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FM25CL64B-DGTR

Infineon Technologies

FM25CL64B-DGTR by Infineon Technologies

FM25CL64B-DGTR by Infineon Technologies is a FRAM with 8KX8 organization, SPI serial bus type, and 20 MHz clock frequency. It operates at -40 to 85 °C and has 100000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data transfer and reliable non-volatile memory storage.

Median Price

$3.010

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,522 parts In-Stock

1+ parts

$2.760

100+ parts

$2.190

1k+ parts

$1.990

10k+ parts

-

2,522

$2.760

$2.190

$1.990

-

Newark

USA . 35 parts In-Stock

1+ parts

$3.010

100+ parts

$2.610

1k+ parts

$2.420

10k+ parts

-

35

$3.010

$2.610

$2.420

-

Chip1Stop

Japan . 1,093 parts In-Stock

1+ parts

$3.040

100+ parts

$2.670

1k+ parts

-

10k+ parts

-

1,093

$3.040

$2.670

-

-

Mouser Electronics

USA . 58 parts In-Stock

1+ parts

$3.630

100+ parts

$2.640

1k+ parts

$2.430

10k+ parts

$2.330

58

$3.630

$2.640

$2.430

$2.330

Element14

Singapore . 2,645 parts In-Stock

1+ parts

$3.797

100+ parts

$2.703

1k+ parts

$2.487

10k+ parts

-

2,645

$3.797

$2.703

$2.487

-

Flip Electronics (Authorized)

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Verical

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.300

10k+ parts

$2.175

3,780

-

-

$2.300

$2.175

Rochester

USA . 3,780 parts In-Stock

1+ parts

-

100+ parts

$2.060

1k+ parts

$1.840

10k+ parts

$1.740

3,780

-

$2.060

$1.840

$1.740

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 804 parts In-Stock

1+ parts

$2.176

100+ parts

-

1k+ parts

-

10k+ parts

-

804

$2.176

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$2.680

-

-

-

Flip Electronics

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,000

-

-

-

-

Vyrian

USA . 3,406 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,406

-

-

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.288

3,000

-

-

-

$2.288

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,314 parts In-Stock

1+ parts

$1.360

100+ parts

-

1k+ parts

-

10k+ parts

-

3,314

$1.360

-

-

-

Corphita

USA . 313 parts In-Stock

1+ parts

$2.061

100+ parts

-

1k+ parts

-

10k+ parts

-

313

$2.061

-

-

-

Continental Prestige Electronics

USA . 4,324 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

-

10k+ parts

$2.577

4,324

$2.630

-

-

$2.577

Argo Parts USA

USA . 2,473 parts In-Stock

1+ parts

$2.630

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$2.630

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

$2.680

100+ parts

-

1k+ parts

$2.546

10k+ parts

$2.492

50

$2.680

-

$2.546

$2.492

Lixinc

USA . 8,549 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,549

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,088 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,088

-

-

-

-

Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Alle Elektronik GmbH

Germany . 3,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,392

-

-

-

-

Advanced Electronics

New Zealand . 75 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

75

-

-

-

-

Overview

Experience the next level of data storage with the FM25CL64B-DGTR by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in their FRAMs category. This advanced memory device offers unparalleled value with its high endurance of 100 trillion write/erase cycles, ensuring long-lasting performance. Ideal for applications requiring fast read/write speeds and low power consumption, this product is a game-changer in the world of memory ICs. Upgrade your systems today with the FM25CL64B-DGTR and witness the difference it makes!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, ideal for portable electronic devices.

Surface Mount: YES

Allows for easy and convenient installation on PCBs.

Operating Mode: SYNCHRONOUS

Enables synchronous operation for efficient data transfer.

Nominal Supply Voltage / Vsup (V): 3.3

Standard voltage level for compatibility with various systems.

Power Supplies (V): 3.3

Consistent power supply for reliable performance.

No. of Terminals: 8

Simplified connections for ease of use.

Maximum Operating Temperature: 85 °C

Suitable for operation in a wide range of environmental conditions.

Organization: 8KX8

Organized memory structure for efficient data storage.

Memory Density: 65536 bit

High memory density for storing large amounts of data.

Endurance: 100000000000000 Write/Erase Cycles

Exceptional endurance for long-lasting usage.

Technical Specifications

FRAMs FM25CL64B-DGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

20 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

4.5 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

3.65 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

FM25CL64B-DGTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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