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FM1808B-SGTR

Infineon Technologies

FM1808B-SGTR by Infineon Technologies

FM1808B-SGTR by Infineon Technologies is a 32Kx8 FRAM with 100T write/erase cycles. Operating at 5V, it has a max access time of 70ns and endurance of 262144 bits. Ideal for applications requiring fast, non-volatile memory storage in small outline packages.

Median Price

$12.635

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,766 parts In-Stock

1+ parts

$12.250

100+ parts

$10.487

1k+ parts

$9.911

10k+ parts

-

1,766

$12.250

$10.487

$9.911

-

Farnell

UK . 12 parts In-Stock

1+ parts

$13.020

100+ parts

$11.140

1k+ parts

-

10k+ parts

-

12

$13.020

$11.140

-

-

Chip1Stop

Japan . 295 parts In-Stock

1+ parts

$14.000

100+ parts

-

1k+ parts

-

10k+ parts

-

295

$14.000

-

-

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$15.320

100+ parts

$13.110

1k+ parts

$12.040

10k+ parts

-

4

$15.320

$13.110

$12.040

-

Newark

USA . 15 parts In-Stock

1+ parts

$19.590

100+ parts

$16.770

1k+ parts

$15.810

10k+ parts

-

15

$19.590

$16.770

$15.810

-

Element14

Singapore . 12 parts In-Stock

1+ parts

$20.380

100+ parts

$17.450

1k+ parts

-

10k+ parts

-

12

$20.380

$17.450

-

-

Flip Electronics (Authorized)

USA . 18,140 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

18,140

-

-

-

-

Arrow

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.217

10k+ parts

-

2,000

-

-

$10.217

-

Verical

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$10.217

10k+ parts

-

2,000

-

-

$10.217

-

Rochester

USA . 1,203 parts In-Stock

1+ parts

-

100+ parts

$8.390

1k+ parts

$7.510

10k+ parts

$7.060

1,203

-

$8.390

$7.510

$7.060

Future Electronics

Canada . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.030

10k+ parts

-

1,000

-

-

$8.030

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 863 parts In-Stock

1+ parts

$8.854

100+ parts

-

1k+ parts

-

10k+ parts

-

863

$8.854

-

-

-

Vyrian

USA . 977 parts In-Stock

1+ parts

$9.000

100+ parts

-

1k+ parts

-

10k+ parts

-

977

$9.000

-

-

-

Flip Electronics

USA . 12,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,461

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 151 parts In-Stock

1+ parts

$1.340

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$1.340

-

-

-

Northwest PG Solutions

USA . 2,157 parts In-Stock

1+ parts

$1.474

100+ parts

-

1k+ parts

-

10k+ parts

-

2,157

$1.474

-

-

-

Corphita

USA . 322 parts In-Stock

1+ parts

$8.388

100+ parts

-

1k+ parts

-

10k+ parts

-

322

$8.388

-

-

-

A-Z Elektronik GmbH

Germany . 9,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,398

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,500

-

-

-

-

Overview

Unlock the power of reliable data storage with the FM1808B-SGTR by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality FRAMs designed for a wide range of applications. With its high-endurance write/erase cycles and fast access time, this product ensures seamless performance for your projects. Say goodbye to data loss worries and hello to the benefits of secure memory storage with the FM1808B-SGTR. Elevate your technology experience today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the FRAM, making it suitable for various environments.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access and processing, enhancing overall performance.

Nominal Supply Voltage (Vsup): 5V

Standard voltage requirement ensures compatibility with a wide range of systems and power sources.

Memory IC Type: FRAM

FRAM technology offers fast read and write speeds, high endurance, and low power consumption, making it a superior choice for memory applications.

Endurance: 100,000,000,000,000 Write/Erase Cycles

High endurance capability ensures a long lifespan and reliable performance for the FRAM.

Technical Specifications

FRAMs FM1808B-SGTR attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Maximum Access Time:

70 ns

Additional Features:

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

Minimum Data Retention Time:

10

Endurance:

100000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-G28

Length:

17.905 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

32KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.67 mm

Maximum Standby Current:

.00005 Amp

Minimum Standby Voltage:

4.5 V

Sub-Category:

SRAMs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

PURE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.505 mm

Trade Compliance

FM1808B-SGTR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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