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FM24CL64B-DG

Infineon Technologies

FM24CL64B-DG by Infineon Technologies

FM24CL64B-DG by Infineon Technologies is a FRAM with 8KX8 organization, 8192 words, and 65536 bit memory density. It operates at 1 MHz clock frequency on a 3.3V supply, suitable for applications requiring high endurance like IoT devices.

Median Price

$2.716

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 89 parts In-Stock

1+ parts

$2.710

100+ parts

$2.590

1k+ parts

-

10k+ parts

-

89

$2.710

$2.590

-

-

Arrow

USA . 20 parts In-Stock

1+ parts

$2.722

100+ parts

$2.464

1k+ parts

$2.392

10k+ parts

$2.316

20

$2.722

$2.464

$2.392

$2.316

DigiKey

USA . 2,304 parts In-Stock

1+ parts

$3.930

100+ parts

$3.425

1k+ parts

$3.197

10k+ parts

$3.125

2,304

$3.930

$3.425

$3.197

$3.125

Mouser Electronics

USA . 1,420 parts In-Stock

1+ parts

$3.930

100+ parts

$3.350

1k+ parts

$3.130

10k+ parts

$3.070

1,420

$3.930

$3.350

$3.130

$3.070

Rochester

USA . 31 parts In-Stock

1+ parts

-

100+ parts

$2.680

1k+ parts

$2.400

10k+ parts

$2.260

31

-

$2.680

$2.400

$2.260

Verical

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$2.464

1k+ parts

$2.392

10k+ parts

$2.316

20

-

$2.464

$2.392

$2.316

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 883 parts In-Stock

1+ parts

$2.840

100+ parts

-

1k+ parts

-

10k+ parts

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883

$2.840

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$3.289

100+ parts

-

1k+ parts

-

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10

$3.289

-

-

-

TME

Poland . 936 parts In-Stock

1+ parts

$5.370

100+ parts

-

1k+ parts

-

10k+ parts

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936

$5.370

-

-

-

Schukat

Germany . 756 parts In-Stock

1+ parts

-

100+ parts

$3.650

1k+ parts

$3.487

10k+ parts

-

756

-

$3.650

$3.487

-

Vyrian

USA . 590 parts In-Stock

1+ parts

-

100+ parts

-

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590

-

-

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Flip Electronics

USA . 519 parts In-Stock

1+ parts

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519

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Technoshack Inc.

Canada . 163 parts In-Stock

1+ parts

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163

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 85 parts In-Stock

1+ parts

$2.691

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$2.691

-

-

-

Component Stockers USA

USA . 2,766 parts In-Stock

1+ parts

$3.040

100+ parts

$2.600

1k+ parts

$3.160

10k+ parts

-

2,766

$3.040

$2.600

$3.160

-

Continental Prestige Electronics

USA . 4,792 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

-

10k+ parts

$3.126

4,792

$3.190

-

-

$3.126

Argo Parts USA

USA . 1,462 parts In-Stock

1+ parts

$3.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,462

$3.190

-

-

-

Bastille Electronics

Australia . 40 parts In-Stock

1+ parts

$3.289

100+ parts

$3.125

1k+ parts

$2.968

10k+ parts

$2.927

40

$3.289

$3.125

$2.968

$2.927

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$3.700

100+ parts

$3.404

1k+ parts

$3.190

10k+ parts

-

550

$3.700

$3.404

$3.190

-

Lixinc

USA . 10,838 parts In-Stock

1+ parts

-

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10,838

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GreenTree Electronics

Israel . 5,057 parts In-Stock

1+ parts

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5,057

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QUARKTWIN TECHNOLOGY LTD

USA . 4,941 parts In-Stock

1+ parts

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4,941

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Perfect Parts

USA . 3,565 parts In-Stock

1+ parts

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3,565

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Kepictronics

USA . 2,171 parts In-Stock

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2,171

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Glotronic Ltd.

UK . 1,175 parts In-Stock

1+ parts

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1,175

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Robosynatics

Brazil . 900 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.263

10k+ parts

$0.263

900

-

$0.263

$0.263

$0.263

Lucentia Tech

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.263

10k+ parts

$0.263

900

-

$0.263

$0.263

$0.263

Metaverse IC Inc.

Canada . 494 parts In-Stock

1+ parts

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494

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Assy Fe

Spain . 394 parts In-Stock

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394

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Overview

Unlock a world of possibilities with the FM24CL64B-DG by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality FRAMs that are perfect for a wide range of applications. With its advanced features and reliable performance, this product offers customers unparalleled value and benefits. Say goodbye to data loss worries and experience the convenience and efficiency that this product brings to your projects. Join the countless satisfied customers who have already made the switch to Infineon's FM24CL64B-DG and elevate your work to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability in various operating conditions, making it a good choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and integration into compact electronic devices, making it a convenient choice for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized design for easy handling and mounting, making it a versatile choice for different PCB layouts.

Operating Mode: SYNCHRONOUS

The synchronous operating mode enhances data transfer efficiency and speed, making it a reliable choice for high-performance applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V ensures compatibility with a wide range of systems, making it a versatile choice for various applications.

Power Supplies (V): 3/3.3

Supporting both 3V and 3.3V power supplies offers flexibility in design and compatibility with different voltage requirements, making it a versatile choice for various electronic systems.

No. of Terminals: 8

With 8 terminals, this FRAM provides sufficient connectivity options for interfacing with other components, making it a versatile choice for different circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style optimizes space utilization and thermal management, making it an efficient choice for compact designs.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C ensures stable performance in varying environmental conditions, making it a reliable choice for industrial applications.

Organization: 8KX8

With an organizational structure of 8KX8, this FRAM offers a balanced memory configuration for efficient data storage and retrieval, making it a versatile choice for memory-intensive applications.

Minimum Standby Voltage: 2.7 V

The minimum standby voltage of 2.7V ensures power efficiency during idle periods, making it a cost-effective choice for energy-conscious applications.

Technical Specifications

FRAMs FM24CL64B-DG attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

ALSO OPERATES WITH 0.4 MHZ AND 0.1 MHZ :2KV ESD AVAILABLE

Maximum Clock Frequency (fCLK):

1 MHz

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

Length:

4.5 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.16,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.85 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000006 Amp

Minimum Standby Voltage:

2.7 V

Sub-Category:

SRAMs

Maximum Supply Current:

.3 mA

Maximum Supply Voltage (Vsup):

3.65 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

4 mm

Write Protection:

HARDWARE

Trade Compliance

FM24CL64B-DG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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