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FM25640B-G

Infineon Technologies

FM25640B-G by Infineon Technologies

Infineon's FM25640B-G FRAM offers 8Kx8 organization, operates at 5V with SPI serial bus type. Ideal for applications requiring high endurance, such as industrial automation and automotive systems. Compact rectangular package with small outline and gull wing terminals make it suitable for space-constrained designs.

Median Price

$3.390

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 22 parts In-Stock

1+ parts

$2.340

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$2.340

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Farnell

UK . 475 parts In-Stock

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$3.390

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$2.820

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$2.680

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475

$3.390

$2.820

$2.680

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Newark

USA . 637 parts In-Stock

1+ parts

$3.730

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$2.680

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637

$3.730

$2.680

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Mouser Electronics

USA . 377 parts In-Stock

1+ parts

$4.020

100+ parts

$3.400

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$3.090

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$2.890

377

$4.020

$3.400

$3.090

$2.890

Arrow

USA . 2,485 parts In-Stock

1+ parts

$4.547

100+ parts

$3.901

1k+ parts

$3.674

10k+ parts

$3.459

2,485

$4.547

$3.901

$3.674

$3.459

Element14

Singapore . 1,092 parts In-Stock

1+ parts

$4.914

100+ parts

$3.931

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$3.775

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1,092

$4.914

$3.931

$3.775

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Flip Electronics (Authorized)

USA . 108,379 parts In-Stock

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DigiKey

USA . 11,226 parts In-Stock

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$2.820

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Verical

USA . 11,226 parts In-Stock

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$1.638

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11,226

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$1.638

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Rochester

USA . 9,855 parts In-Stock

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$2.320

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$2.070

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$1.950

9,855

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$2.320

$2.070

$1.950

Future Electronics

Canada . 994 parts In-Stock

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$2.230

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$2.160

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994

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RS (Exports)

UK . 10 parts In-Stock

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$3.866

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$3.757

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10

-

$3.866

$3.757

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Distributors (In-Stock)

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Digiode

USA . 49 parts In-Stock

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$1.872

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49

$1.872

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Nova Conductors

Japan . 80 parts In-Stock

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$2.730

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80

$2.730

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Voyager Components

USA . 39 parts In-Stock

1+ parts

$3.342

100+ parts

$3.342

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$3.342

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$3.342

39

$3.342

$3.342

$3.342

$3.342

Flip Electronics

USA . 72,605 parts In-Stock

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Chip Stock

USA . 28,500 parts In-Stock

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Vyrian

USA . 13,260 parts In-Stock

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IBS Electronics

USA . 1,554 parts In-Stock

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$2.847

1k+ parts

$3.492

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1,554

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$2.847

$3.492

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LWI Electronics Inc

India . 495 parts In-Stock

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495

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Schukat

Germany . 440 parts In-Stock

1+ parts

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100+ parts

$1.989

1k+ parts

$1.902

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440

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$1.989

$1.902

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Rutronik

Germany . 388 parts In-Stock

1+ parts

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$2.630

388

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$2.630

DigiKey Marketplace

USA . 108 parts In-Stock

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ComSIT Distribution GmbH

Germany . 89 parts In-Stock

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ComSIT USA

USA . 89 parts In-Stock

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Sensible Micro Corp

USA . 58 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 41 parts In-Stock

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Cyclops Electronics Ltd

UK . 29 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1 parts In-Stock

1+ parts

$1.773

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1

$1.773

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Benley Electronics

USA . 3 parts In-Stock

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$2.000

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Netroflash

USA . 1,000 parts In-Stock

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$2.730

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Component Stockers USA

USA . 11,469 parts In-Stock

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$3.540

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$3.190

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$3.120

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Continental Prestige Electronics

USA . 1,868 parts In-Stock

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$5.060

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$3.620

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QUARKTWIN TECHNOLOGY LTD

USA . 20,078 parts In-Stock

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Perfect Parts

USA . 10,786 parts In-Stock

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Kepictronics

USA . 10,680 parts In-Stock

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GreenTree Electronics

Israel . 1,940 parts In-Stock

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Argo Parts USA

USA . 1,049 parts In-Stock

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Metaverse IC Inc.

Canada . 682 parts In-Stock

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682

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Assy Fe

Spain . 100 parts In-Stock

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Overview

Unlock the power of reliable and high-quality data storage with the FM25640B-G by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies offers FRAMs that provide exceptional durability, speed, and efficiency for a wide range of applications. With its advanced features and innovative technology, this product ensures seamless operation and secure data storage. Experience the value and benefits of superior performance with the FM25640B-G, making it the ideal choice for all your memory needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the FRAM, making it suitable for various environments.

Surface Mount: YES

The surface mount capability allows for easy installation on PCBs, saving space and making the integration process more efficient.

Operating Mode: SYNCHRONOUS

The synchronous operation ensures data is transferred efficiently and accurately within the FRAM, enhancing overall performance.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides sufficient power to the FRAM for reliable operation and data retention.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Technology: CMOS

The CMOS technology offers low power consumption and high speed operation, contributing to energy efficiency and faster data processing.

Memory IC Type: FRAM

The FRAM (Ferroelectric RAM) technology combines the advantages of both non-volatile memory and RAM, providing fast read/write speeds and high endurance.

Technical Specifications

FRAMs FM25640B-G attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G8

Length:

4.889 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.727 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00001 Amp

Minimum Standby Voltage:

4.5 V

Maximum Supply Current:

4 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.8985 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

FM25640B-G Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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