-

-

-

Perfect Parts

USA . 17 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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17

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Overview

Unlock the power of cutting-edge technology with the CY15B108QI-20LPXC by Infineon Technologies. As a leader in FRAMs, Infineon guarantees top-notch quality, reliability, and innovation. This product's unique features make it ideal for applications requiring fast and efficient data storage solutions. With its high endurance, low power consumption, and secure write protection, the CY15B108QI-20LPXC offers unparalleled value and performance to customers looking to stay ahead in today's competitive market. Experience the difference with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FRAM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and fast installation on circuit boards, saving time during manufacturing processes.

Operating Mode: SYNCHRONOUS

Enables precise and synchronized operation with other components in the system, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a common supply voltage, making it compatible with a wide range of systems.

Write Protection: HARDWARE/SOFTWARE

Enhances data security by allowing the FRAM to be protected from unauthorized write access, preventing data loss or corruption.

Technical Specifications

FRAMs CY15B108QI-20LPXC attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.2,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00012 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

1.75 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B108QI-20LPXC Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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