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MAX3784UTET

Analog Devices

MAX3784UTET by Analog Devices

Analog Devices' MAX3784UTET is a 16-terminal analog data transmission interface with 3.3V supply voltage, operating b/w 0-85 °C. It features a square surface mount package style and matte tin terminal finish, suitable for telecom applications as a line equalizer IC.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,793 parts In-Stock

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6,793

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Digiode

USA . 1,213 parts In-Stock

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1,213

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Anansix

USA . 349 parts In-Stock

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349

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Distributors (Availability)

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MARBEL Systems

Belgium . 1,748 parts In-Stock

1+ parts

$12.703

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1,748

$12.703

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Texas Native Microelectronics

USA . 1,906 parts In-Stock

1+ parts

$14.601

100+ parts

$14.017

1k+ parts

$13.579

10k+ parts

$12.849

1,906

$14.601

$14.017

$13.579

$12.849

AZTECH Wire

Italy . 454 parts In-Stock

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$16.224

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454

$16.224

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Kenton Components

USA . 2,377 parts In-Stock

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$17.521

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$15.419

2,377

$17.521

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$15.419

Qasali Group International

UK . 450 parts In-Stock

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$39.423

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450

$39.423

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One Stop Electronics

USA . 1,407 parts In-Stock

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$455.000

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1,407

$455.000

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Semicontronic

India . 1,521 parts In-Stock

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$788.000

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$768.300

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$764.360

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1,521

$788.000

$768.300

$764.360

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Corphita

USA . 1,110 parts In-Stock

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Overview

Enhance your data transmission with the MAX3784UTET from Analog Devices, a leading manufacturer known for top-quality analog interfaces. Designed for efficiency and reliability, this product offers seamless communication in various applications. With a compact square package and a 3.3V power supply, the MAX3784UTET is the perfect solution for your needs. Trust Analog Devices to deliver unparalleled performance and value, giving you the competitive edge you need. Experience the benefits of cutting-edge technology with the MAX3784UTET today!

Feature Benefit Bullets

Surface Mount: YES

Provides efficient and reliable connection to the PCB, making installation and maintenance easier.

Package Shape: SQUARE

Compact and space-saving design, ideal for applications where board space is limited.

Power Supplies (V): 3.3

Operates on a commonly available voltage, ensuring compatibility with existing systems.

No. of Terminals: 16

Offers multiple connection points for enhanced functionality and versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Combination of packaging styles allows for efficient heat dissipation and compact form factor.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for a wide range of operating environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold temperatures, ensuring reliable performance in various conditions.

Terminal Finish: MATTE TIN

Provides excellent solderability and corrosion resistance for durable connections.

Terminal Position: QUAD

Quad terminal layout allows for secure and stable connections on the PCB.

Maximum Seated Height: 0.8 mm

Low profile design minimizes board space requirements and enables compact layouts.

Width: 4 mm

Compact width dimensions facilitate integration into tight spaces or densely populated PCBs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

Capable of withstanding high reflow temperatures, ensuring robust solder connections.

Length: 4 mm

Compact length dimensions make it suitable for space-constrained applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safer for manufacturing and disposal.

Telecom IC Type: LINE EQUALIZER

Specifically designed for telecom applications to enhance signal quality and transmission performance.

Nominal Supply Voltage: 3.3 V

Compatible with standard voltage supplies, ensuring seamless integration into existing systems.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and increased connectivity within a limited space.

Technical Specifications

Analog Data Transmission Interfaces MAX3784UTET attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.16SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Analog Transmission Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

MAX3784UTET Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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