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HPA02292SQ/NOPB

Texas Instruments

HPA02292SQ/NOPB by Texas Instruments

HPA02292SQ/NOPB by Texas Instruments is a 16-terminal analog data transmission interface in a square chip carrier package. Operating temperature range from -40 to 85°C, with a supply voltage of 3.3V and data rate of 2970 Mbps. Ideal for telecom applications requiring line equalization at industrial temperatures.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,439 parts In-Stock

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4,439

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Digiode

USA . 4,024 parts In-Stock

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Nova Conductors

Japan . 82 parts In-Stock

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82

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Distributors (Availability)

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Parana Technologies

USA . 2,290 parts In-Stock

1+ parts

$6.658

100+ parts

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$7.368

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2,290

$6.658

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$7.368

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DigiPath Technology Company

USA . 704 parts In-Stock

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$7.331

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$6.745

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704

$7.331

$6.745

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ChromeModa Solutions

Germany . 4,923 parts In-Stock

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$7.481

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$6.134

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$7.481

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IDEA Electronic Components Group

UK . 2,137 parts In-Stock

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$7.481

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$6.733

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2,137

$7.481

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$6.733

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AZTECH Wire

Italy . 888 parts In-Stock

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$16.408

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888

$16.408

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One Stop Electronics

USA . 1,083 parts In-Stock

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$376.000

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$376.000

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Ampacity Inc.

Singapore . 606 parts In-Stock

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$794.000

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$794.000

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Microchip USA

USA . 2,217 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Perfect Parts

USA . 672 parts In-Stock

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Corphita

USA . 656 parts In-Stock

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Overview

Unlock unparalleled data transmission performance with the HPA02292SQ/NOPB by Texas Instruments. As a leader in analog data transmission interfaces, Texas Instruments delivers exceptional quality and reliability in every product. This SQUARE package chip carrier boasts a very thin profile and matte tin terminal finish for seamless integration. Ideal for industrial applications, this LINE EQUALIZER offers a blazing fast data rate of 2970 Mbps at a nominal supply voltage of 3.3 V. Elevate your projects with the unmatched value and benefits of Texas Instruments' HPA02292SQ/NOPB.

Feature Benefit Bullets

Surface Mount: YES

Enables easy and efficient installation onto a printed circuit board, saving time and labor costs.

No. of Terminals: 16

Provides sufficient connectivity options for a variety of applications.

Maximum Operating Temperature: 85 °C

Allows for reliable operation in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

Enhances solderability and conductivity for stable connections.

Maximum Seated Height: 0.8 mm

Facilitates a low-profile design to fit in compact spaces.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during manufacturing processes.

Nominal Supply Voltage: 3.3 V

Operates efficiently with a common and easily accessible voltage level.

Data Rate: 2970 Mbps

High data rate capability for fast and reliable transmission of analog signals.

Technical Specifications

Analog Data Transmission Interfaces HPA02292SQ/NOPB attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

Data Rate:

2970 Mbps

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Current:

.1 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

HPA02292SQ/NOPB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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