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CY15V104QN-50LPXI

Infineon Technologies

CY15V104QN-50LPXI by Infineon Technologies

Infineon CY15V104QN-50LPXI FRAM offers 512Kx8 organization, operates at 50MHz clock frequency, and has 1000000000000000 write/erase cycles endurance. Ideal for applications requiring high-speed data storage with low power consumption in compact designs.

Median Price

$16.780

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$20.475

1k+ parts

$18.313

10k+ parts

$17.238

356

-

$20.475

$18.313

$17.238

Rochester

USA . 356 parts In-Stock

1+ parts

-

100+ parts

$16.380

1k+ parts

$14.650

10k+ parts

$13.790

356

-

$16.380

$14.650

$13.790

DigiKey

USA . 88 parts In-Stock

1+ parts

-

100+ parts

$16.780

1k+ parts

-

10k+ parts

-

88

-

$16.780

-

-

Flip Electronics (Authorized)

USA . 88 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

88

-

-

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 20 parts In-Stock

1+ parts

$16.109

100+ parts

$14.820

1k+ parts

-

10k+ parts

-

20

$16.109

$14.820

-

-

Vyrian

USA . 74 parts In-Stock

1+ parts

$16.780

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$16.780

-

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Flip Electronics

USA . 3,028 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

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3,028

-

-

-

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Digiode

USA . 871 parts In-Stock

1+ parts

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871

-

-

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Nova Conductors

Japan . 40 parts In-Stock

1+ parts

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40

-

-

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Dan-Mar Components

USA . 20 parts In-Stock

1+ parts

-

100+ parts

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20

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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10

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,548 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,548

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

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Continental Prestige Electronics

USA . 2,593 parts In-Stock

1+ parts

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2,593

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Corphita

USA . 684 parts In-Stock

1+ parts

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684

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Aranea Global

USA . 500 parts In-Stock

1+ parts

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500

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Overview

Unlock the power of cutting-edge technology with the CY15V104QN-50LPXI by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies delivers top-quality FRAMs for a wide range of applications. This product stands out with its high performance and reliability, providing customers with unmatched value and benefits. Experience seamless operation and enhanced efficiency with the CY15V104QN-50LPXI, a game-changer in memory technology. Elevate your projects to new heights with this innovative solution from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protects the internal components of the FRAM, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, making it suitable for mass production and assembly.

Operating Mode: SYNCHRONOUS

Enhances data transfer speed and efficiency, making the FRAM ideal for high-performance applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low voltage, resulting in lower power consumption and longer battery life.

Organization: 512KX8

Offers a large memory capacity and data organization, suitable for storing and accessing a significant amount of information.

Write Protection: HARDWARE/SOFTWARE

Ensures the security and integrity of stored data by allowing selective protection against unauthorized write operations.

Technology: CMOS

Utilizes low power consumption and high noise immunity, making the FRAM energy-efficient and reliable in various operating environments.

Endurance: 1000000000000000 Write/Erase Cycles

Withstands a high number of write and erase cycles, increasing the lifespan and reliability of the FRAM.

Serial Bus Type: SPI

Supports a high-speed serial communication interface, allowing for fast and efficient data transfer between the FRAM and other devices.

Technical Specifications

FRAMs CY15V104QN-50LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

50 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.000065 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3.7 mA

Maximum Supply Voltage (Vsup):

1.89 V

Minimum Supply Voltage (Vsup):

1.71 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15V104QN-50LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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