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L3235N

STMicroelectronics

L3235N by STMicroelectronics

L3235N by STMicroelectronics is a low-profile, square telecom IC designed for analog data transmission. It operates with ±5V power supplies and features 44 terminals in a gull-wing configuration. Ideal for hybrid 2-4 conversion applications, it withstands temperatures up to 70 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,927 parts In-Stock

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3,927

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Anansix

USA . 2,875 parts In-Stock

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2,875

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Vyrian

USA . 996 parts In-Stock

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996

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IDEA Electronic Components Group

UK . 472 parts In-Stock

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$9.621

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-

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$8.659

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472

$9.621

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$8.659

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MKK Technologies

India . 1,904 parts In-Stock

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$18.092

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1,904

$18.092

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DigiPath Technology Company

USA . 1,904 parts In-Stock

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$18.092

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1,904

$18.092

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A-Z Elektronik GmbH

Germany . 6,153 parts In-Stock

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6,153

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Alle Elektronik GmbH

Germany . 4,102 parts In-Stock

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4,102

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RC Electronics

USA . 2,700 parts In-Stock

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Corphita

USA . 2,268 parts In-Stock

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2,268

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Parana Technologies

USA . 1,453 parts In-Stock

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$11.504

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$11.504

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Kepictronics

USA . 100 parts In-Stock

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100

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Overview

Elevate your designs with the L3235N from STMicroelectronics, a leader in innovative analog data transmission solutions. This low-profile, reliable interface ensures seamless connectivity in various applications, from telecommunications to industrial automation. With STMicroelectronics' commitment to quality and performance, you gain unmatched durability and efficiency, empowering your projects with superior signal integrity and robust operation under diverse conditions. Choose the L3235N for trusted performance that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy construction ensures long-term reliability and reduces the impact of environmental factors, making it an ideal choice for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern PCB designs, promoting efficient space utilization and manufacturability.

Package Shape: SQUARE

The square package shape provides a compact footprint, facilitating dense circuit designs and improving performance in space-limited applications.

Power Supplies (V): +-5

Supports dual power supplies, which improves flexibility in system design and allows for optimal performance across various operating conditions.

No. of Terminals: 44

The high terminal count enhances connectivity options, enabling complex interfaces and functionalities within a single component.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design minimizes height while maximizing surface area, beneficial for high-density installations and thermal management.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this product can function in challenging environments without compromising reliability.

Battery Supply (V): -48

Compatible with a wide range of battery supplies, it allows integration into systems using various power sources, enhancing versatility.

Minimum Operating Temperature: 0 °C

This ensures the product can operate in a broad range of climates, making it suitable for diverse applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and offers superior corrosion resistance, which contributes to long-term reliability.

Terminal Position: QUAD

A quad terminal positioning optimizes space while ensuring stable connections, reducing the risk of signal loss in high-frequency applications.

Maximum Seated Height: 1.6 mm

The low seated height allows for smoother airflow in miniaturized designs, aiding in thermal management and device performance.

Width: 10 mm

The standard width allows for compatibility with various layouts, enhancing integration into existing designs.

Battery Feed: RESISTIVE

The resistive battery feed improves power management options, allowing for efficient energy consumption in various settings.

Length: 10 mm

Maintaining a compact length, this product can be easily integrated into confined spaces without sacrificing performance.

Temperature Grade: COMMERCIAL

As a commercial-grade component, it balances performance and cost, making it suitable for widespread applications in consumer and industrial markets.

Technology: BIPOLAR

Utilizing bipolar technology improves signal fidelity and allows for enhanced processing capabilities, making it ideal for analog applications.

Nominal Negative Supply Voltage: -5 V

The specific negative supply voltage provides a standard reference point for applications requiring stability in bipolar operation.

Terminal Form: GULL WING

The gull wing terminal form improves solder joint reliability and ease of handling during manufacturing processes.

Telecom IC Type: SLIC

Designed specifically for telecommunications applications, ensuring optimal performance and compatibility with associated equipment.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V enhances compatibility with a range of digital systems, making integration simpler.

Hybrid 2-4 CONVERSION

This feature allows for versatile signal conversion, making it highly applicable in modern communication systems that require hybrid architectures.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for high-density mounting while still maintaining reliability in mechanical and electrical connections.

Technical Specifications

Analog Data Transmission Interfaces L3235N attributes and parameters. Explore more Analog Data Transmission Interfaces devices from STMicroelectronics

Specs

Battery Feed:

RESISTIVE

Battery Supply (V):

-48

Hybrid:

2-4 CONVERSION

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

Nominal Negative Supply Voltage:

-5 V

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Analog Transmission Interfaces

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

L3235N Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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