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CY15E064J-SXE

Infineon Technologies

CY15E064J-SXE by Infineon Technologies

Infineon's CY15E064J-SXE FRAM features 8Kx8 organization, 1MHz clock frequency, and 10000000000000 write/erase cycles. Ideal for applications requiring high endurance memory with a serial I2C interface in automotive electronics due to AEC-Q100 screening level.

Median Price

$2.980

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 841 parts In-Stock

1+ parts

-

100+ parts

$2.980

1k+ parts

$2.670

10k+ parts

$2.510

841

-

$2.980

$2.670

$2.510

Verical

USA . 841 parts In-Stock

1+ parts

-

100+ parts

$3.925

1k+ parts

$3.337

10k+ parts

$3.138

841

-

$3.925

$3.337

$3.138

DigiKey

USA . 739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.680

10k+ parts

-

739

-

-

$2.680

-

Flip Electronics (Authorized)

USA . 739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

739

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 488 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

488

$2.680

-

-

-

Digiode

USA . 859 parts In-Stock

1+ parts

$3.154

100+ parts

-

1k+ parts

-

10k+ parts

-

859

$3.154

-

-

-

Flip Electronics

USA . 739 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

739

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 410 parts In-Stock

1+ parts

$0.384

100+ parts

-

1k+ parts

-

10k+ parts

$0.369

410

$0.384

-

-

$0.369

Northwest PG Solutions

USA . 420 parts In-Stock

1+ parts

$0.422

100+ parts

-

1k+ parts

-

10k+ parts

$0.372

420

$0.422

-

-

$0.372

Corphita

USA . 445 parts In-Stock

1+ parts

$2.988

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$2.988

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

-

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Overview

Unlock endless possibilities with the CY15E064J-SXE by Infineon Technologies, a high-quality FRAM memory IC designed to revolutionize your applications. Infineon's renowned expertise ensures top-notch performance and reliability, while its compact design and versatile features make it ideal for a wide range of uses. Experience lightning-fast data transfer speeds, unparalleled endurance, and secure data protection with this advanced solution. Upgrade to the CY15E064J-SXE today and take your projects to new heights with unmatched efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the FRAM, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, making it ideal for automotive applications.

Operating Mode: SYNCHRONOUS

Enables synchronous operation with other components, improving overall system performance and efficiency.

Nominal Supply Voltage / Vsup (V): 5

Operates at a common supply voltage, ensuring compatibility with standard power sources.

No. of Terminals: 8

Provides a sufficient number of terminals for connecting the FRAM to other components in a system.

Package Style (Meter): SMALL OUTLINE

Compact package style helps in saving space on the PCB and makes it suitable for applications with limited board real estate.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, increasing the range of applications where the FRAM can be used.

Organization: 8KX8

Organized as 8Kx8, providing a good balance between memory capacity and data organization for efficient data storage.

Minimum Standby Voltage: 4.5 V

Can operate even at low standby voltages, ensuring power efficiency and battery savings in standby mode.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, making it suitable for automotive, industrial, and outdoor applications.

Terminal Position: DUAL

Dual terminal position provides flexibility in board layout and connection options, improving ease of integration in a design.

Write Protection: HARDWARE

Hardware-based write protection ensures data security by preventing accidental or unauthorized writing to the memory.

Maximum Seated Height: 1.727 mm

Low profile design with a small seated height allows for compact device designs and reduces overall system height.

Maximum Clock Frequency (fCLK): 1 MHz

Supports a high clock frequency for fast data transfer and processing, enhancing system performance.

Width: 3.8985 mm

Small width dimension allows for efficient use of board space and enables compact designs.

Minimum Supply Voltage (Vsup): 4.5 V

Allows operation at a low supply voltage, ensuring compatibility with various power sources and increasing design flexibility.

Length: 4.889 mm

Compact length dimension helps in space-constrained applications and contributes to overall size reduction in the system.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and compatibility with a wide range of digital systems.

Parallel or Serial: SERIAL

Serial communication interface simplifies data transfer and reduces pin count, making it suitable for space-constrained designs.

Terminal Form: GULL WING

Gull wing terminal form eases the soldering process and provides mechanical stability during assembly and operation.

Maximum Supply Current: 0.45 mA

Low supply current requirement helps in reducing power consumption and extending battery life in portable devices.

No. of Words: 8192 words

Provides ample storage capacity for storing data and program instructions in embedded systems.

Memory Width: 8

8-bit memory width allows for efficient data handling and processing, suitable for various applications.

Minimum Data Retention Time: 11

Long data retention time ensures data integrity and reliability, even in the absence of power.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy integration into PCB designs and assembly processes.

No. of Words Code: 8K

Denotes the memory capacity in words, providing a quick reference for the storage size of the FRAM.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FRAM is suitable for reflow soldering processes and has moderate moisture sensitivity.

Maximum Supply Voltage (Vsup): 5.5 V

Operates within a safe voltage range, protecting the device from overvoltage conditions and ensuring reliable performance.

Endurance: 10000000000000 Write/Erase Cycles

High endurance rating ensures long-lasting performance and reliable data storage for frequent read/write operations.

Serial Bus Type: I2C

I2C serial bus interface allows for easy integration with I2C-compatible devices and simplifies communication in multi-device systems.

Memory Density: 65536 bit

Offers a high memory density in a compact package, providing ample storage capacity for various data storage applications.

Memory IC Type: FRAM

Utilizes Ferroelectric RAM technology, which combines the best features of non-volatile and volatile memories for fast and reliable data storage.

Maximum Standby Current: 0.00004 Amp

Low standby current consumption helps in conserving power and extending battery life in standby mode.

Technical Specifications

FRAMs CY15E064J-SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.00004 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

.45 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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