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CY15B108QN-40LPXI

Infineon Technologies

CY15B108QN-40LPXI by Infineon Technologies

Infineon's CY15B108QN-40LPXI is a 1MX8 FRAM with 40MHz clock frequency, SPI serial bus, and 3.3V supply voltage. It offers 1000000000000000 write/erase cycles endurance for applications requiring high-speed non-volatile memory in compact designs.

Median Price

$32.675

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 360 parts In-Stock

1+ parts

$45.930

100+ parts

$39.066

1k+ parts

-

10k+ parts

-

360

$45.930

$39.066

-

-

Rochester

USA . 1,455 parts In-Stock

1+ parts

-

100+ parts

$26.210

1k+ parts

$23.450

10k+ parts

$22.070

1,455

-

$26.210

$23.450

$22.070

Verical

USA . 656 parts In-Stock

1+ parts

-

100+ parts

$32.675

1k+ parts

$29.238

10k+ parts

$27.525

656

-

$32.675

$29.238

$27.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 268 parts In-Stock

1+ parts

$27.674

100+ parts

-

1k+ parts

-

10k+ parts

-

268

$27.674

-

-

-

Nova Conductors

Japan . 86 parts In-Stock

1+ parts

$34.047

100+ parts

-

1k+ parts

-

10k+ parts

-

86

$34.047

-

-

-

Vyrian

USA . 1,562 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,562

-

-

-

-

Flip Electronics

USA . 490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

490

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,558 parts In-Stock

1+ parts

$24.760

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$24.760

-

-

-

Corphita

USA . 234 parts In-Stock

1+ parts

$26.217

100+ parts

-

1k+ parts

-

10k+ parts

-

234

$26.217

-

-

-

Component Stockers USA

USA . 1,914 parts In-Stock

1+ parts

$29.400

100+ parts

$26.690

1k+ parts

$26.490

10k+ parts

-

1,914

$29.400

$26.690

$26.490

-

Continental Prestige Electronics

USA . 2,535 parts In-Stock

1+ parts

$34.047

100+ parts

-

1k+ parts

-

10k+ parts

$33.366

2,535

$34.047

-

-

$33.366

Semicontronic

India . 1,400 parts In-Stock

1+ parts

$53.890

100+ parts

$52.543

1k+ parts

$52.273

10k+ parts

-

1,400

$53.890

$52.543

$52.273

-

Argo Parts USA

USA . 3,223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,223

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$33.366

1k+ parts

$32.344

10k+ parts

$31.663

100

-

$33.366

$32.344

$31.663

Overview

Unlock endless possibilities with the CY15B108QN-40LPXI by Infineon Technologies, a cutting-edge FRAM memory solution. Infineon's reputation for quality and innovation shines through in this product, offering unparalleled reliability and performance. Ideal for applications requiring high endurance and low power consumption, this memory device delivers value by maximizing efficiency and minimizing downtime. Experience seamless integration and superior functionality with the CY15B108QN-40LPXI, the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation onto circuit boards.

Operating Mode: SYNCHRONOUS

Enables synchronized operations for improved performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3.3

Optimal supply voltage for stable and efficient operation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for various environments.

No. of Terminals: 8

Provides the necessary connections for interfacing with other components.

Write Protection: HARDWARE/SOFTWARE

Enhances security by allowing different levels of protection for data stored in the memory.

Technology: CMOS

Utilizes low power consumption CMOS technology for energy efficiency.

Memory IC Type: FRAM

Utilizes Ferroelectric Random Access Memory technology for high-speed read/write capabilities and non-volatile storage.

Technical Specifications

FRAMs CY15B108QN-40LPXI attributes and parameters. Explore more FRAMs devices from Infineon Technologies

Specs

Additional Features:

2kv ESD available

Maximum Clock Frequency (fCLK):

40 MHz

Minimum Data Retention Time:

10

Endurance:

1000000000000000 Write/Erase Cycles

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3.28 mm

Memory Density:

8388608 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1048576 words

No. of Words Code:

1M

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1MX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Serial Bus Type:

SPI

Maximum Standby Current:

.00012 Amp

Minimum Standby Voltage:

1.8 V

Maximum Supply Current:

3.2 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3.23 mm

Write Protection:

HARDWARE/SOFTWARE

Trade Compliance

CY15B108QN-40LPXI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.1.B.2

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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