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CY15E064Q-SXE

Infineon Technologies

CY15E064Q-SXE by Infineon Technologies

Infineon's CY15E064Q-SXE FRAM features 8Kx8 organization, 16MHz clock frequency, and SPI serial bus type. Ideal for automotive applications due to AEC-Q100 screening level, 125°C operating temp, and 10000000000000 write/erase cycles endurance.

Median Price

$3.758

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$2.910

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$2.910

-

-

-

Arrow

USA . 20 parts In-Stock

1+ parts

$4.579

100+ parts

-

1k+ parts

-

10k+ parts

-

20

$4.579

-

-

-

Mouser Electronics

USA . 225 parts In-Stock

1+ parts

$4.990

100+ parts

$4.210

1k+ parts

$3.690

10k+ parts

-

225

$4.990

$4.210

$3.690

-

DigiKey

USA . 178 parts In-Stock

1+ parts

$4.990

100+ parts

$4.309

1k+ parts

$4.041

10k+ parts

$3.952

178

$4.990

$4.309

$4.041

$3.952

Flip Electronics (Authorized)

USA . 69,094 parts In-Stock

1+ parts

-

100+ parts

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69,094

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Rochester

USA . 5,225 parts In-Stock

1+ parts

-

100+ parts

$2.620

1k+ parts

$2.350

10k+ parts

$2.210

5,225

-

$2.620

$2.350

$2.210

Verical

USA . 4,365 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.938

10k+ parts

$2.763

4,365

-

-

$2.938

$2.763

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 32 parts In-Stock

1+ parts

$2.764

100+ parts

-

1k+ parts

-

10k+ parts

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32

$2.764

-

-

-

Vyrian

USA . 21 parts In-Stock

1+ parts

$2.786

100+ parts

-

1k+ parts

-

10k+ parts

-

21

$2.786

-

-

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Flip Electronics

USA . 69,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

69,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 450 parts In-Stock

1+ parts

$2.619

100+ parts

-

1k+ parts

-

10k+ parts

-

450

$2.619

-

-

-

Component Stockers USA

USA . 717 parts In-Stock

1+ parts

$3.430

100+ parts

$3.910

1k+ parts

-

10k+ parts

-

717

$3.430

$3.910

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,488 parts In-Stock

1+ parts

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100+ parts

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16,488

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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10,000

-

-

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A-Z Elektronik GmbH

Germany . 4,725 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,725

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-

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Alle Elektronik GmbH

Germany . 3,150 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,150

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Native Components

USA . 712 parts In-Stock

1+ parts

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712

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Northwest PG Solutions

USA . 160 parts In-Stock

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160

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Overview

Unlock a world of possibilities with the CY15E064Q-SXE by Infineon Technologies, a cutting-edge FRAM memory IC that offers unparalleled quality and reliability. Designed with advanced technology and superior materials, this product is perfect for a wide range of applications. Its high endurance and fast operating mode make it stand out from the competition. Say goodbye to data loss or corruption with the hardware/software write protection feature, ensuring your information stays safe at all times. Invest in the future with Infineon Technologies and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the FRAM, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and convenient installation onto circuit boards, saving time and effort during assembly.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise and coordinated data transfer, improving overall system efficiency.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides a stable power source for the FRAM, optimizing performance and reliability.

Package Style (Meter): SMALL OUTLINE

Small outline packaging saves space on the circuit board, making this FRAM suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this FRAM can withstand harsh environmental conditions and maintain performance.

Maximum Clock Frequency (fCLK): 16 MHz

High clock frequency allows for fast data processing and access speed, enhancing overall system performance.

Memory Density: 65536 bit

High memory density enables storage of a large amount of data, making this FRAM suitable for applications requiring extensive data storage.

Technical Specifications

FRAMs CY15E064Q-SXE attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 105 DEGREE CENTIGRADE;2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

16 MHz

Minimum Data Retention Time:

11

Endurance:

10000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00003 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15E064Q-SXE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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