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DS80EP100

Texas Instruments

DS80EP100 by Texas Instruments

DS80EP100 by Texas Instruments is a small outline, heat sink package with 6 terminals. It operates in industrial temperature range (-40 to 85 °C) and serves as a line equalizer for analog data transmission interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,963 parts In-Stock

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Digiode

USA . 2,120 parts In-Stock

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Anansix

USA . 1,533 parts In-Stock

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Native Components

USA . 99 parts In-Stock

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$0.851

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99

$0.851

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Northwest PG Solutions

USA . 916 parts In-Stock

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$0.936

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916

$0.936

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Parana Technologies

USA . 1,915 parts In-Stock

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$13.386

100+ parts

$1,243.056

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$12.047

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1,915

$13.386

$1,243.056

$12.047

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DigiPath Technology Company

USA . 192 parts In-Stock

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$14.739

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$13.560

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192

$14.739

$13.560

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ChromeModa Solutions

Germany . 1,119 parts In-Stock

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$15.040

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$12.333

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$15.040

$12.333

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IDEA Electronic Components Group

UK . 562 parts In-Stock

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$15.040

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$14.288

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$13.536

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562

$15.040

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$13.536

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AZTECH Wire

Italy . 620 parts In-Stock

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$17.360

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One Stop Electronics

USA . 647 parts In-Stock

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$214.000

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Corphita

USA . 3,927 parts In-Stock

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Overview

Looking for high-quality analog data transmission interfaces? Look no further than the DS80EP100 by Texas Instruments. This top-notch product is designed with precision and reliability in mind, making it an ideal choice for a wide range of applications. Whether you're in need of line equalizers for telecom systems or any other analog data transmission interface, this product offers exceptional value, benefits, and advantages to meet your needs. Upgrade your systems with the DS80EP100 and experience the difference today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount option makes it easier to integrate this product into compact and densely populated circuit boards.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB, enabling a more streamlined and compact design.

No. of Terminals: 6

Having 6 terminals provides multiple connection points, offering flexibility in circuit design and connectivity options.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style enhances thermal dissipation and allows for a more compact overall design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this product can withstand cold temperature environments without compromising functionality.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connection, making the product more robust.

Maximum Seated Height: 0.8 mm

The low maximum seated height of 0.8 mm allows for a slim profile, contributing to space-saving and compact designs.

Width: 2.2 mm

Narrow width of 2.2 mm enables efficient utilization of space on the PCB, especially in tight layouts.

Length: 2.5 mm

The short length of 2.5 mm helps in creating compact and space-efficient circuit board designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh environments typically found in industrial applications.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and compliant with regulations, making it a sustainable choice for green initiatives.

Telecom IC Type: LINE EQUALIZER

Line equalizer functionality helps in optimizing signal quality and transmission in telecom applications, ensuring reliable and efficient data transmission.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for finer connections and tighter packing of components on the PCB, enhancing circuit density.

Technical Specifications

Analog Data Transmission Interfaces DS80EP100 attributes and parameters. Explore more Analog Data Transmission Interfaces devices from Texas Instruments

Specs

JESD-30 Code:

R-XDSO-N6

Length:

2.5 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

2.2 mm

Trade Compliance

DS80EP100 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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