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L3235T

STMicroelectronics

L3235T by STMicroelectronics

STMicroelectronics L3235T is a SLIC telecom IC with +-5V power supplies, 28 terminals in a square chip carrier package. Operating b/w 0-70 °C, it has -48V battery supply and 5V nominal voltage for analog data transmission interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,849 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,849

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Anansix

USA . 1,353 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,353

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-

-

-

Digiode

USA . 832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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832

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 464 parts In-Stock

1+ parts

$5.548

100+ parts

-

1k+ parts

$4.993

10k+ parts

-

464

$5.548

-

$4.993

-

MKK Technologies

India . 338 parts In-Stock

1+ parts

$10.432

100+ parts

-

1k+ parts

-

10k+ parts

-

338

$10.432

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-

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DigiPath Technology Company

USA . 338 parts In-Stock

1+ parts

$10.432

100+ parts

-

1k+ parts

-

10k+ parts

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338

$10.432

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-

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Corphita

USA . 1,388 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,388

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-

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Parana Technologies

USA . 1,071 parts In-Stock

1+ parts

-

100+ parts

$6.633

1k+ parts

-

10k+ parts

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1,071

-

$6.633

-

-

Overview

Unleash the power of seamless analog data transmission with the L3235T by STMicroelectronics. Crafted with precision and expertise, this innovative solution offers unparalleled quality and reliability. From telecom applications to industrial automation, this versatile product caters to a wide range of needs with its cutting-edge technology and superior performance. Elevate your projects with the value and benefits that only STMicroelectronics can deliver. Choose the L3235T and experience a world of possibilities at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and making the product suitable for compact designs.

Power Supplies (V): +-5

Allows for flexibility in power input, making the product compatible with a range of power sources.

No. of Terminals: 28

Provides multiple connection points for interfacing with other components, enhancing the product's functionality.

Maximum Operating Temperature: 70 °C

Ensures reliable performance even in high-temperature environments, making the product suitable for various applications.

Technology: BIPOLAR

Offers high-speed and high-power operation, making the product ideal for applications requiring quick data transmission.

Nominal Supply Voltage: 5 V

Provides a stable and common voltage level, ensuring compatibility with many other devices and systems.

Telecom IC Type: SLIC

Specifically designed for telecommunications applications, ensuring reliable and efficient data transmission in such environments.

Technical Specifications

Analog Data Transmission Interfaces L3235T attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

Battery Supply (V):

-48

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Analog Transmission Interfaces

Maximum Supply Current:

8 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

L3235T Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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